INVECAS Inc. will provide design services to GLOBALFOUNDRIES customers designing on leading-edge processes

Santa Clara, Calif., November 6, 2014 – GF, a leading provider of advanced semiconductor manufacturing, design and technology solutions, today announced a partnership with INVECAS Inc., a newly formed design services provider focused on accelerating customer introduction of new products on leading-edge semiconductor process technologies. INVECAS will operate multiple system-on-chip (SoC) design service centers in both the United States and India to provide exclusive support for GF customers.

This new partnership is intended to serve a variety of customers across multiple market segments, from small fabless companies with limited internal resources to large systems companies seeking to differentiate their products through customized silicon. INVECAS will focus on offering design services for GF’s leading-edge processes including 14nm FinFET, addressing multiple market segments including high-performance computing, consumer electronics, and mobile communications.

INVECAS will operate design service centers in Santa Clara, Calif., Burlington, Vt., Bangalore, India and Hyderabad, India. INVECAS design centers will be staffed by more than 600 engineers and will provide customers with GF-focused design services.

“These newly launched centers will provide a significant complement to our in-house global design solutions capabilities while enhancing our existing ecosystem of design and IP partners,” said Gregg Bartlett, senior vice president of product management at GF. “The INVECAS team has a strong track record of providing spec-to-silicon solutions for complex SoC designs in multiple high-volume market segments. They will be an excellent partner to help us expand the services available to customers designing products on the leading edge of technology.”

“By combining our proven system-level expertise with a laser-like focus on GF’s advanced processes, INVECAS brings unrivaled expertise to some of the most difficult issues facing designers today,” said Dasaradha Gude, chairman of INVECAS Inc. “This will enable a broader range of customers to accelerate time-to-volume of designs on complex technologies like 14nm FinFETs.”

Through INVECAS, customers will have access to a broad spectrum of services such as system design, embedded software design, SoC design and verification, and physical implementation.

In additional to traditional design services, INVECAS will offer customers a wide selection of design IP across various GF process nodes. The IP offerings include standard cells, IOs, memories, analog, and complex interface IP solutions. The center will expand the availability and affordability of qualified IP solutions for GF’s leading-edge process technologies.

The new design centers complement GF’s broad ecosystem of partners enabling customers to achieve the fastest time-to-volume. Called GLOBALSOLUTIONS^SM, the ecosystem includes partners in all aspects of design enablement and turnkey services, OPC and mask operations, and advanced capabilities in assembly solutions.

ABOUT INVECAS

INVECAS offers semiconductor IPs, design realization and Silicon realization services exclusively for GF customers. INVECAS will be staffed by more than 600 engineers with development centers in US and India. The team has strong track record in delivering world class high speed interface and memory IPs. INVECAS’s design realization team has achieved first time silicon success on multiple designs on leading edge processes. For more information, visit https://www.INVECAS.com.

ABOUT GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com.

Contacts:

Jason Gorss
GF
(518) 305-9022
[email protected]

Partnership with leading foundry will support Everspin’s ST-MRAM market growth starting with 40nm and 28nm technology

Chandler, AZ, Oct 27, 2014 — Everspin Technologies, Inc., the world’s leading developer and manufacturer of discrete and embedded MRAM, today announced that the company has partnered with GLOBALFOUNDRIES to build fully processed 300mm wafers with Everspin’s magnetic tunnel junction (MTJ) Spin-Torque Magnetoresistive Random-Access Memory (ST-MRAM) technology, starting with GF 40 nanometer and 28 nanometer Low Power CMOS platforms. This relationship forms the core of Everspin’s long-term strategy to proliferate ST-MRAM into the marketplace by offering designers of high performance storage systems a fast, non-volatile memory solution featuring low latency and increased reliability.

GF has invested in advanced ST-MRAM CMOS processing equipment to deliver the fully processed CMOS and MRAM wafers beginning with GF’s 40 nanometer technology node. GF has also invested an undisclosed amount in Everspin.

“Everspin’s experience in shipping over 40 million MRAM products to the market, as well as designing and launching the first commercially-available ST-MRAM, together with our manufacturing capability will establish the industry’s first 300mm ST-MRAM technology” said Gregg Bartlett, senior vice president of product management at GF. “Our partnership with Everspin will help drive ST-MRAM adoption and feed the rapidly growing MRAM market.”

“GF is a pioneer in delivering value-added and fully-integrated memory solutions to a multitude of markets and applications,” said Phill LoPresti, President and CEO at Everspin. “Our partnership with a world-class foundry is a fundamental piece of our long-term strategy to deliver ST-MRAM on 300mm, accelerate availability of our perpendicular MTJ ST-MRAM bit cell, fast-track ST-MRAM production in advanced CMOS technology nodes, secure high volume capacity for our customers, and scale ST-MRAM towards Gigabit densities to further expand the market and application uses of Everspin ST-MRAM products.”

About Everspin Technologies

Everspin Technologies is the worldwide leader in designing, manufacturing, and commercially shipping discrete and embedded Magnetoresistive RAM (MRAM) and Spin-Torque MRAM (ST-MRAM) into markets and applications where data persistence and integrity, low latency, and security are paramount. With over 40 Million MRAM and ST-MRAM products deployed in data center, cloud storage, energy, industrial, automotive, and transportation markets, Everspin has built the strongest and fastest growing foundation of MRAM users in the world. With an intellectual property portfolio of more than 500 active patents and applications, Everspin leads the market in development of both in-plane and perpendicular magnetic tunnel junction (MTJ) ST-MRAM bit cells. Everspin has established high-quality manufacturing worldwide, along with enabling a full turn-key 300mm high-volume foundry partner for advanced technology nodes including 40nm, 28nm and beyond. In addition to launching discrete memory solutions with new densities and advanced interfaces, including the world’s first commercialization and volume shipments of ST-MRAM, Everspin is delivering on the company’s strategy to proliferate MRAM and ST-MRAM as mainstream embedded memories for use in MCUs, GPUs, DSPs, Application Processors, and ASICs, earning Everspin its description as “The MRAM Company”. www.everspin.com

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Everspin Contact:

Michael Schoolnik
Story Public Relations
415-674-3816
[email protected]

Acquisition Enables GLOBALFOUNDRIES to Become a World Leader in Semiconductor Foundry Technology;

IBM to Focus on Fundamental Semiconductor Research and Systems Innovation

ARMONK, N.Y., and SANTA CLARA, Calif., October 20, 2014: IBM (NYSE: IBM) and GF today announced that they have signed a Definitive Agreement under which GF plans to acquire IBM’s global commercial semiconductor technology business, including intellectual property, world-class technologists and technologies related to IBM Microelectronics, subject to completion of applicable regulatory reviews. GF will also become IBM’s exclusive server processor semiconductor technology provider for 22 nanometer (nm), 14nm and 10nm semiconductors for the next 10 years.

The Agreement, once closed, enables IBM to further focus on fundamental semiconductor research and the development of future cloud, mobile, big data analytics, and secure transaction-optimized systems. IBM continues its previously announced $3 billion investment over five years for semiconductor technology research to lead in the next generation of computing. GF will have primary access to the research that results from this investment through joint collaboration at the Colleges of Nanoscale Science and Engineering (CNSE), SUNY Polytechnic Institute, in Albany, N.Y.

As part of this Agreement, GF will gain substantial intellectual property including thousands of patents, making GF the holder of one of the largest semiconductor patent portfolios in the world. GF also will benefit from an influx of one of the best technical teams in the semiconductor industry, which will solidify its path to advanced process geometries at 10nm and below. Additionally, the acquisition opens up business opportunities in industry-leading radio frequency (RF) and specialty technologies and ASIC design capabilities.

“This acquisition solidifies GF’ leadership position in semiconductor technology development and manufacturing,” said Dr. Sanjay Jha, CEO, GF. “We can now offer our customers a broader range of differentiated leading-edge 3D transistor and RF technologies, and we will also improve our design ecosystem to accelerate time-to-revenue for our customers. This acquisition further strengthens advanced manufacturing in the United States, and builds on established relationships in New York and Vermont.”

“The Agreement expands our longstanding collaboration, which began when GF was created in 2009, and reflects our confidence in GF’ capability,” said IBM Senior Vice President & Director of Research Dr. John E. Kelly III. “This acquisition enables IBM to focus on fundamental semiconductor and material science research, development capabilities and expertise in high-value systems, with GF’ leadership in advanced technology manufacturing at scale and commitment to delivering future semiconductor technologies. We are grateful for the leadership and investments by the states of New York and Vermont in supporting the semiconductor industry.”

This acquisition bolsters semiconductor manufacturing and technology development in the United States. GF has robust capital expenditure plans of approximately $10 billion in 2014-2015, with the majority being invested in New York. GF has created nearly 3,000 direct jobs in New York and thousands more indirect jobs in the United States since 2009.

GF will acquire and operate existing IBM semiconductor manufacturing operations and facilities in East Fishkill, New York and Essex Junction, Vermont, adding capacity to serve its customers and thousands of jobs to GF’ workforce. GF plans to provide employment opportunities for substantially all IBM employees at the two facilities who are part of the transferred businesses, except for a team of semiconductor server group employees who will remain with IBM. After the close of this transaction, GF will be the largest semiconductor technology manufacturing employer in the Northeast.

GF will also acquire IBM’s commercial microelectronics business, which includes ASIC and specialty foundry, manufacturing and related operations and sales. GF plans to invest to grow these businesses.

IBM will reflect a pre-tax charge of $4.7 billion in its financial results for the third quarter of 2014, which includes an asset impairment, estimated costs to sell the IBM microelectronics business, and cash consideration to GF. Cash consideration of $1.5 billion is expected to be paid to GF by IBM over the next three years. The cash consideration will be adjusted by the amount of working capital which is estimated to be $200 million.

The transaction is subject to the satisfaction of regulatory requirements and customary closing conditions.

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About GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by the Mubadala Development Company. For more information, visit https://www.globalfoundries.com.

About IBM

For more information on IBM, visit https://www.ibm.com

Editors’ Note: Photos are available via the Associated Press Photo Network and on the Internet at Feature Photo Service’s link through https://www.newscom.com

IBM press contacts:

Jeff Cross
+1 (914) 766-4166
415-674-3816
[email protected]

Chris Andrews
+1 (914) 499-4045
[email protected]

GF press contacts:

Jason Gorss
+1 (518) 698-7765
[email protected]

Travis Bullard
+1 (518) 491-7658
[email protected]

Santa Clara, Calif., October 1, 2014 – GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, today announced that it has received the 2014 award for Excellence in Silicon Ecosystems from Cisco.

This prestigious award recognizes GF for performing beyond expectations by partnering with Cisco as a critical sub-tier supply chain partner on developing advanced technologies in the areas of silicon wafer manufacturing, IC packaging, assembly and test. The distinction was awarded during Cisco’s 23rd Annual Supplier Appreciation Event, held September 18 at the Santa Clara Convention Center.

“Our Supplier Appreciation Awards give us an opportunity to highlight exceptional performances by the very best of our extended supply chain,” said Gary Cooper, vice president, Global Supplier Management, Cisco. “These partners have demonstrated outstanding achievement in their core operations, and consistently exceeded expectations in supporting the success of Cisco and our customers.”

Cisco presented awards to suppliers in recognition of their contributions to Cisco’s success in fiscal year 2014. At the event, Cisco recognized the hard work and dedication of its strategic suppliers and manufacturing partners—underscoring the company’s commitment to close collaboration with its supply network to drive customer satisfaction, innovation, and operational efficiency.

About GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com.

CONTACTS:

Jason Gorss
GF
518-305-9022
[email protected]

New Scholarship Recognizes Rising Semiconductor Industry Talent

Santa Clara, California, September 9, 2014 – GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, today announced the “GF Undergraduate Research Scholarship,” a new scholarship recognizing and rewarding aspiring, leadership-oriented engineering students interested in careers in the semiconductor industry. The GF Undergraduate Research Scholarship will fund undergraduate research opportunities (URO) and intern scholars through the Semiconductor Research Corporation’s (SRC) Education Alliance.

Presented at SRC’s annual TECHCON conference in Austin, Texas, the scholarship was created by GF in partnership with SRC to recognize and reward science, technology and engineering students who demonstrate promise in their academic and professional efforts. The selected recipients of this scholarship will have the opportunity to interact with GF researchers and access the professional resources of SRC and the SRC Education Alliance.

“Building a pipeline of highly skilled talent is essential to our business and to the competitiveness of the entire semiconductor industry,” said Suresh Venkatesan, senior vice president of technology development, GF. “SRC connects companies with the top universities, which results in exciting research and educational opportunities for the best and the brightest students. The GF Undergraduate Research Scholarship gives us the opportunity to support science, technology, engineering and mathematics education and help develop the technical leaders who will continue to drive innovation in the semiconductor industry in the future.”

Until recently, SRC focused exclusively on students seeking advanced degrees, providing fellowships for them to do university research that had practical applications for corporate members of its unique consortium. The URO is SRC’s innovative program providing undergraduates with valuable research experience and mentoring. The goal of the URO is to empower bright, well-educated, and experienced scientists and engineers for which U.S. high-tech companies are seeking.

“Recognizing the critical importance of a strong pipeline of new talent for the semiconductor industry, the SRC Education Alliance through the URO Program provides financial assistance to undergraduates, allowing students and universities to recognize the connections between the materials they are learning in the classroom and the technological innovations that transform the world,” said SRC President Larry Sumney. “We are thrilled to collaborate with GF as we continue to develop our URO program.”

Rising sophomores, juniors and seniors in an accredited undergraduate program majoring in the field of engineering are encouraged to apply. Additional information about the scholarship can be obtained by visiting: www.src.org/program/srcea/uro/globalfoundries.

Every year TECHCON brings together the brightest minds in microelectronics research to exchange news about the progress of new materials and processes created by SRC’s network of more than 100 of the top engineering universities. Students and industry leaders discuss basic research that is intended to accelerate advancements for both private and public entities.

ABOUT GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com.

Contact:

Travis Bullard
GF
(518) 305-9025
[email protected]

ArcticLink® 3 S2 silicon platform to use 65nm process technologies

Sunnyvale and Santa Clara, Calif., September 8, 2014 – QuickLogic Corporation (NASDAQ: QUIK), the innovator of ultra-low power programmable Customer Specific Standard Products (CSSPs), and GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, today announced that QuickLogic’s next-generation ArcticLink 3 S2 Ultra-low Power Sensor Hub is sampling on GF’s low-power 65 nanometer (nm) process technology.

The ArcticLink 3 S2 Sensor Hub is an ultra-low power, context-aware sensor hub optimized for smartphone and wearable devices. Building on QuickLogic’s ArcticLink 3 S1, the S2 offers OEMs four times the computational capability, four times the sensor algorithm memory, and eight times the sensor data memory in a pin-identical footprint.

The ArcticLink® 3 S2 leverages GF’s 65nm LPe (low-power enhanced) technology, which uses innovative leakage reduction techniques to significantly improve power utilization and extend battery life, making it especially well-suited for battery-operated and cost-sensitive mobile applications. The S2 Sensor Hub is expected to be production-certified in Q4 2014.

“The fast-growing market for sensor hubs in smartphones and wearables presents a wide array of new applications that match perfectly with our ArcticLink 3 S2 sensor hub solution,” said Brian Faith, VP of worldwide sales and marketing at QuickLogic. “This new collaboration with GF as the manufacturer for the S2 platform will help us meet our demanding time-to-market requirements with a technology that delivers the right balance of performance, power consumption, and cost.”

“As the industry continues its seismic shift from PC to mobility, a whole new set of applications and devices are driving the need for differentiated silicon solutions,” said Gregg Bartlett, senior vice president of product management at GF. “Innovative designers like QuickLogic need a collaborative foundry to help them bring their creative ideas to market, and we are pleased to partner with them to deliver their next-generation sensor hub on our 65nm technology.”

About QuickLogic

QuickLogic Corporation is the inventor and pioneer of innovative, customizable semiconductor solutions for mobile and portable electronics OEMs and ODMs. These silicon platforms plus software solutions are called Customer Specific Standard Products (CSSPs). CSSPs enable our customers to bring their products to market more quickly and remain in the market longer, with the low power, cost and size demanded by the mobile and portable electronics market. For more information about QuickLogic and CSSPs, visit www.quicklogic.com

About GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com.

Contacts:

Jason Gorss
GLOBALFOUNDRIES
(518) 305-9022
[email protected]

Andrea Vedanayagam
Veda Communications
(408) 656-4494
[email protected]

Santa Clara, Calif., September 4, 2014 – GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, announced today that Louis “Lou” Lupin has joined the company as senior vice president and chief legal officer. In this role, Lupin is responsible for the company’s global legal affairs including litigation, intellectual property and corporate matters and will oversee all compliance programs. Lupin has also assumed the role as secretary to the GF board of directors.

Lupin succeeds Alexie Lee, who had served as GF’s general counsel since the inception of the company and who has recently taken on the role of chief of staff to the CEO.

“Lou is an accomplished and respected corporate general counsel with nearly 30 years of experience in litigation, intellectual property licensing, strategic relationships and portfolio management,” said Sanjay Jha, CEO, GF. “Moreover, he has a keen understanding of technology, which is critical to our success. We are excited to have Lou join the GF leadership team.”

Before joining GF, Lupin was a legal consultant to Qualcomm Incorporated since 2008. Prior to that, he served as Qualcomm’s executive vice president, general counsel, and assistant secretary to the board, and as a member of the executive committee. He also sits on the advisory boards of a number of public and private companies.

Previous to Qualcomm, Lupin was a partner with Cooley, Godward, Castro, Huddleson and Tatum (now Cooley LLP) where he focused on intellectual property litigation in the telecommunications, software and biotechnology industries. He also served as a special agent for the U.S. Department of Justice, Drug Enforcement Administration and a border patrol agent for the U.S. Department of Justice, Immigration and Naturalization Service.

Lupin holds a bachelor’s degree from Swarthmore College and a J.D. from Stanford Law School.

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About GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com.

Media Contacts:

Travis Bullard
GF
(518) 305-9025
[email protected]

CEO Sanjay Jha expands executive team to help lead next phase of growth

Santa Clara, Calif., August 4, 2014 – GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, announced today the addition of William “Bill” Davidson, Jr. as senior vice president and chief administrative officer (CAO), strengthening the company’s leadership team. As the company’s first CAO, Davidson takes over global leadership of critical corporate functions supporting the company’s worldwide operations including Human Resources, IT, Corporate Marketing and Communications, Government Relations, and Risk Management, Sustainability and Real Estate.

“Bill is an accomplished industry executive who brings to GF a strong track record of managerial success,” said Sanjay Jha, CEO, GF. “His ability to develop and lead global teams across complex organizations will help drive our next phase of growth.”

Davidson joins GF with more than 25 years of experience in leading technical sales, marketing and general management roles in the telecommunications and semiconductor industries. He most recently served in a dual role as senior vice president, strategy and operations and senior vice president, investor relations at Qualcomm Inc. In these roles, Davidson oversaw reporting and operations, executed on strategic global business initiatives, and served as the primary liaison with the investment community and Qualcomm shareholders. During his time at Qualcomm, Davidson also led global marketing and communications for more than six years.

Davidson also spent 13 years at Bell Atlantic where he gained substantial experience in the wireline business at New Jersey Bell, as well as serving as vice president of wireless data sales and marketing for Bell Atlantic Mobile. Davidson’s background also includes serving as vice president of commercial sales operations for GE Capital’s telecommunications financial services division.

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About GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com.

Media Contacts:

Travis Bullard
GF
(518) 305-9025
[email protected]

JSR Corporation, Lam Research, Tokyo Electron Ltd. and SUMCO Corporation honored for outstanding collaboration, service and cost leadership

Santa Clara, Calif., June 19, 2014 – GLOBALFOUNDRIES today recognized the winners of its first-ever global Supplier Awards at the company’s 2014 Supplier Day event in Malta, NY. Recipients were recognized for their exceptional collaboration and support, as well as a demonstrated ability to perform at the highest level based on the specific needs of GF.

JSR Corporation was named the recipient of the Excellence Award for Collaboration and Sustained Support. JSR Corporation, headquartered in Tokyo, provides advanced materials for the semiconductor, flat panel display, and optical materials fields. JSR Corporation demonstrated superior collaboration with GF on programs that drive defectivity improvement cost-effectively. JSR Corporation is the first supplier to meet GF’s formal award criteria.

Additionally, Spotlight Awards for suppliers that exhibited superior performance and collaboration were presented to Lam Research, Tokyo Electron Ltd. and SUMCO Corporation.

“The goal of the Supplier Day event and Awards is to strengthen relationships with key suppliers who are committed to collaborating with GF to deliver maximum value to our customers,” said Magnus Matthiasson, GF chief procurement officer. “We are pleased to recognize suppliers that support GF’s commitment to manufacturing excellence, and we thank them for their dedication and support.”

The Supplier Day event provides a collaborative forum to foster strong supplier relationships and continually improve GF’s supply chain capabilities. This year’s event, themed ‘Collaborative Growth,’ drew top executives from over 30 of GF key suppliers.

This is GF’s first annual Supplier Awards, a program that is being launched to recognize supplier excellence. The program identifies the highest performing suppliers by assessing their execution to GF’s goals for technology, quality, cost and operational indicators.

ABOUT GF

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com.

Contact:

Jessica Kerley
GF
(518) 305-9469
[email protected]

Sophia Antipolis – France, Santa Clara – Calif, June 4, 2014: Scaleo chip today announced that they are the first fabless company to introduce an automotive microcontroller manufactured with the new GLOBALFOUNDRIES 55nm automotive-specific advanced semiconductor manufacturing platform.

Scaleo chip, the leading fabless semiconductor company in automotive electronics for powertrain, body control and driver-information, has used the GF 55nm eFlash NVM Platform to develop a new family of microcontrollers embedding unique technologies related to real-time process and control of highly electrified internal combustion engines and electric motors based on programmable logic (AMEC®), as well as a set of ISO 26262 compliant functional safety features which improve powertrain system safety integrity and accuracy (SILant®).

GF, a leading provider of advanced semiconductor manufacturing technology and a member of the Automotive Electronics Council (AEC), developed the optimized semiconductor manufacturing platform to specifically meet the stringent and evolving needs of the automotive industry. Built on the company’s 55nm Low Power process and AEC-Q100 Group D qualified, the platform supports the implementation of non-volatile memory (NVM) in MCUs and SoC designs, as well as best-in-class, automotive grade SST-based embedded flash technology.

With a projected revenue growth of about 11% over the 2013-2016 period, automotive semiconductors are one of the fastest growing segments, with about twice the growth rate of the mobile device segment. The growing need for fuel-efficient, eco-friendly, safer and more connected cars is sustaining an increase of electronics content in vehicles. Powertrain applications are one of the fastest growing sub-segments and car manufacturers require more integrated, powerful and complex electronic systems to address both the stringent ISO 26262 functional safety standard along with mandatory reduction of emissions and fuel consumption.

“The growing need for advanced automotive electronics is driving semiconductor companies to strengthen their collaboration with foundry partners, so together we can act at all levels of the supply chain to provide the best products to our customers,” said Ana Hunter, vice president of product management at GF. “The combination of Scaleo chip’s new microcontrollers and our 55nm automotive platform will improve the efficiency, performance, and power consumption of automotive ICs while maintaining adherence to the industry’s strict safety and quality standards.”

“Above and beyond the quality and efficiency of GF’s technology and team, their long-term commitment to the automotive market, demonstrated by their current investment and roadmap, is a key foundation of our preference for the GF 55nm eFlash NVM Platform,” said Bruno Paucard, President & CEO of Scaleo chip. “We see GF as a critical partner for us, fully supporting the success of Scaleo chip and our products as well as the satisfaction of our customers.”

OLEA microcontroller silicon samples are already available for selected customers. Demonstration of the first plug-in, full hybrid demonstration car powered by OLEA microcontrollers will be available shortly.

About Scaleo chip:

Scaleo chip is a fabless semiconductor company that designs, develops and sells complete and high value solutions, combining System-on-Chip (SoC) and embedded software for the future of automotive electronics industry. Scaleo chip product offering includes standard automotive microcontrollers addressing powertrain, body control, driver information and infotainment applications. The company leverages its technology and know-how by offering additionally custom products development and manufacturing for applications requiring added quality constraints as in defense or industrial markets. Scaleo chip is headquartered in Sophia-Antipolis, France. For more information, visit: scaleochip.com.

About GF:

GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as the second largest foundry in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com.

Communication/Press contact:

Scaleo chip
Marie Redureau
Tel: +33 (0)497 152 050
E-mail: [email protected]

GF
Jason Gorss
Tel: (518) 305-9022
E-mail: [email protected]

Marketing/Sales contact:

Scaleo chip
Tel: +33 (0)497 152 000
E-mail: [email protected]