IoT is Now! February 10, 2016The Internet of Things (IoT) is gaining a huge amount of attention – again. From considerable traction being made in low-cost sensors, cloud-based services and big data analytics to having significant prominence at CES, the IoT hype is back. Here are some one-liners, of my experience walking the floor at CES 2016: Drones – Storming the Horizon Automotive – Hot! Hot! Hot! Virtual Reality (VR) & Augmented Reality (AR) – VR more prominent than AR Robotics – Different form factors moving around 3D Printers – Getting serious 3D TVs without 3D glasses/eye-wear – Emerging and getting bigger Smart Home – Tons of gadgets showing up Wearables and Smart-garments – No cover-up here! Starting to blend with VR/AR It is important to recognize that the IoT goes beyond the “Things”. The associated market opportunity extends to the Networks to carry the data traffic, and the Data Centers to harness the data, and run analytics to transform the raw data to faster decision-making insights and outcomes. Internet of things is Beyond Things The IoT applications and use-cases that span Things, Networks, and Data Centers drive new requirements for semiconductors including ultra low power, ultra low leakage, smaller and denser packaging, and cost effectiveness. These requirements are at the heart of the IoT platform technologies developed by semiconductor Foundries that are power efficient, optimized, and cost-effective for IoT nodes. This “under-the-hood” differentiation at the semiconductor level enables the enhanced end-user and application experiences for IoT. Based on the market and customer trends, the prevalent process technologies for the Low and Mid-end IoT nodes are 55nm and 40nm. From 2017-18 onwards, we’ll see the shift to leading edge 28nm, 22nm, and 14nm and beyond, and a growth in edge-node computing. The best way to utilize changing technology is to forge the right strategic partnerships. How we partner with our customers – whether they’re supernovas coming from consolidation, or startups, which are the stars that are being born – will help define the IoT. Foundries understand they have a tremendous role to play in realizing the Internet of Things. By forging and strengthening partnerships with key customers, working to develop more efficient and effective technologies and ensuring excellence in execution – high yields and on time delivery – each and every one of us has a direct role to play in realizing the full potential of this critical opportunity. By any measure, this is the largest technology opportunity of our lifetime.
SUNY Poly and GLOBALFOUNDRIES Announce New $500M R&D Program in Albany To Accelerate Next Generation Chip Technology February 9, 2016Arrival of Second Cutting Edge EUV Lithography Tool Launches New Patterning Center That Will Generate Over 100 New High Tech Jobs at SUNY Poly ALBANY, NY – In support of Governor Andrew M. Cuomo’s commitment to maintaining New York State’s global leadership in nanotechnology research and development, SUNY Polytechnic Institute (SUNY Poly) and GLOBALFOUNDRIES today announced the establishment of a new Advanced Patterning and Productivity Center (APPC), which will be located at the Colleges of Nanoscale Science and Engineering (CNSE) in Albany, N.Y. The $500 million, 5-year program will accelerate the introduction of Extreme Ultraviolet (EUV) lithography technologies into manufacturing. The center is anchored by a network of international chipmakers and material and equipment suppliers, including IBM and Tokyo Electron, and will generate 100 jobs. “This advanced new partnership between SUNY Poly and GF demonstrates how Governor Cuomo’s strategic investments in SUNY are bolstering the system’s research capacity, leveraging private dollars, and creating exciting new opportunities at our campuses for students and faculty,” said SUNY Chancellor Nancy L. Zimpher. “SUNY Poly’s nanotechnology expertise coupled with the governor’s innovative public-private partnership model has positioned New York as a global leader in computer chip research, development, and manufacturing. SUNY System Administration strongly applauds Dr. Kaloyeros for his leadership in bringing the Advanced Patterning and Productivity Center to Albany.” “Today’s announcement is a direct result of Governor Cuomo’s innovation driven economic development model. His strategic investments supporting the state’s world class nanotechnology infrastructure and workforce have made us uniquely suited to host the new APPC, which will enable the continuation of Moore’s Law and unlock new capabilities and opportunities for the entire semiconductor industry,” said Dr. Alain Kaloyeros, President and CEO of SUNY Polytechnic Institute. “In partnership with GF, IBM and Tokyo Electron, we will leverage our combined expertise and technological capabilities to meet the critical needs of the industry and advance the introduction of this complex technology.” “GF is committed to an aggressive research roadmap that continually pushes the limits of semiconductor technology. With the recent acquisition of IBM Microelectronics, GF has gained direct access to IBM’s continued investment in world-class semiconductor research and has significantly enhanced its ability to develop leading-edge technologies,” said Dr. Gary Patton, CTO and Senior Vice President of R&D at GF. “Together with SUNY Poly, the new center will improve our capabilities and position us to advance our process geometries at 7nm and beyond.” EUV lithography is a next-generation semiconductor manufacturing technique that produces short wavelengths (14-nanometers and below) of light to create minuscule patterns on integrated circuits. The technology is critical to achieve the cost, performance, and power improvements needed to meet the industry’s anticipated demands in cloud computing, Big Data, mobile devices, and other emerging technologies. The APPC will tackle the challenges associated with commercializing EUV lithography technology. A key component of the center will be the installation of the ASML NXE:3300 EUV scanner, a state-of-the-art tool for the development and manufacturing of semiconductor process technologies at 7nm and beyond. This installation follows the installation of the IBM supported ASML NXE:3300B EUV scanner already in place at SUNY Poly. The center aims to bring mask and materials suppliers together to extend the capabilities of EUV lithography through exploring fundamental aspects of the patterning process. Other projects will be focused on enhancing productivity, in preparation for implementing EUV lithography in the manufacturing of leading-edge products in GF’s production facility in Malta, NY. Through the APPC, members will have access to SUNY Poly’s patterning infrastructure, which includes state-of-the-art film deposition and etch capability, leading-edge patterning systems, EUV mask infrastructure, and world-class EUV imaging capabilities. “IBM is committed to providing high-performance computing solutions for the cloud and cognitive era through continued leadership and collaboration in semiconductor technology research,” said Mukesh Khare, Vice President at IBM Research. “SUNY Poly CNSE’s investment in the APPC and new ASML tool will accelerate maturity of EUV technology towards manufacturing, which will allow us to build on the innovations that enabled an IBM Research-led alliance to deliver the industry’s first 7nm test chip demonstration earlier this year. Through the vision and leadership of the Governor and CSNE, leading-edge partnerships such as this one are possible.” “EUV technology has emerged from R&D and the new center will meet the rising demand to commercialize this technology and put it in the hands of end users,” said Gishi Chung, SVP & GM, Head of SPE Development Division from TEL. “TEL is proud to be partnering with SUNY Poly at its Albany NanoTech Complex as we continue our work with fellow industry leaders to advance cutting edge innovations in semiconductor process technology.” ### SUNY Polytechnic Institute. SUNY Polytechnic Institute (SUNY Poly) is New York’s globally recognized, high-tech educational ecosystem, formed from the merger of the SUNY College of Nanoscale Science and Engineering and SUNY Institute of Technology. SUNY Poly offers undergraduate and graduate degrees in the emerging disciplines of nanoscience and nanoengineering, as well as cutting-edge nanobioscience and nanoeconomics programs at its Albany location and undergraduate and graduate degrees in technology, including engineering, cybersecurity, computer science, and the engineering technologies; professional studies, including business, communication, and nursing; and arts and sciences, including natural sciences, mathematics, humanities, and social sciences at its Utica/Rome location. Thriving athletic, recreational, and cultural programs, events, and activities complement the campus experience. As the world’s most advanced, university-driven research enterprise, SUNY Poly boasts more than $43 billion in high-tech investments, over 300 corporate partners, and maintains a statewide footprint. The 1.3 million-square-foot Albany NanoTech megaplex is home to more than 4,000 scientists, researchers, engineers, students, faculty, and staff, in addition to Tech Valley High School. SUNY Poly operates the Smart Cities Technology Innovation Center (SCiTI) at Kiernan Plaza in Albany, the Solar Energy Development Center in Halfmoon, the Children’s Museum of Science and Technology (CMOST) in Troy, the Central New York Hub for Emerging Nano Industries in Syracuse, the Smart System Technology and Commercialization Center (STC) in Canandaigua, and the Photovoltaic Manufacturing and Technology Development Facility in Rochester where SUNY Poly also leads the American Institute for Manufacturing Integrated Photonics. SUNY Poly founded and manages the Computer Chip Commercialization Center (Quad-C) at its Utica location and also manages the $500 million New York Power Electronics Manufacturing Consortium, with nodes in Albany and Rochester, as well as the Buffalo High-Tech Manufacturing Innovation Hub at RiverBend, Buffalo Information Technologies Innovation and Commercialization Hub, and Buffalo Medical Innovation and Commercialization Hub. For information visit www.sunycnse.com and www.sunypoly.edu. GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as one of the largest foundries in the world, providing a unique combination of advanced technology and manufacturing to more than 250 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s 300mm fabs and 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com.
纽约州立大学理工学院和格芯在奥尔巴尼宣布新的500万美元研发计划，以加速下一代芯片技术 February 9, 2016 第二款尖端EUV平版印刷工具推出新型图案化中心，这将为SUNY Poly创造超过100个新的高科技工作职位。 纽约州阿尔巴尼 —为支持纽约州州长Andrew M. Cuomo承诺地维护纽约州在纳米技术研究与开发方面的全球领导力，纽约州立大学理工学院（SUNY Poly）和格芯今天宣布成立新的高级复写和创造力中心（APPC），该中心位于纽约州奥尔巴尼的纳米科学与工程学院（CNSE）。 5亿美元的5年计划将加速将极紫外（EUV）光刻技术引入制造阶段。该中心由国际芯片制造商和材料和设备供应商（包括IBM和东京电子）组成，并将创造100个工作岗位。 “纽约州立大学理工学院和格芯之间的这种先进的新型合作伙伴关系表明，州长Cuomo SUNY的战略投资正在加强系统的研究能力，高效的利用私人资金，并在校园为学生和教师创造令人兴奋的新机会，”SUNY总理Nancy L. Zimpher表示，“纽约州立大学理工学院的纳米技术的优势，以及州长创造性的公私伙伴关系模式将使纽约成为计算机芯片研发，制造领域的全球领导者。SUNY系统管理部门高度的赞扬了Kaloyeros博士在领导奥尔巴尼高级图案化和生产力中心方面的成就”。 “今天的公告是州长Cuomo创新驱动的经济发展模式的直接成果。他战略投资支持纽约州发展成国家世界级纳米技术基础设施和劳动力，这使我们非常适合主办新的APPC并继续实施摩尔定律，为整个半导体行业开辟新的能力和机会。” 纽约州立大学理工学院院长Alain Kaloyeros博士说，“与格芯，IBM和东京电子合作，我们将利用我们的综合专业知识和技术能力来满足业界的核心需求，并推动这一复杂技术的引进。” “格芯致力于一个积极的研究规划发展，不断突破半导体技术的极限。随着最近收购IBM微电子，格芯已经直接获得了IBM对世界级半导体研究的持续投资，并大大提高了其开发尖端技术的能力。”格芯首席技术官，兼研发部高级副总裁Gary Patton博士表示， “与纽约州立大学理工学院一起，新的中心将提高我们的能力，并使我们能够在7nm及以上的技术上提升我们的几何制程和工艺。” EUV光刻技术是下一代半导体制造技术。这种技术产生短波光（14纳米及以下），并且在集成电路上产生微小的图案。该技术对于实现业界在云计算，大数据，移动设备和其他新兴技术方面的成本，性能和功耗改进发展是至关重要的。 APPC将解决EUV光刻技术商业化将面临的相关挑战。该中心的关键组成部分将是安装ASML NXE：3300 EUV扫描仪，这是一种用于在7nm及以上的半导体制程技术开发和制造的最先进的工具。此安装遵循纽约州立大学理工学院已经安装的IBM支持的ASML NXE：3300B EUV扫描仪。 该中心旨在通过探索图案复写过程的基本方面，将掩膜和材料供应商集中在一起，扩大EUV光刻的能力。其他项目将侧重于提高生产力，为格芯在纽约马耳他的生产设施制造领先产品做准备。 通过APPC，成员将可以使用纽约州立大学理工学院的图案化基础设施，其中包括最先进的影像沉积和蚀刻能力，前沿图案系统，EUV掩膜基础设施以及世界一流的EUV成像能力。 “IBM致力于通过半导体技术研究领域的不断领导和合作，为云和认知时代提供高性能的计算解决方案。”IBM研究部副总裁Mukesh Khare表示，“纽约州立大学理工学院CNSE对APPC的投资和新的ASML工具将加速EUV技术向制造阶段的迈进。这将使我们能够利用IBM研发主导的联盟在今年早些时候提供业界首个7nm测试芯片演示。通过州长和CSNE的愿景和领导，这样的前沿伙伴关系是完全可能实现的。” “EUV技术来源于研发。新中心将会满足这种技术日益增长的商业化需求，最终将这种技术带到用户手中。”TEL的SPE开发部门负责人Gishi Chung表示，“TEL很荣幸能与纽约州立大学理工学院在Albany NanoTech Complex合作。我们将继续与同行业领导者合作，推动半导体工艺技术的在尖端领域的创新。” 关于纽约州立大学理工学院 纽约州立大学理工学院（SUNY Poly）是全球公认的高科技教育生态系统，由SUNY纳米科学与工程学院与SUNY理工学院合并组成。 SUNY Poly在新兴的纳米科学和纳米工程学科提供本科和研究生学位，同时在奥尔巴尼地区提供尖端纳米生物学和纳米经济学课程。该机构同时在各个方面提供本科和研究生学位，技术方向包括：工程，网络安全，计算机科学和工程技术；专业研究方向，包括商务，沟通和护理;艺术和科学方向，包括自然科学，数学，人文和社会科学。蓬勃进行的各类娱乐和文化活动，也进一步充实了学校的校园体验。作为世界最先进的大学驱动型研究型企业，纽约州立大学理工学院拥有超过430亿美元的高科技投资，超过300家企业合作伙伴，合作范围遍及全球。 Tech Valley中除了拥有130万平方英尺的奥尔巴尼纳米科技大型学院，还拥有超过4000名科学家，研究人员，工程师，学生，教职员工和员工。 纽约州立大学理工学院运营管理着多个机构，包括：位于奥尔巴尼Kiernan广场的智能城市技术创新中心（SCiTI），位于Halfmoon的太阳能发展中心，位于特洛伊的儿童科技博物馆（CMOST），位于雪城的新兴纳米工业中心 ，位于卡南代瓜市的智能系统技术和商业中心（STC），以及位于罗彻斯特的光伏制造和技术开发设施和美国制造集成光子学研究所。纽约州立大学理工学院在创立并管理位于由提卡市的计算机芯片商业化中心（QuadC），并管理了5亿美元的纽约电力电子制造联盟（New York Power Electronics Manufacturing Consortium），其中包括在奥尔巴尼和罗切斯特的节点以及在RiverBend的布法罗高科技制造创新中心，布法罗信息技术创新和商业中心，以及布法罗医疗创新和商业化中心。有关信息，请访问www.sunycnse.com and www.sunypoly.edu. 关于格芯 GF是世界上第一个具有真正意义上足迹遍布全球的全方位服务晶圆制造商。该公司于2009年3月成名，并迅速实现了规模化，成为世界最大的晶圆生产商之一，为250多个客户提供先进技术和独特制造的组合。格芯在新加坡，德国和美国经营，是唯一提供跨越全球三大洲的制造中心，并提供的足够灵活性和高度安全性的代工厂。该公司的300mm晶圆厂和200mm晶圆厂提供从主流到前沿的全系列制程技术。格芯的制造业务遍及全球，而格芯位于美国，欧洲和亚洲的半导体业务中心的大量的研发和设计实现人员为格芯的全球制造业务提供全面的支持。格芯由Mubadala Development Company拥有。欲了解更多信息，请访问https://www.globalfoundries.com.
新的Cadence Modus测试解决方案可以降低高达3倍的SoC测试时间 February 2, 2016 SAN JOSE, Calif., 01 Feb 2016 Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the new Modus™ Test Solution that enables design engineers to achieve an up to 3X reduction in test time, thereby reducing production test cost and increasing silicon profit margins. This next-generation test solution incorporates patent-pending, physically aware 2D Elastic Compression architecture that enables compression ratios beyond 400X without impacting design size or routing.
New Cadence Modus Test Solution Delivers Up to 3X Reduction in SoC Test Time February 2, 2016Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the new Modus™ Test Solution that enables design engineers to achieve an up to 3X reduction in test time, thereby reducing production test cost and increasing silicon profit margins. This next-generation test solution incorporates patent-pending, physically aware 2D Elastic Compression architecture that enables compression ratios beyond 400X without impacting design size or routing
22FDX®: Enabler for IoT? January 18, 2016There is no question that the Internet of Things (IoT) is expected to be the next big application for microelectronics. 50 billion devices to be connected by the year 2020 – this is the vision of the IoT development paradigm. IoT systems are going to show a high diversity of function and shape. While some systems may be small, others might expand to become as large as today’s SoC systems for the mobile internet. The question is, how do we address IoT system components, which need to be fast but consume low static stand-by power when not in use? GLOBALFOUNDRIES 22FDX technology offers an excellent fit to such system and cost requirements. The determining new feature of this 22nm fully depleted SOI (FD-SOI) technology is the thin silicon layer where the active transistor is formed. In traditional SOI technologies a conventional transistor is formed in an isolated well, which is typically left floating in digital circuits. FD-SOI transistors are much thinner, and no well is formed. In addition, device isolation is a lot simpler, which also reduces implant steps. And, as engineers contemplate their next node, they need to keep in mind that the 22FDX flow provides FinFET-like performance with ultra-low power at a cost comparable to 28nm planar technologies. Below are some additional noteworthy data points on the technology: 70% lower power compared to 28nm High K Metal Gate (HKMG) 20% smaller die than 28nm bulk planar Lower die cost than FinFETs A Sandbox for Creative Designers Software-controlled body-biasing, which provides a flexible trade-off for managing high performance and low power, offers an additional degree of freedom for system and circuit design with 22FDX. Real time power consumption trade-offs can be made at the device level — mostly by powering major functional blocks. This is one reason why industry analyst Dan G. Hutcheson believes GF’s 22FDX will be a “major revolution.” 22FDX: Multiple Body-Bias and Vt Points on Same Die Additionally, 22FDX offers capabilities for design flexibility and intelligent control that enable innovation that hasn’t been possible in the past. These capabilities include: Post-silicon tuning enables lower power consumption while maintaining high circuit performance Integrated RF includes tuning “knobs” to reduce RF power by up to 50 percent, making a separate RF chip unnecessary The 22FDX technology design ecosystem is building fast. In November, all major EDA vendors, in particular Synopsys, Cadence and Mentor Graphics, announced they are offering tool suites adapted for 22FDX. They are a key part of an ecosystem that is expanding to support our customers’ success. Design Migration to 22FDX from Bulk Node 22FDX is a breakthrough technology with a robust future, extending Moore’s Law through delivering the die size reductions, power reductions, increases in performance and increased functionality and without more complex manufacturing processes. Subramani Kengeri, Vice President, General Management, CMOS Platforms Business Unit at GF, will present on enabling next-generation innovation with 22FDX on Thursday, Jan. 21, 2016 at the FD-SOI Forum in Tokyo, Japan.
Sidense Qualifies 1T-OTP Memory IP at GLOBALFOUNDRIES 55nm Low-Power Process Node December 29, 2015CHANDLER, Ariz., July 12, 2016 — Microchip Technology Inc. (NASDAQ: MCHP), a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, through its Silicon Storage Technology (SST) subsidiary, announced today qualification and availability of SST’s low-mask-count embedded SuperFlash® non-volatile memory (NVM) on GLOBALFOUNDRIES’ 130 nm BCDLite® technology platform. SST’s embedded SuperFlash memory solution requires the addition of only four masking steps to GLOBALFOUNDRIES’s BCDLite technology that provides power, microcontroller (MCU) and industrial IC designers with a cost-effective, high-endurance embedded Flash solution. In high-volume power applications such as battery charging (5V-30V), the GLOBALFOUNDRIES 130 nm BCDLite platform paired with the SST SuperFlash embedded memory capability enables advanced battery monitoring that accurately gauges the age and health of the battery.
GLOBALFOUNDRIES Strengthens Presence in Asia through Regional Headquarter Status in Singapore December 1, 2015 First regional headquarters office outside of United States Shared global services and management of regional subsidiaries to better serve customers throughout Asia and other geographies Committed to growing success in Asia and global semiconductor sector Singapore, December 1, 2015 — GLOBALFOUNDRIES, a leading provider of semiconductor manufacturing technology, today announced that its subsidiary, GF Singapore Pte. Ltd., has received the Regional Headquarters (RHQ) award by the Singapore Economic Development Board (EDB). The RHQ status is granted by EDB to companies that that demonstrate their commitment to manage their regional headquarters with substantial investments in Singapore. The RHQ status offers various incentives, including tax benefits. “Receiving the RHQ status for our Singapore site is a testament of our long term commitment to the region and enables us to deeply anchor our relationships in Asia Pacific, ” said Mr. KC Ang, Senior Vice President and General Manager of GF Singapore Operations. “We appreciate the long-standing support from the Singapore EDB, and we look forward to continuing our success in this region and growth in the global semiconductor sector.” In line with the RHQ status, GF Singapore conducts activities in general management and administration, strategic business planning and development, marketing and sales in key Asian markets. In addition, the Singapore site is offering its expertise in advanced technology design and enablement, IT application services and finance control and administration to GF’s other global locations, including its manufacturing sites in Germany and the U.S.A. “We are pleased that GF has chosen Singapore as its regional headquarters outside of the USA,” said Mr. Yeoh Keat Chuan, Managing Director of the Singapore Economic Development Board. “GF’s decision is a testament to Singapore’s value as a location from which companies can manage and grow their businesses in Asia. We look forward to further strengthening our long partnership with GF.” ABOUT GF GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as one of the largest foundries in the world, providing a unique combination of advanced technology and manufacturing to more than 250 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s 300mm fabs and 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by the Mubadala Development Company. For more information, visit https://www.globalfoundries.com. Media Contact: Jason GorssGF518-698-7765[email protected]
GLOBALFOUNDRIES Receives Quality Award from INOVA Semiconductors GmbH November 19, 2015SINGAPORE, November 19, 2015 – GLOBALFOUNDRIES today announced it has been presented with an Award of Excellence from INOVA Semiconductors GmbH, a specialist in the development of state-of-the-art products for Gigabit/s serial data communication for in-vehicle Display- and Driver Assistance Systems. This award acknowledges GF for its ability to achieve top quality and yield performance for the silicon wafers produced specifically for the customer’s RF communication products used in the automotive market. Driven by “Zero Excursion, Zero Defect” (ZEZD) mindset, this is a testament to GF’s continuous strive for improvement to increase initial product quality and reduce wafer failure rate after delivery. “Achieving zero defect is our goal and GF’s proven expertise in the automotive semiconductor supply chain plays an important role in helping us to reach that goal,” said Robert Kraus, INOVA Semiconductors CEO. “It is a great honor for GF to receive this award from INOVA. This award further solidifies our position in serving the automotive market over a decade with high quality and reliability standard, and propel us to become a leading foundry in this segment,” said KC Ang, SVP and General Manager for GF Singapore. GF completes a range of industry certifications and audits every year in its continuous commitment to semiconductor quality and reliability. Every fab in Singapore are certified or exceeding ISO-TS 16949, ISO 9001, ISO 14001 and OHSAS 18001, including the customer-led VDA6.3 audits that exceed the TS16949 standard. GF is also a member of the Automotive Electronics Council (AEC) which sets global industry standards for automotive semiconductor quality. About GF GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as one of the largest foundries in the world, providing a unique combination of advanced technology and manufacturing to more than 250 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com. About INOVA Semiconductors Inova Semiconductors is a fabless semiconductor company and the developer of APIX: a serial high speed Gigabit multichannel link to interconnect displays, cameras and control units over a single cable. Inova specializes in developing state-of-the-art products for serial data communication, with a focus on digital video and the automotive market. Based in Germany, Inova was founded in 1999. Today, APIX is used by ten leading car brands and more than 20 tier 1 suppliers. For more information, visit https://www.inova-semiconductors.com.
GLOBALFOUNDRIES Launches High-Performance ASIC Offering on 14nm FinFET Process Technology November 11, 2015GLOBALFOUNDRIES FX-14™ delivers industry’s most complete ASIC offering for chip designers targeting cloud, data center, and communication applications Santa Clara, Calif., November 11, 2015 — GF today announced the availability of FX-14™, an application-specific integrated circuit (ASIC) offering built on the company’s next-generation 14nm FinFET process technology. The GF FX-14 ASIC offering is an ideal solution for customers seeking to strike a balance between high bandwidth, low power, and cost for cloud networking, wireless base station, compute, and storage applications. With the recent acquisition of IBM’s Microelectronics Division, the FX-14 ASIC offering combines GF’s manufacturing scale and process technology leadership with a legacy of ASIC expertise that has helped customers bring some of the industry’s most complex ASICs to market. Using GF’s 14LPP process technology, FX-14 leverages the production-proven 14nm FinFET platform from the company’s Fab 8 facility in Saratoga County, NY. “In order to enable extremely high-speed connectivity solutions for a wide range of networking applications, we require ASIC solutions that provide an optimal balance of performance, power and cost,” said Kianoosh Naghshineh, CEO, Chelsio Communications, Inc. “The combination of the recently acquired IBM ASIC design expertise and GF’s 14LPP technology enables Chelsio to continue to push the price-performance curve and deliver industry-leading solutions to our customers.” “The FX-14 ASIC offering continues to extend our leadership in delivering the most advanced ASIC solutions for the wired and wireless networking infrastructure,” said Mike Cadigan, senior vice president of product management at GF. “Coupling the legacy of strong ASIC expertise with GF’s 14LPP technology provides our customers the best combination to differentiate and stay ahead of evolving marketplace demands.” The FX-14 ASIC offering includes an enhanced, optimized intellectual property (IP) portfolio, featuring leading-edge ARM cores and ARM® Artisan® physical IP. The broad lineup of cores for system-on-chip designs include 64-bit ARM Cortex®-A72 and ARM Cortex-A53 processors. “The industry-leading ARM processors that power more than 95% percent of the smartphones shipping today are an ideal complement to GF’s FX-14 ASIC offering,” said James McNiven, general manager, CPU group, ARM. “Our latest collaboration efforts with GF on the FX-14 ASIC offering will further enable our mutual silicon partners to deliver highly-advanced SoCs.” The FX-14 offering also delivers an optimized IP portfolio including High Speed Serdes (HSS) solutions. The HSS solutions range from the best in class architecture for high performance 56G backplane and chip-to-chip designs to optimized 30G and 16G SERDES designs covering a broad range of interface standards. GF’s embedded memory solutions include ternary content-addressable memory (TCAM), capable of billions of searches per second as well as high density and high performance memory compilers. These memory compilers exploit the industry’s smallest memory cell to achieve outstanding SRAM density as well as take advantage of a performance-tuned memory cell to achieve the best in class performance. GF’s 14LPP technology offering was qualified in the third quarter of 2015 and is on track for volume production in 2016. FX-14 design kits are available to customers now. For more information on GF’s ASIC solutions, visit our booth #607 at ARM TechCon from November 10-12, in Santa Clara, California, or go online at www.globalfoundries.com ABOUT GF GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as one of the largest foundries in the world, providing a unique combination of advanced technology and manufacturing to more than 250 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s 300mm fabs and 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com. Media Contact: Erica McGillGF(518) 305-5978[email protected]
