• Collaborative agreement expands existing relationship, to deliver requisite cost, scale and capacity to enable mainstream L-PIC deployment for 100G, 400G and beyond
• Multi-source supply chain leveraging GF’s global manufacturing footprint in Singapore and New York
• Production scale of 300mm wafers is expected to enable exponential port growth in cloud Data Centers and 5G networks

Lowell, Massachusetts and Santa Clara, Calif., March 5, 2019 – MACOM Technology Solutions Inc. (“MACOM”), and GLOBALFOUNDRIES (“GF”) today announced a strategic collaboration to ramp MACOM’s innovative Laser Photonic Integrated Circuit (L-PIC™) platform using GF’s current-generation silicon photonics offering, 90WG, to meet Data Center and 5G Telecom industry demands.  The collaboration will leverage GF’s 300mm silicon manufacturing process to deliver requisite cost, scale and capacity that is expected to enable mainstream L-PIC deployment for hyperscale Data Center interconnects and 5G network deployments at 100G, 400G and beyond.

GF’s 90WG, built on the company’s 90nm SOI technology using 300mm wafer processing, enables low-cost integration of optical devices like modulators, multiplexers and detectors into a single silicon substrate. MACOM’s L-PIC technology solves the remaining key challenge of aligning lasers to the silicon PIC. Leveraging MACOM’s patented Etched Facet Technology (EFT) lasers and a patented Self-Alignment EFT (SAEFTTM) process, MACOM’s lasers are aligned and attached directly to the silicon photonics die with high speed and high coupling efficiency, thereby accelerating the adoption of silicon photonics in true industrial-scale applications.   

The industry is entering a long upgrade cycle for high speed optical connectivity within Cloud Data Centers as well as 5G optical buildouts. Industry forecasts project 2019, 2020 and beyond to be strong growth years for Coarse Wavelength Division Multiplexing (CWDM) and PAM-4, with the potential for overall unit demand in 2019, reaching volumes of 10 million units. With a track record of enabling 1.6 million ports in 2016, 4 million ports in 2017, and 6 million ports in 2018, MACOM will work with GF to scale L-PIC production aimed at meeting this exponentially growing market demand.

“With the demand for bandwidth doubling inside Data Centers each year, Cloud Service Providers are supply constrained in moving to 100G and beyond. On top of this, Telecom carriers are now adopting the same CWDM and PAM-4 optical standards for their 5G Network buildouts. The ability to efficiently scale transceiver capacity and manufacturing throughput is critical,” said John Croteau, President and CEO of MACOM.  “By aligning capacity expansion between GF’s silicon photonics technology and MACOM’s EFT Lasers, and moving to 300mm wafers, we believe that this very strategic collaboration will allow us to meet industry demand and position us to service the industry for years to come.”

“We have built an incredible foundation as a leader in providing silicon photonic solutions and advanced packaging capabilities that enable our clients to build a new generation of high-performance optical interconnects,” said Tom Caulfield, CEO at GF. “With our deep manufacturing expertise, combined with MACOM’s strong technology, we can deliver differentiated silicon photonic solutions at scale, accelerate time-to-market, and reduce costs for client applications in Data Center and next-generation 5G optical networks.”

About MACOM:

MACOM enables a better-connected and safer world by delivering breakthrough semiconductor technologies for optical, wireless and satellite networks that satisfy society’s insatiable demand for information.

Today, MACOM powers the infrastructure that millions of lives and livelihoods depend on every minute to communicate, transact business, travel, stay informed and be entertained.  Our technology increases the speed and coverage of the mobile Internet and enables fiber optic networks to carry previously unimaginable volumes of traffic to businesses, homes and Data Centers.

Keeping us all safe, MACOM technology enables next-generation radars for air traffic control and weather forecasting, as well as mission success on the modern networked battlefield.

MACOM is the partner of choice to the world’s leading communications infrastructure, aerospace and defense companies, helping solve their most complex challenges in areas including network capacity, signal coverage, energy efficiency and field reliability, through its best-in-class team and broad portfolio of analog RF, microwave, millimeterwave and photonic semiconductor products.

MACOM is a pillar of the semiconductor industry, thriving for more than 60 years of daring to change the world for the better, through bold technological strokes that deliver true competitive advantage to customers and superior value to investors.

Headquartered in Lowell, Massachusetts, MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard. MACOM has design centers and sales offices throughout North America, Europe, and Asia.

MACOM, M/A-COM, M/A-COM Technology Solutions, M/A-COM Tech, Partners in RF & Microwave, The First Name in Microwave and related logos are trademarks of MACOM. All other trademarks are the property of their respective owners. For more information about MACOM, please visit www.macom.com follow @MACOMtweets on Twitter, join MACOM on LinkedIn and Facebook or visit the MACOM YouTube Channel.

About GF:

GLOBALFOUNDRIES (GF) is a leading full-service foundry delivering truly differentiated semiconductor technologies for a range of high-growth markets. GF provides a unique combination of design, development, and fabrication services, with a range of innovative IP and feature-rich offerings including FinFET, FDX™, RF and analog mixed signal. With a manufacturing footprint spanning three continents, GF has the flexibility and agility to meet the dynamic needs of clients across the globe. GF is owned by Mubadala Investment Company. For more information, visit www.globalfoundries.com.

SPECIAL NOTE REGARDING FORWARD-LOOKING STATEMENTS:

This press release contains forward-looking statements based on MACOM’s beliefs and assumptions and on information currently available to MACOM. These forward-looking statements reflect MACOM’s current views about future events and are subject to risks, uncertainties, assumptions and changes in circumstances that may cause those events or our actual activities or results to differ materially from those expressed in any forward-looking statement. Although MACOM believes that the expectations reflected in the forward-looking statements are reasonable, it cannot and does not guarantee future events, results, actions, levels of activity, performance or achievements. Readers are cautioned not to place undue reliance on these forward-looking statements. A number of important factors could cause actual results to differ materially from those indicated by the forward-looking statements, including, but not limited to, those factors described in “Risk Factors” in MACOM’s Annual Report on Form 10-K, Quarterly Reports on Form 10-Q and other filings with the Securities and Exchange Commission. MACOM undertakes no obligation to publicly update or revise any forward-looking statement, whether as a result of new information, future events or otherwise.

DISCLAIMER FOR NEW PRODUCTS:

Any express or implied statements in MACOM product announcements are not meant as warranties or warrantable specifications of any kind. The only warranty MACOM may offer with respect to any product sale is one contained in a written purchase agreement between MACOM and the purchaser concerning such sale and signed by a duly authorized MACOM employee, or, to the extent MACOM’s purchase order acknowledgment so indicates, the limited warranty contained in MACOM’s standard Terms and Conditions for Quotation or Sale, a copy of which may be found at: https://www.macom.com/purchases

FOR SALES INFORMATION, PLEASE CONTACT:

North Americas — Phone: 800.366.2266
Europe — Phone: +353.21.244.6400
India — Phone: +91.80.43537383
China — Phone: +86.21.2407.1588

MEDIA CONTACTS:

Ozzie Billimoria
MACOM Technology Solutions Inc.
978-656-2896
[email protected]

Colin Boroski
Rainier Communications
508-475-0025 x142
[email protected]

Anja-Maria Hastenrath
embedded PR
+49 (0)89 64913634-11
[email protected]

Erica McGill
GLOBALFOUNDRIES
518-795-5240
[email protected]

Visit reinforces support for GF as the company executes on its new strategy

Singapore, February 28, 2019 – GLOBALFOUNDRIES today hosted an official state visit by His Highness Sheikh Mohammed bin Zayed Al Nahyan, Crown Prince of Abu Dhabi and Deputy Supreme Commander of the United Arab Emirates Armed Forces, and Dr. Maliki Osman, Senior Minister of State, Ministry of Defense & Ministry of Foreign Affairs from Singapore, at the company’s advanced semiconductor manufacturing facility in Singapore. The visit was part of a broader regional tour to strengthen bilateral and economic collaboration between the UAE and a number of Asian countries.

The GLOBALFOUNDRIES facilities in the Woodlands Technology Park comprise Abu Dhabi’s largest investment in Singapore. With more than 5,500 employees and the capacity to manufacture millions of semiconductor wafers per year across a wide range of technologies, the site is leading the way in executing on GLOBALFOUNDRIES’ new strategy of providing differentiated semiconductor solutions tailored to the needs of the world’s most innovative chip designers.

His Highness Sheikh Mohammed bin Zayed Al Nahyan is the Chairman of Mubadala Investment Company, GLOBALFOUNDRIES’ 100% shareholder. Accompanying him on the visit were a number of government and business leaders including HE Khaldoon Khalifa Al Mubarak, Chairman of the Executive Affairs Authority and CEO and Managing Director of Mubadala Investment Company.

“The technologies manufactured here in Singapore are enabling a new era of innovation in a world that now has billions of connected devices,” said Al Mubarak. “With its focused and inspirational leadership and a clear strategy for value creation, GLOBALFOUNDRIES continues to be an integral part of Mubadala’s portfolio.”

The UAE delegation toured GF’s manufacturing facilities, met with company leadership, and received a demonstration of the company’s innovations in Augmented and Virtual Reality as well as Artificial Intelligence and Machine Learning, to support advances in the manufacturing process.

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About GF

GLOBALFOUNDRIES (GF) is a leading full-service foundry delivering truly differentiated semiconductor technologies for a range of high-growth markets. GF provides a unique combination of design, development, and fabrication services, with a range of innovative IP and feature-rich offerings including FinFET, FDX™, RF, and analog mixed signal. With a manufacturing footprint spanning three continents, GF has the flexibility and agility to meet the dynamic needs of clients across the globe. GF is 100% owned by Mubadala Investment Company. For more information, visit globalfoundries.com.

Contact:

Erica McGill
GLOBALFOUNDRIES
(518) 795-5240
[email protected]

Synopsys’ Portfolio of DesignWare Foundation, Analog, and Interface IP Accelerate ISO 26262 Qualification for ADAS, Powertrain, 5G, and Radar Automotive SoCs

MOUNTAIN VIEW, Calif., and SANTA CLARA, Calif., Feb. 21, 2019 –

Highlights

• Synopsys DesignWare IP for automotive Grade 1 and Grade 2 temperature operation on GLOBALFOUNDRIES 22FDX® process includes Logic Libraries, Embedded Memories, Data Converters, LPDDR4, PCI Express 3.1, USB 2.0/3.1, and MIPI D-PHY IP
• Synopsys’ IP solutions implement additional automotive-grade design rules for the 22FDX process to meet reliability and 15-year automotive operation requirements
• Synopsys’ IP that supports AEC-Q100 temperature grades and ISO 26262 ASIL Readiness accelerates SoC reliability and functional safety assessments
• Join Synopsys and GLOBALFOUNDRIES at Mobile World Congress in Barcelona, Spain on Feb. 25 for a panel on “Intelligent Connectivity for a Data-Driven Future”

Synopsys, Inc. (Nasdaq:SNPS) and GLOBALFOUNDRIES (GF) today announced a collaboration to develop a portfolio of automotive Grade 1 temperature (-40C to +150C junction) DesignWare® Foundation, Analog, and Interface IP for the GF 22-nm Fully-Depleted Silicon-On-Insulator (22FDX®) process. By providing IP that is designed for high temperature operation on 22FDX, Synopsys enables designers to reduce their design effort and accelerate AEC-Q100 qualification of system-on-chips (SoCs) for automotive applications such as eMobility, 5G connectivity, advanced driver assistance systems (ADAS), and infotainment. The Synopsys DesignWare IP implements additional automotive design rules for the GF 22FDX process to meet stringent reliability and operation requirements. This latest collaboration complements Synopsys’ broad portfolio of automotive-grade IP that provides ISO 26262 ASIL B Ready or ASIL D Ready certification, AEC-Q100 testing, and quality management.

“Arbe’s ultra-high-resolution radar is leveraging this cutting edge technology that enabled us to create a unique radar solution and provide the missing link for autonomous vehicles and safe driver assistance,” said Avi Bauer, vice president of R&D at Arbe. “We need to work with leading companies who can support our technology innovation. GF’s 22FDX technology, with Synopsys automotive-grade DesignWare IP, will help us meet automotive reliability and operation requirements and is critical to our success.”

“GF’s close, collaborative relationships with leading automotive suppliers and ecosystem partners such as Synopsys have enabled advanced process technology solutions for a broad range of driving system applications,” said Mark Ireland, vice president of ecosystem partnerships at GF. “The combination of our 22FDX process with Synopsys’ DesignWare IP enables our mutual customers to speed the development and certification of their automotive SoCs, while meeting their performance, power, and area targets.”

“Synopsys’ extensive investment in developing automotive-qualified IP for advanced processes, such as GF’s 22FDX, helps designers accelerate their SoC-level qualifications for functional safety, reliability, and automotive quality,” said John Koeter, vice president of marketing for IP at Synopsys. “Our close collaboration with GF mitigates risks for designers integrating DesignWare Foundation, Analog, and Interface IP into low-power, high-performance automotive SoCs on the 22FDX process.”

GLOBALFOUNDRIES & Synopsys at Mobile World Congress 2019

On February 25, 2019, Synopsys will join the GLOBALFOUNDRIES NEXTech Lab Theater Session at MWC19. A panel discussion, with leading industry experts, including Joachim Kunkel, general manager of the Solutions Group at Synopsys, and Mike Cadigan, senior vice president of global sales, business development, customer and design engineering at GF, will offer insights about the importance of intelligent connectivity, the growth, demands, and innovations it is poised to bring, and its impacts across the semiconductor value chain. For more information, visit: https://www.globalfoundries.com/join-gf-mwc19.

Resources

For more information on Synopsys DesignWare IP for automotive Grade 1 temperature operation on GF’s 22FDX process:

• Foundation IP: Logic Libraries, Embedded Memories, One-Time Programmable Non-Volatile Memories (OTP NVM), and Embedded Test and Repair
• Data Converters
• LPDDR4
• PCI Express 3.1
• USB 2.0/3.1
• MIPI

About GLOBALFOUNDRIES

GLOBALFOUNDRIES (GF) is a leading full-service foundry delivering truly differentiated semiconductor technologies for a range of high-growth markets. GF provides a unique combination of design, development, and fabrication services, with a range of innovative IP and feature-rich offerings including FinFET, FDX™, RF and analog/mixed signal. With a manufacturing footprint spanning three continents, GF has the flexibility and agility to meet the dynamic needs of clients across the globe. GF is owned by Mubadala Investment Company. For more information, visit www.globalfoundries.com.

About Synopsys DesignWare IP

Synopsys is a leading provider of high-quality, silicon-proven IP solutions for SoC designs. The broad Synopsys DesignWare IP portfolio includes logic libraries, embedded memories, embedded test, analog IP, wired and wireless interface IP, security IP, embedded processors, and subsystems. To accelerate prototyping, software development and integration of IP into SoCs, Synopsys’ IP Accelerated initiative offers IP prototyping kits, IP software development kits and IP subsystems. Synopsys’ extensive investment in IP quality, comprehensive technical support and robust IP development methodology enables designers to reduce integration risk and accelerate time-to-market. For more information on Synopsys DesignWare IP, visit https://www.synopsys.com/designware

About Synopsys

Synopsys, Inc. (Nasdaq: SNPS) is the Silicon to Software™ partner for innovative companies developing the electronic products and software applications we rely on every day. As the world’s 15th largest software company, Synopsys has a long history of being a global leader in electronic design automation (EDA) and semiconductor IP and is also growing its leadership in software security and quality solutions. Whether you’re a system-on-chip (SoC) designer creating advanced semiconductors, or a software developer writing applications that require the highest security and quality, Synopsys has the solutions needed to deliver innovative, high-quality, secure products. Learn more at www.synopsys.com

Editorial Contacts:

Norma Sengstock
Synopsys, Inc.
650-584-2890
[email protected]

Erica McGill
GLOBALFOUNDRIES
518-795-5240
[email protected]

Mobile market continues to favor RF SOI, with 8SW proving to be the industry’s leading platform for power-optimized chips

Santa Clara, Calif., February 20, 2019 – GLOBALFOUNDRIES today announced that the company’s mobile-optimized 8SW RF SOI technology platform has delivered more than a billion dollars of client design win revenue since its launch in September 2017. With yields and performance exceeding client expectations, 8SW is enabling designers to develop solutions that offer extremely fast downloads, higher quality connections and reliable data connectivity for today’s 4G/LTE Advanced operating frequencies and future sub-6 GHz 5G mobile and wireless communication applications.

As the industry’s first 300 mm RF SOI foundry solution, 8SW delivers significant performance, integration and area advantages, with best-in-class low-noise amplifier (LNA) and switch performance which all together improve integration solutions in the front-end module (FEM). The optimized RF FEM platform is tailored to accommodate aggressive LTE and sub-6 GHz standards for FEM applications, including 5G IoT, mobile device and wireless communications.

“At Qorvo, we continuously expand upon our industry-leading RF portfolio to support all pre-5G and 5G architectures, as such we require the best available technologies to enable us to deliver top-notch solutions with the broadest range of connectivity in sub-6 GHz and mmWave 5G,” said Todd Gillenwater, Qorvo CTO. “GF’s 8SW technology delivers a mix of performance, integration and area advantages in FEM switches and LNAs, giving us a great platform for our world-class products.”

“As new high-speed standards, including 4G LTE and 5G, continue to grow in complexity, innovation in RF Front End radio design must continue to deliver performance commensurate with growing network, data and application demands,” said Bami Bastani, senior vice president of business units at GF. “GF continuously builds on our extensive RF SOI capabilities that are providing our clients a competitive market advantage with first time design success, optimal performance, and the shortest time to market.”

According to Mobile Experts, the mobile RF front-end market is estimated to reach $22 billion in 2022, with a CAGR of 8.3 percent. With more than 40 billion RF SOI chips shipped thru 2018, GF is uniquely positioned to deliver an expanding RF portfolio for a broad range of high-growth applications such as automotive, 5G connectivity and the Internet of Things (IoT).

“Radio complexity promises to increase for both sub-6 GHz and mmWave, driving tight integration of multiple RF functions,” said Joe Madden, Principal Analyst at Mobile Experts. “The market needs RF solutions with high efficiency and linearity performance, but also using scalable processes on large wafers. GF has established an RF SOI process that will enable longer-term market expansion.”

GF combines legacy RF expertise and the industry’s most differentiated RF technology platform spanning advanced and established technology nodes, to help clients develop 5G connectivity solutions for next-generation products.

GF will present its 5G-ready RF solutions with industry experts at MWC Barcelona on February 25 at the NEXTech Labs Theater, in the Fira Gran Via Convention Center, in Barcelona Spain. For more information, go to globalfoundries.com.

About GLOBALFOUNDRIES

GLOBALFOUNDRIES (GF) is a leading full-service foundry delivering truly differentiated semiconductor technologies for a range of high-growth markets. GF provides a unique combination of design, development, and fabrication services, with a range of innovative IP and feature-rich offerings including FinFET, FDX™, RF, and analog/mixed signal. With a manufacturing footprint spanning three continents, GF has the flexibility and agility to meet the dynamic needs of clients across the globe. GF is owned by Mubadala Investment Company. For more information, visit globalfoundries.com.

Contact:

Erica McGill
GLOBALFOUNDRIES
(518) 795-5240
[email protected]