In collaboration with design ecosystem partners, GLOBALFOUNDRIES provides digital design flows for customers designing on leading-edge technology

Santa Clara, Calif., June 2, 2015 –

• In partnership with leading EDA providers Cadence, Mentor Graphics, and Synopsys, GF develops new digital design flows.
• New digital design starter kit integrates process design kit (PDK) and early access standard cell libraries.
• The new design flows have been optimized to solve challenges associated with the critical design rules of 14nm FinFET technology.

GF, a leading provider of advanced semiconductor manufacturing technology, today announced it has reached a critical milestone in providing a robust design infrastructure for its 14-nanometer (nm) FinFET process technology, supporting customer’s design starts on the foundry’s latest manufacturing technology node.

Together with key ecosystem partners Cadence Design Systems, Mentor Graphics, and Synopsys, GF has developed new digital design flows for register-transfer level (RTL) to graphic design database system (GDS) implementation. Integrated with a technology-proven process design kit (PDK) and early-access standard cell libraries, the flows create a digital design “starter kit” that provides designers with a built-in test case for out-of-the-box physical implementation testing and analysis of performance, power and area.

“GF is committed to providing our customers with advanced technology platforms that include the comprehensive design infrastructure required to optimize design productivity and cycle time,” said Rick Mahoney, senior vice president of design enablement at GF. “To ensure our design ecosystem delivers the highest quality experience with our 14nm FinFET technology, GF has collaborated with our EDA partners to complement our in-house global design capabilities and accelerate time-to-volume of designs on complex technologies like 14nm FinFET.”

GF’s digital design flows have been optimized to solve the challenges associated with the critical design rules of the 14nm technology node and includes newly introduced features such as implant-aware placement and double-patterning aware routing, In-Design DRC™ fixing and yield improvement, local/random variability aware timing, 3D FinFET extraction, and color-aware LVS/DRC sign-off.

The Synopsys-based Design Enablement Starter Kit leverages broad capabilities of its Galaxy™ Design Platform to deliver signed-off GF’s 14LPP FinFET designs with optimized performance, power and area. Synopsys’ Design Compiler® Graphical synthesis, coupled with its Formality® equivalence checking solution, streamlines the flow by providing physical guidance and results that closely correlate with physical implementation. For FinFET implementation, Synopsys’ IC Compiler™, IC Compiler II and IC Validator solutions provide implant- and double-patterning-aware placement and routing with In-Design color-aware physical verification. Synopsys’ StarRC™ extraction provides double-patterning support, with modeling for color-aware and 3-D extraction essential for 14nm designs. In addition, the industry-standard Synopsys PrimeTime® sign-off solution for accurate delay calculation, timing analysis and advanced waveform propagation accurately accounts for FinFET impacts such as ultra-low voltage, increased Miller effect and resistivity, and process variation.

To enable customers to achieve the benefits of GF’s 14LPP node at the design level, GF and Cadence have worked together to create a digital flow for a complete RTL-to-GDSII FinFET solution. The digital flow integrates and optimizes Cadence’s front-end, back-end, physical verification, and DFM solutions for 14LPP technology. For front-end design, Cadence’s RTL Compiler synthesis flow is fine-tuned with the 14LPP library. For physical implementation, both Encounter® Digital Implementation System (EDI) and Innovus™ Implementation System provide color-aware double-patterning technology for correct-by-construction placement and routing, and customized settings for the 14LPP design rules and library to optimize power, performance and area (PPA). In-design PVS DRC fixing and in-design litho hot-spot fixing are both available to designers to reduce design iterations and ease design closure. For signoff, the flow features fully integrated Quantus QRC Parasitic Extraction and Tempus Timing Signoff solutions. Integration within both EDI and Innovus allows Quantus and Tempus to bring advanced process modeling earlier in the P&R flow for better timing convergence and time-to-tapeout. Encounter Conformal® Equivalence Checker is embedded in multiple stages in the implementation flow. Voltus power and EMIR analysis, standalone Physical Verification System physical verification and Litho Physical Analyzer litho hot-spot check are also embedded in the reference flow. The reference flow provides a guided approach to Cadence’s tool suite and the GF 14LPP process to ensure designers hit the maximum PPA envelope with minimum ramp-up time.

As with production tape-outs at prior nodes, the starter kit uses the Mentor Graphics Calibre® tool suite for sign-off. In the case of the 14nm starter kit, the Calibre nmDRC™ and Calibre MultiPatterning products are used for layer decomposition, DRC verification and metal filling, while the Calibre nmLVS™ product is used for logic verification.

GF 14nm FinFET technology is among the most advanced in the industry, offering an ideal solution for the most demanding high-volume, high-performance and power-efficient SoC designs. The 3D FinFET devices offers the perfect answer to growing market needs, with best-in-class intrinsic performance boost over 28nm technology and a superior power footprint compared to any predecessors. These leading edge devices also provide a true cost advantage due to superior power, performance and area scaling.

GF is yielding on its 14nm technology and is on schedule to support multiple product tape-outs and volume ramp in 2015.

Through GF’s design partnership ecosystem, designers have access to a broad spectrum of services such as system design, embedded software design, SoC design and verification, and physical implementation. These include design flows for electronic design automation (EDA); silicon-proven IP building blocks, such as libraries; and simulation and verification design kits, i.e., process design kits (PDK) and technology files.

ABOUT GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com.

Press Contact:

Erica McGill
GF
518-305-9022
[email protected]

Technology is the first in the industry to provide design enablement support optimized to meet low power requirements of RF SoCs

Santa Clara, Calif., May 20, 2015 –

• GLOBALFOUNDRIES is the first pure-play foundry to develop 28nm HKMG technology complete with radio frequency (RF) modelling.
• Full design enablement and optimized RF process design kits (RF PDKs) offer design flexibility in core RF performance and functionality.
• RF technology provides critical functionality for SoC solutions, broadening the horizon for a wide range of wireless applications.

GF, a leading provider of advanced semiconductor manufacturing technology, today announced it is offering a 28nm High-k Metal Gate (HKMG) radio frequency (RF) process technology that will provide power-efficient solutions for highly integrated mobile applications and connected devices. Based on GF’ 28nm Super Low Power (SLP) technology with HKMG, the 28nm-SLP-RF process includes a comprehensive set of design capabilities enabling chip designers to integrate critical RF system-on-chip (SoC) functionality into their products.

“The proliferation of connected devices and IoT consumer applications has created an opportunity and demand for RF-enabled chips,” said Mike Mendicino, senior director of product management at GF. “GF’ RF-enabled 28nm process lowers design barriers and enables a broader range of customers to accelerate time-to-volume of leading-edge RF SoCs.”

The 28nm-SLP-RF process is built on the field-proven, cost-optimized 28nm-SLP HKMG process. Silicon results have demonstrated high-frequency performance (Ft ~ 310GHz) and low flicker/thermal noise providing chip designers flexibility in optimizing core RF performance and functionality in a cost-effective logic platform. The 28nm-SLP-RF process technology is designed for the next generation of connected devices that require low standby power and long battery life integrated with RF/wireless functionality. The technology is enabled with key RF features, including core and I/O (1.5V/1.8V) transistor RF models along with 5V LDMOS devices, which simplifies RF SoC design. For passive RF devices, 28nm-SLP-RF offers alternate polarity metal-oxide-metal (APMOM) capacitors up to 5V, deep n-well devices, diffusion, poly and precision resistors, inductors and an ultra-thick metal (UTM) layer. All RF-enabled devices are scalable, hardware verified across the entire operating range, and have met industry standard reliability qualification requirements. Volume production of the 28nm-SLP platform started in 2012.

GF’ 28nm-SLP-RF technology utilizes the companies’ production-proven, 28nm-SLP silicon-validated design flows, which include a complete set of libraries, compilers, and complex IP. The company has collaborated with leading companies in the EDA/IP ecosystem to deliver an optimized process design kit (PDK) that supports highly accurate RF SPICE models and comprehensive technology files that are integral to RF designs. GF’ enhanced 28nm-SLP-RF PDK and verification method is available now.

GF will be exhibiting at booth #834 and will showcase innovative RF solutions through various presentations at the International Microwave Symposium from May 17-22, in Phoenix, Arizona.

ABOUT GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as one of the largest foundries in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com.

Contacts:

Erica McGill
GF
(518) 305-5978
[email protected]

• SST’s SuperFlash®Technology and GLOBALFOUNDRIES 55nm LPx provides low power and cost, high reliability, superior data retention and high-endurance performance customer solutions
• Optimized and silicon-proven Flash IP blocks available for various applications
• Growing customer traction for Smartcard, NFC, IoT, MCU and Automotive Grade 1 applications

Chandler, Ariz., and Santa Clara, Calif., May 5 2015 — Microchip Technology Inc. [NASDAQ: MCHP], a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, through its Silicon Storage Technology (SST) subsidiary, and GF, a leading provider of advanced semiconductor manufacturing technology, today announced the full qualification and availability of SST’s 55nm embedded SuperFlash® non-volatile memory (NVM) on GF’s 55nm Low Power Extended (LPx)/ RF enabled platform. The qualification of GF’s 55nm, split-gate-cell SuperFlash technology-based process was performed according to JEDEC standards. This process technology also met the requirements of AEC-Q100 Grade 1 qualification with an ambient temperature range of -40°C to 125°C, and demonstrated endurance of 100K program/erase cycles with more than 20 years of data retention at 150°C.

According to global information company IHS, the automotive semiconductor market is forecast to reach $31B in 2015, with a strong 7.5 percent improvement over 2014. Embedded Flash-based semiconductors are a key component of this market segment.

“Embedded SuperFlash memory is a de-facto standard at foundries for microcontrollers, smartcards, and various system-on-chip devices,” said Mark Reiten, vice president of Technology Licensing for SST, a wholly owned subsidiary of Microchip. “GF has been a great partner for building a state-of-the-art 55nm embedded SuperFlash platform, and we are already engaged with several customers in various market segments. We are pleased to partner with GF, to further strengthen our market leadership in embedded Flash-based devices”.

“GF recognizes the need to provide a low-cost embedded Flash platform for secure ID, mixed-signal, NFC/RF and next-generation IoT applications,” said Gregg Bartlett, senior vice president of product management at GF. “Our deep collaboration with SST has resulted in qualified, commercially available 55nm SuperFlash technology on GF’s high-yielding 55nm low-power process platform, which will enable high-performance solutions for customers across key market segments.”

GF’s 55nm LPx/RF platform, complete with eNVM technology, is available to customers now. This platform technology offers a fast path-to-product solution, with a custom library of off-the-shelf eNVM IP blocks that are optimized for specific MCU product applications.

About Silicon Storage Technology

Microchip Technology’s SST subsidiary is a leading provider of embedded Flash technology. SST develops, designs, licenses and markets a diversified range of proprietary and patented SuperFlash memory technology solutions for the consumer, industrial, automotive and Internet of Things (IoT) markets. SST was founded in 1989, went public in 1995 (NASDAQ: SSTI), and was acquired by Microchip in April 2010. SST is now a wholly owned subsidiary of Microchip, and is headquartered in San Jose, Calif. For more information, visit the SST Web site at https://www.sst.com.

About GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com.

About Microchip Technology

Microchip Technology Inc. (NASDAQ: MCHP) is a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, providing low-risk product development, lower total system cost and faster time to market for thousands of diverse customer applications worldwide. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality. For more information, visit the Microchip website at https://www.microchip.com.

Note: The SST name, the SST logo, and SuperFlash are registered trademarks of Microchip Technology Inc. and Silicon Storage Technology, Inc., as applicable, in the USA and other countries. All other trademarks mentioned herein are the property of their respective companies.

Tags / Keywords: SuperFlash, Embedded Flash, 55nm, Non-Volatile Memory, Automotive Flash, Industrial Flash, IoT, Low Power Flash, High Reliability Flash, High Endurance Flash, High Data Retention Flash, Split-Gate Cell

Media Contact:

SST Editorial Contact
Eric Lawson
480-792-7182
[email protected]

GF Editorial Contact
Erica McGill.
518-305-5978
[email protected]

Co-developed technology to leverage GLOBALFOUNDRIES 40nm process technology platform

Singapore and Santa Clara, Calif., March 24, 2015–

• Successful joint development and production-ready technology enables NXP to further proliferate in smart card and near-field communications IC markets.
• GF is the first wafer foundry to develop and qualify 40nm eNVM low-power process technology for production.

GF, a leading provider of advanced semiconductor manufacturing technology, and NXP Semiconductor N.V, a leading semiconductor company for secure connection solutions, today announced that they have jointly developed a next-generation embedded non-volatile memory (eNVM), which has resulted in production of 300mm prototype wafers on GF’s 40-nanometer (nm) process technology platform. GF is the first wafer foundry to develop and qualify 40nm eNVM low-power process technology. Volume production is expected in 2016 at its Singapore facility.

The successful execution of joint development and technology production milestones will enable faster time to market of high density on-chip eNVM for innovative applications in a variety of products including identification, near-field-communication, healthcare, and microcontrollers. NXP will leverage GF’s leading-edge semiconductor manufacturing capability to apply the overall technology to 40nm eNVM that will bring competitive value to end customers.

“We are pleased to see the co-developed 40nm-LP eNVM technology is ready for production in GF facility,” said Dr. Hai Wang, executive vice president of Technology and Operations at NXP Semiconductor. “GF is the first foundry that developed this process technology specifically targeting markets that require embedded non-volatile memory products. The successful release to production will enable NXP to further strengthen our market leadership in offering advanced solutions for secure and near field communication market segments.”

“We have a long-standing and close collaboration with NXP across other technology nodes. The successful joint development of eNVM gives us a boost in our confidence in the marketplace as we advance our 40nm technology leadership,” said KC Ang, SVP and GM for GF Singapore. “We look forward to having additional eNVM technology offerings for future market opportunities.”

GF’s manufacturing site in Singapore is certified by the German Federal Office for Information Security (BSI) for secure IC products manufacturing. In 2012, the foundry received Common Criteria ISO 15408-EAL 6 certification and successfully received renewal in 2014. The company is also a two-time winner of NXP annual supplier award for best foundry services.

ABOUT NXP Semiconductors

NXP Semiconductors N.V. (NASDAQ: NXPI) creates solutions that enable secure connections for a smarter world. Building on its expertise in High Performance Mixed Signal electronics, NXP is driving innovation in the automotive, identification and mobile industries, and in application areas including wireless infrastructure, lighting, healthcare, industrial, consumer tech and computing. NXP has operations in more than 25 countries, and posted revenue of $5.65 billion in 2014. Find out more at www.nxp.com.

ABOUT GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com.

Media Contact:

Gina Wong
GF, Asia Pacific & Japan
+65-6670-1808
[email protected]

Erica McGill
GF, U.S.
+518-305-5978
[email protected]

• To nurture aspiring future leaders and build sustainable talent pipeline to support Singapore’s key strategic growth sector
• To offer career progression opportunities to one of the world’s leading high-tech and innovative companies

Singapore, February 27, 2015 – GLOBALFOUNDRIES in Singapore today announced that it has joined the Singapore-Industry Scholarship (SgIS), a partnership between the Singapore government and private enterprises, to offer Singapore citizens who are pursuing their university education, locally and overseas, the opportunity to have a head start in their career while still pursuing their undergraduate studies.

Under SgIS, successful applicants will be placed under the direct guidance of their respective sponsoring organization. SgIS scholars will receive internship opportunities, field trips, professional training and development program, and many other local and global immersion activities, to prepare themselves for their career with the company.

“We are pleased to participate in the national effort in nurturing talents that is much needed to spur and sustain the key growth sector of Singapore,” said KC Ang, senior vice president and general manager of GF Singapore. “Semiconductor manufacturing is the highest contributor to Singapore’s electronic sector output. As a responsible corporate citizen, we want to encourage and draw talents from the community we operate our business in, and be part of it to promote and groom the necessary talents for our future semiconductor industry.”

“The career opportunity in our industry is abundant. Because of the sophisticated nature of our business and the technology innovations we create, people asset is therefore important to us. Our people are given the opportunity to carve out their niche in technical and non-technical field. As an employer, we are providing an avenue for them to fulfil their dream and become part of the success enabler of our company and industry,” Ang added.

Being committed to providing organizational learning and development for employees, GF Singapore also offers scholarship grants to current employees who are pursuing their Ph.D through Industrial Postgraduate Programme (IPP) Scholarship; and Educational Assistance Program for employees who are keen to pursue their studies on part time basis.

ABOUT GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com.

Media Contact:

Gina Wong
GF, Asia Pacific & Japan
+65-6670-1808
[email protected]

Cooperation will focus on critical R&D for mobile and wireless sensor networks

Santa Clara, Calif., February 17, 2015 –

• Collaboration to address critical challenges in radio architecture design in multiband, multimode mobile radios and ultra-low power (ULP) wireless devices.
• Cooperation on critical digital-intensive RF architectures and analog circuits for mobile communications and IoT sensor nodes.
• Research will leverage GLOBALFOUNDRIES CMOS technology platforms optimized to boost RF performance of IC’s.

GF, a leading provider of advanced semiconductor manufacturing technology, today announced a partnership with imec, a leading nanoelectronics research center, for joint research on future radio architectures and designs for highly integrated mobile devices and IoT applications.

A key challenge for next-generation mobile devices is controlling the cost and footprint of the radio and antenna interface circuitry, which contain all of the components that process a cellular signal across the various supported frequency bands. Today, a typical mobile device must support up to 28 bands for worldwide 2G, 3G, 4G, LTE network connectivity, and more complex carrier aggregation schemes and additional frequency bands are expected for future generations. These challenges are driving the need for an agile radio that integrates many of the separate components into one piece of silicon, including power amplifiers, antenna switches, and tuners and provides a solution which is both flexible and low cost.

GF will closely collaborate with technical experts from imec to investigate low-power and compact high-performance agile radio solutions that will enable a broad range of radio architecture design–targeting improvements in area, performance and power consumption. GF will also partner with imec to develop innovative ultra-low power IC design solutions leveraging GF’s CMOS technology to address the demanding requirements of tomorrow’s IoT devices. Ultimately, the partnership aims to build a technology and design infrastructure that will enable future RF architectures while minimizing critical interface requirements for radio power consumption and performance.

“This collaboration expands our relationship with imec, and we’re eager to leverage their R&D expertise in RF technology to accelerate time-to-volume of designs and deliver leading-edge RF technology to our customers,” said Peter Rabbeni, director RF Segment Marketing at GF. “This relationship further reflects our commitment to find RF design implementations that will efficiently extend the range of wireless communication applications without increasing the form factor or cost.”

“There are advanced chip technology challenges the industry needs to address to enable a higher level of integration and lower power consumption for future wireless communication,” said Harmke de Groot, senior director Perceptive Systems for the Internet of Things. “Imec is pleased to welcome GF as a partner in ultra-low power wireless design. Leveraging imec’s advanced IC technology knowhow and system design experience, and GF’s CMOS technology, we will accelerate the investigation and develop new approaches.”

ABOUT IMEC

Imec performs world-leading research in nanoelectronics and photovoltaics. Imec leverages its scientific knowledge with the innovative power of its global partnerships in ICT, healthcare and energy. Imec delivers industry-relevant technology solutions. In a unique high-tech environment, its international top talent is committed to providing the building blocks for a better life in a sustainable society. Imec is headquartered in Leuven, Belgium, and has offices in the Netherlands, Taiwan, US, China, India and Japan. Its staff of over 2,080 people includes more than 670 industrial residents and guest researchers. In 2013, imec’s revenue (P&L) totaled 332 million euro. Further information on imec can be found at www.imec.be. Stay up to date about what’s happening at imec with the monthly imec magazine, available for tablets and smartphones (as an app for iOS and Android), or via the website www.imec.be/imecmagazine.

Imec is a registered trademark for the activities of IMEC International (a legal entity set up under Belgian law as a “stichting van openbaar nut”), imec Belgium (IMEC vzw supported by the Flemish Government), imec the Netherlands (Stichting IMEC Nederland, part of Holst Centre which is supported by the Dutch Government), imec Taiwan (IMEC Taiwan Co.) and imec China (IMEC Microelectronics (Shanghai) Co. Ltd.) and imec India (Imec India Private Limited).

ABOUT GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com.

Contact:

Erica McGill
GF
518-305-5978
[email protected]

Hanne Degans
Imec
0032 16 281 769
[email protected]

CES 2015, Las Vegas, January 09, 2015 – GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, and Linear Dimensions Semiconductor Inc., a semiconductor company specializing in low power analog and mixed signal integrated circuits, today announced that they are working together to manufacture a 14-channel programmable reference from Linear Dimensions for multiple markets including IoT (Internet of Things) sensor and wearable device applications.

The LND1114 is a 14-channel reference designed to meet the tuning needs of emerging IoT sensors and Wearable applications. The LND1114 is available in QFN-3×2.2mm form factor, and is the worlds smallest programmable multi-channel reference product. With a typical drift of only 13uV after 10 years at 70C, low temperature drift and an initial accuracy of 0.2%, the LND1114 is ideally suited for precision sensor biasing.

“GF’s advanced process and development capabilities have allowed Linear Dimensions to engineer an analog non-volatile tuning solution ideally positioned for emerging wearable and portable IoT sensor applications,” said David Schie, CEO of Linear Dimensions. “Devices such as wearable health and fitness products, cell phones, consumer cameras, media players and headsets are increasingly integrating multiple single and multi-function sensors to offer added functionality. These multiple sensors all require specific biasing and tuning to operate correctly. The LND1114 is a revolutionary new way to bias and tune precision devices because it offers multiple channels with unparalleled accuracy and flexibility, in a smaller footprint just a fraction of the size of existing solutions.”

“As sensor based applications proliferate, and wearables become more popular in the market, technologies that enable such devices become extremely important,” said Gregg Bartlett, senior vice president of product management at GF. “We will continue to provide differentiated technology platforms from 350nm to 28nm that our customers can use for innovative products in the rapidly growing IoT and wearable markets. By partnering with Linear Dimensions we have been able to leverage our world-class analog processing capabilities to offer tuning and biasing performance that has not previously been available in such a small form factor.”

GF has a solid track record of providing semiconductor technologies to a variety of market segments including mobility, industrial, automotive and computing. In mainstream technologies, GF offers modular platforms on technology nodes from 180nm to 40nm on both 200mm and 300mm wafers, with additional process modules such as analog, power management, radio frequency (RF), embedded non-volatile memory (eNVM) and Micro-Electro-Mechanical Systems (MEMS).

Wafer volume production for Linear Dimensions’ 14-channel programmable floating gate reference program is expected to start in Q3 2015 in GF manufacturing facility in Singapore.

ABOUT LINEAR DIMENSIONS

Headquartered in San Jose, California, Linear Dimensions is focused on powering and interfacing sensors and microelectromechanical systems (MEMs) for use in industrial, communications, IoT and wearable device applications. Linear’s innovations include flexible analog front ends (AFEs), mixed-signal integrated circuits including application specific SoCs, communications devices, high performance analog math engines, and extraction & security algorithms and software. Visit Linear at CES booth #73314 @ The Sands to learn more.

ABOUT GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com.

Media Contact:

Jason Gorss
GF, U.S.
+(518) 305-9022
[email protected]

Gina Wong
GF, Asia Pacific
+65-6670-1808
[email protected]

Mike Ward
LINEAR DIMENSIONS SEMICONDUCTOR
+(408) 914-ASIC (2742)
[email protected]

GLOBALFOUNDRIES also tapes out second ARM Cortex-A17 processor using full Cadence digital implementation and signoff flow

SAN JOSE, Calif., December 17, 2014 — Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, and GF, a leading provider of advanced semiconductor manufacturing technology, today announced the delivery of quad-core silicon built around the ARM® Cortex®-A17 processor implemented using GF’s 28nm Super Low Power (28nm-SLP) process with High-k Metal Gate (HKMG) technology. GF utilized Cadence® tools exclusively to achieve 2.0GHz processor performance at typical operating conditions, which matched pre-silicon design performance predicted by Cadence Tempus™ Timing Signoff Solution analysis.

The Cadence tools used in this successful design include Encounter® Digital Implementation System, Encounter RTL Compiler, Quantus™ QRC Extraction Solution, Tempus Timing Signoff Solution, Encounter Conformal® Equivalence Checker, Physical Verification System and Litho Physical Analyzer. The flow incorporated physical IP technology from the ARM POP™ IP suite to leverage the full performance range of the 28nm-SLP process.

Based on the success of this design, Cadence and GF have also completed the tapeout of a second chip using the latest ARM Cortex-A17 processor RTL, achieving a 23 percent single-core area reduction versus the previous tapeout, while meeting the 2.0GHz maximum frequency signoff target. The second tapeout included the full suite of ARM POP IP, including the optimized memory instances for Cortex-A17. In addition, the Cadence Voltus™ IC Power Integrity solution was used throughout the design of the next-generation quad-core tapeout to guide and validate the power grid and enable the implementation of advanced power shutoff technologies. Encounter Conformal Low Power was used to verify the power-intent specification for the design.

“Silicon to simulation correlation at 2.0GHz performance further validates the maturity of our 28nm-SLP process, which continues to deliver silicon-proven performance and power targets our high-volume mid-range mobile customers demand,” said Gregg Bartlett, senior vice president, Product Management Group at GF. “We collaborated closely with Cadence and ARM to deliver these designs using our 28nm-SLP process, and our customers can reap the benefits when using the ARM Cortex-A17 processor and the Cadence design flow.”

“SoCs based on the ARM Cortex-A17 processor deliver premium cost-optimized performance for multiple devices including mainstream mobile and other consumer products that take advantage of the millions of software applications designed for 32-bit ARM-based cores,” said Dipesh Patel, executive vice president and general manager, physical design group, ARM. “The Cortex-A17 core is purpose-built for high performance within thermally restricted devices, and the partnership between ARM, Cadence and GF enables designers to use it to meet an array of complex requirements. We also expect it to drive innovation in new applications such as high-end wearables.”

“The full Cadence suite with integrated signoff enabled GF to deliver working silicon with high accuracy,” said Anirudh Devgan, senior vice president, Digital and Signoff Group, Cadence. “GF can now offer an efficient process with an integrated Cadence flow that can allow designers to bring low-power, high-performance designs to the market within tight windows.”

GF’s 28nm-SLP technology is ideally suited for the next generation of mobile devices and low power Internet of Things (IoT) solutions, enabling designs with faster processing speeds, smaller feature sizes, lower standby power and longer battery life. The technology is based on GF’s “Gate First” approach to HKMG, which has been in volume production for nearly four years. The technology offers a combination of performance, power efficiency and cost that is ideally suited for the mobile and IoT market.

About Cadence

Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.

About GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com.

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©2014 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo, Conformal, and Encounter are registered trademarks and Quantus, Tempus, and Voltus are trademarks of Cadence Design Systems, Inc. in the United States and other countries. ARM and Cortex are registered trademarks of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. POP is a trademark of ARM Limited (or its subsidiaries) in the EU and/or elsewhere. All rights reserved. All other trademarks are the property of their respective owners.

Foundation presents $172,915 in new funding to 43 local organizations supporting a wide variety of community programs

Malta, NY – December 16, 2014 – The GLOBALFOUNDRIES-Town of Malta Foundation today presented its 2014 slate of grants totaling $172,915 benefiting 43 local organizations and community projects. The 2014 grant awards were presented today at a reception hosted at the David R. Meager Community Center in Malta. Organizations were on hand to receive checks funding the following programs:

• Ballston Spa CSD Partnership for Innovation in Education Fund: $4,000 to support the FIRST robotics team
• NY Tech Valley Robotics: $6,000 to support the Annual Robot Rumble Robotics Competition event in Malta
• Ballston Spa High School PTA: $2,000 to support the “After Prom” event promoting a safe, drug and alcohol free environment for high school students
• Ballston Spa Junior Baseball League: $4,000 for improvements to the youth sports field
• Best Buddies New York: $1,000 to support three Best Buddies chapters
• CAPTAIN Youth and Family Services: $2,000 to support the Runaway and Homeless Emergency Youth Shelter
• Chango Elementary School Literacy Team: $4,000 to support materials and technology to support literacy programs
• Dunning Street Rural Cemetery Association: $3,000 to help fund necessary improvements of historical features
• Eastline Romp and Play Dog Park: $2,500for equipment and improvements to public park
• Fire Companies of Malta: $3,000 for equipment to improve the new fire station
• Gordon Creek Elementary PTA: $2,600 to support a school wide music and cultural arts in education initiative
• Junior Achievement of Northeastern NY: $4,500 to fund 45 Junior Achievement classes reaching 900 students in the Ballston Spa school system
• Malta-Stillwater EMS: $20,000 to purchase a mechanical CPR device
• The Malta Athletic Association: $4,000 for equipment and field maintenance supporting public athletic fields
• Malta Avenue Elementary Parent Teacher Association: $3,000 to support education and recreation events at Malta Avenue Elementary
• Malta League of Arts: $2,500 to fund the annual Arts Attitudes with a Visual Experience
• Malta Ridge Cemetery Association: $3,000 to help repair and restore historic stones and monuments
• Malta Ridge Volunteer Fire Company: $5,000 to purchase equipment supporting local emergency response
• Malta Seniors: $2,800 to support programs for seniors
• Miss Scottie’s Softball Association: $4,000 to help fund equipment for local youth athletic programs
• Rebuilding Together Saratoga County: $10,000 to purchase building materials needed for home repairs supporting local families in need
• Village of Round Lake Auditorium: $1,683 to repair and replace fixtures and equipment in the historic Auditorium building
• Round Lake Hose Company: $5,000 to purchase a Bullex Digital Fire Training System to support local fire fighting and emergency response
• Round Lake/Malta Youth Baseball League: $4,000 to support improvements for the local youth athletic fields
• Rug Runners Robotics: $10,000 to purchase materials in support of the FIRST Robotics team
• Saratoga Bridges: $8,182 to purchase therapeutic and wellness equipment for three sites in Malta
• Saratoga Springs Blue Streak Robotics: $250 to support the Saratoga Vex Robotic Competition
• Saratoga Rowing Association: $2,500 to help fund equipment for Ballston Spa rowing team activities
• St. Mary’s School Lego Enrichment Club: $2,400 to purchase equipment supporting Lego teams competing in First Lego League Tournament
• St. Peter Lutheran Church: $5,000 to purchase food for the Malta Community Center food pantry supporting local families in need
• The Children’s Museum at Saratoga: $2,000 to help fund a new science exhibit
• Malta Youth Commission: $4,000 to fund four programs throughout the year supporting families in Malta
• Town of Malta Department of Parks & Recreation: $4,500 to support the 2015 Summer Concert Series
• Collamer Park: $4,000 to support revitalization efforts at local park
• Round Lake Library: $1,000 to build the Eco Explorers Discovery Pack Loaner program
• Spotlighters’ Theatre Troupe: $5,000 for equipment and installation of equipment supporting community theater at the Malta Community Center
• Town of Malta Veterans Committee: $10,000 to help support the Honor Flight program for Malta veterans and their guardians

In addition to these 2014 grant awards, this year the GF-Town of Malta Foundation has identified $10,500 in additional grant funding that can be accessed by five qualifying organizations on an as-needed basis through 2015. These five organizations – the Angel Names Association, Camp Abilities Saratoga, Jake’s Help From Heaven, Taylor’s Heroes, and the Tears Foundation – each support specific programs designed to assist local families in the event of crisis situation. These five organizations have qualified to receive grant funding if situations occur that meet the Foundation’s grant guidelines through the next year.

The GF-Town of Malta Foundation provides thousands of dollars of grant funding every year local to organizations, programs and projects that provide tangible benefits of a public nature to diverse groups serving the citizens of the Town of Malta including, not-for-profit corporations, charitable organizations, community arts and theater groups, community historical sites, special events, education programs, and sports and recreation activities.

Each year, the GF-Town of Malta Foundation looks for projects that are creative, innovative, and inclusive in their scope and opportunities that will provide the maximum amount of benefit to the local Malta community. The Foundation’s history of giving includes:

• 2011: $37,500 to 13 local organizations
• 2012: $60,000 to 23 local organizations
• 2013: $164,000 to 38 local organizations
• 2014: $172,915 to 43 local organizations

Information on 2015 grant application process will be available on the GF-Town of Malta Foundation Web page soon. Please continue to check the Web page for more information.

ABOUT THE GF-TOWN OF MALTA FOUNDATION

As part of the development of the Fab 8 project, GF has invested $5 million to fund two charitable foundations – the GF-Town of Malta Foundation and the GF-Town of Stillwater Foundation. Both foundations are using the initial $5 million corporate contribution and annual income earned from investments to fund a wide variety of local community programs.

The GF-Malta Foundation was developed to fund organizations, programs and projects that provide tangible benefits of a public nature to diverse groups serving the citizens of the Town of Malta including, not-for-profit corporations, charitable organizations, community arts and theater groups, community historical sites, special events, education programs, and sports and recreation activities.

Each year, the GF-Town of Malta Foundation looks for projects that are creative, innovative, and inclusive in their scope and opportunities that will provide the maximum amount of benefit to the local Malta community. For more information, visit the Foundation’s Web site (URL: https://sites.google.com/site/gfmaltafoundationorg/home ).

ABOUT GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 150 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com.

Media Contact:

Travis Bullard
GF
(518) 305-9025
[email protected]