GLOBALFOUNDRIES Brings New Level of Security and Protection on 22FDX Platform for Connected Systems October 10, 201922FDX security solution aims to protect against physical tampering and attacks for cellular Internet of Things (IoT) devices Santa Clara, Calif., October 10, 2019 – GLOBALFOUNDRIES® (GF®), the world’s leading specialty foundry, announced today that it is working with Arm® to offer secure system-on-chip (SoC) solutions on GF’s 22FDX® platform, based on FD-SOI, for cellular IoT applications. With the growing threat of reverse engineering and other illegal threats to IP, it is imperative to protect complex electronic systems at their foundation with hardware-based security IP solutions, including crypto cores, hardware trust and high-speed protocol engines. GF’s 22FDX platform with Arm® CryptoIsland™ on-chip security enclave provides an on-die, hardware-secure solution enabling easy integration of front-end modules (FEM), RF, baseband, embedded MRAM and cryptographic capabilities into a single IoT SoC, while significantly reducing costs. “In a world where billions of devices are generating data across smart cities, rural environments, and digitally transformed industries, in order to deliver true insight, security cannot be optional,” said Vincent Korstanje, vice president and general manager, Emerging Businesses at Arm. “Customers designing for mobile and IoT applications will benefit from the CryptoIsland technology on GF’s 22FDX highly integrated, energy-efficient platform, providing new levels of security that is easy to deploy at a cost point that scales.” “With so many conduits to the Internet and the growing importance of cyberattack defenses, we believe chip security will only grow in importance for the industry and our clients in the years ahead,” said Ed Kaste, vice president of Industrial and Multi-Market at GF. “By leveraging our 22FDX platform and applying Arm’s powerful CryptoIsland security subsystem, we can jointly offer a highly integrated security solution to our mutual clients that will unlock new levels of cellular IoT integration, offering new secure identity capabilities for cellular IoT applications.” GF’s 22FDX provides a fast path-to-product solution that includes silicon-qualified IP. The 22FDX security solution is now under development on GF’s state-of-the-art 300mm production line at Fab 1 in Dresden, Germany. About GF GLOBALFOUNDRIES (GF) is the world’s leading specialty foundry. We deliver differentiated feature-rich solutions that enable our clients to develop innovative products for high-growth market segments. GF provides a broad range of platforms and features with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF has the flexibility and agility to meet the dynamic needs of clients across the globe. GF is owned by Mubadala Investment Company. For more information, visit globalfoundries.com. Contact: Erica McGillGLOBALFOUNDRIES(518) 795-5240[email protected]
GLOBALFOUNDRIES and Racyics GmbH Demonstrate Ultra-Low-Power Microcontroller for the Internet of Things October 10, 2019Record silicon results to be presented tomorrow at GTC 2019 in Munich, made possible by the adaptive body biasing capability on GF’s 22FDX® platform, along with Racyics’ IP Santa Clara, Calif. and Dresden, Germany, October 10, 2019 – A major limiting factor in the growth of Internet of Things (IoT) applications is the amount of power consumed by the edge devices used in IoT networks, and as a result, there is an urgent need to find ways to use far less power to operate them. Tomorrow, GLOBALFOUNDRIES® (GF®), the world’s leading specialty foundry, and Racyics GmbH will unveil a major breakthrough in the race to build more power-efficient IoT devices: record-breaking ultra-low-power operation of a commonly used microcontroller core for mixed-signal IoT applications, built on GF’s 22FDX® platform. At GF’s annual Global Technology Conference (GTC) in Munich, the companies will demonstrate a 22FDX-based 100MHz Arm® Cortex®-M4F microcontroller test chip with 84kB of SRAM, which demonstrated an ultra-high energy-efficiency of 6.88 µW/MHz. Key to this outstanding performance is the adaptive body bias (ABB) tunability inherent to 22FDX, along with Racyics’ circuit design approach which maximizes its advantages. The 22FDX platform with ABB capability enables designers to create circuits where transistor threshold voltage can be tuned, or optimized, to match an application’s requirements for energy efficiency, performance, area, reliability, or any combination. Leveraging this capability, Racyics offers a design IP called ABBX that enables the creation of circuits with reliable, predictable ultra-low voltage operation down to 0.4V. This is done by holistically considering process, supply voltage and temperature inputs to achieve power, performance and area goals with a high yield. “The need for power-efficiency is urgent because SoCs (systems-on-chip) for IoT applications are projected to grow at a double-digit rate, fueled by diverse and increasingly sophisticated applications across smart city, agricultural, medical, industrial, smart home and other markets,“ said Ed Kaste, vice president of Industrial and Multi-Market at GF. “Although the needs of these applications vary, the most important consideration among all of them is ultra-low power consumption. The record-breaking circuit we produced and will discuss at GTC 2019 is tangible proof that our 22FDX platform offers best-in-class performance, power consumption and level of integration for IoT applications.” “Our easy-to use turnkey ABBX solution is based on the standard design and sign-off flow, and delivers improved PPA (power, performance and area) results with guaranteed performance and power,” said Holger Eisenreich, CEO of Racyics. “The silicon results demonstrate the benefits of our holistic adaptive body biasing approach for ultra-low voltage designs.” Cellular narrowband (NB-IoT) devices offer one example of why energy efficiency is such a critical IoT requirement. These devices are often expected to operate on battery power for up to 10 years, and to achieve this, sophisticated energy management techniques are used to activate specific functional blocks and power domains only as-needed. When in operation, extreme energy efficiency at the lowest operating voltages are key to achieving the most demanding power budget. The Racyics ABBX solution is now qualified on GF’s 22FDX® platform. About Racyics GmbH Racyics, based in Dresden, Germany, is an experienced system-on-chip (SoC) design service and IP provider with a focus on advanced semiconductor nodes. We offer our customers a wide range of design services including custom IP and turnkey SoC solutions. For more information, please go to www.racyics.de. About GF GLOBALFOUNDRIES (GF) is the world’s leading specialty foundry. We deliver differentiated feature-rich solutions that enable our clients to develop innovative products for high-growth market segments. GF provides a broad range of platforms and features with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF has the flexibility and agility to meet the dynamic needs of clients across the globe. GF is owned by Mubadala Investment Company. For more information, visit globalfoundries.com. Contact: Erica McGillGLOBALFOUNDRIES(518) 795-5240[email protected]
GLOBALFOUNDRIES Acquires Smartcom’s PDK Engineering Team to Expand Worldwide Design Enablement Capacity October 10, 2019Acquisition strengthens overall process design capabilities and expands the company’s footprint in Europe Santa Clara, Calif., October 10, 2019 – GLOBALFOUNDRIES® (GF®), the world’s leading specialty foundry, announced today that it has acquired the PDK (Process Design Kit) engineering team from Smartcom Bulgaria AD in Sofia, Bulgaria. The newly acquired team will enhance GF’s scale and capabilities, while strengthening competitiveness of its specialized application solutions to further position the company for growth and value creation. Process Design Kits are the critical interface between a company’s integrated circuit (IC) design and the fabs, which manufacture the clients chip products. Since 2015, Smartcom has supported GF’s PDK development and quality assurance for platform technologies spanning from 350nm to 12nm. Under the terms of the acquisition, GF will acquire Smartcom’s PDK development team of more than 125 employees. The newly acquired team will be led by Dr. Dobromir Gaydazhiev, an experienced industry veteran who has been responsible for leading the business since its inception in 2003. The deal is expected to close in December 2019, following receipt of required regulatory approvals. With this acquisition, GF is expanding its worldwide design enablement capabilities and strengthening its European footprint. The Sofia operations build on GF’s long established Fab 1 operations in Dresden, Germany, the company’s Bump Test Facility (BTF) and the AMTC mask house, a joint venture with Toppan. These three facilities with more than 3500 employees and a combined investment of more than US $12B are central to Silicon Saxony, Europe’s largest and most significant microelectronics cluster. “Today is an exciting day for GF. As we continue to offer more feature-rich differentiated solutions for our clients, PDKs are becoming increasingly important,” said Thomas Caulfield, CEO of GF. “With the acquisition of Smartcom’s PDK development team, we are enhancing the depth and breadth of our capabilities and capacity in Europe and across the globe. We have worked with the Sofia team for many years and the quality of their work is unmatched in the industry. We fully expect to expand our investment in our worldwide PDK organization to meet the growing demands of our clients.” “We are excited to join GF at this time and to be part of GF’s growth strategy,” said Dr. Dobromir Gaydazhiev, managing director PDK Services Bulgaria EAD. “Our collaboration goes back many years and our progress has been largely fueled by GF. The team and I are looking forward to become fully integrated into GF’s design enablement processes and to helping enable our clients’ products with our PDKs. We also appreciate the opportunity to engage in European programs and projects that bring together RTOs, IDMs, Design System Companies with Foundries to advance Europe’s capabilities and capacities in microelectronics.” About Smartcom Smartcom Bulgaria AD (Smartcom) is an innovation and technology driven private joint stock company, established in May 1990, which operates subsidiaries in UK and Turkey. The company specializes in: Microelectronics and Electronic Design Automation, Carrier Grade Telecom Professional Services, Embedded Systems, IoT. For more information, visit: www.smartcom.bg About GF GLOBALFOUNDRIES (GF) is the world’s leading specialty foundry. We deliver differentiated feature-rich solutions that enable our clients to develop innovative products for high-growth market segments. GF provides a broad range of platforms and features with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF has the flexibility and agility to meet the dynamic needs of clients across the globe. GF is owned by Mubadala Investment Company. For more information, visit globalfoundries.com. Contact: Erica McGillGLOBALFOUNDRIES(518) 795-5240[email protected]
GF’s First Decade: Finding Their Center September 30, 2019By: Dave Lammers The second of a three-part series looking back at GF’s first 10 years, and looking forward to the next decade and beyond. GLOBALFOUNDRIES’ first decade was a ten-year period during which the foundry met a series of remarkable challenges, ranging from technology transitions that tested the mettle of its staff to decisions about how to differentiate GF from its competition. How GF got from delivering just a few technology solutions for AMD in 2009 to where it is today – with a portfolio of RF-based solutions dominating the marketplace and a serious thrust underway in fully depleted SOI – is arguably the most interesting story in the semiconductor industry over the past decade. The journey to build an at-scale global semiconductor manufacturerSource: GF I talked to Gregg Bartlett, now GF’s head of engineering and technology, who was recruited to join the brand-new company at the very beginning. Bartlett remembers 2009 as the year when he joined GLOBALFOUNDRIES and immediately was thrust into what was a demanding start for the new foundry, but it also was a time when management learned to assess how much risk it should take on technology and product transitions – a valuable lesson. A Challenging Beginning GF, spun out from AMD in early 2009 with financial backing from Abu Dhabi’s Mubadala investment fund, was immediately tasked with bringing up a new AMD product architecture, on a new 32nm high-k/metal gate process. That combination proved to be very challenging to build in high volume production. Bartlett recalled, AMD’s flagship new “APU” part –which pioneered the combination of a graphics processing engine and a CPU core on one die – required focused execution at GF’s flagship fab in Dresden, Germany. “It was quite a humbling time, a really difficult time – but we persevered,” Bartlett said. Patrick Moorhead, now an industry analyst at Moor Insights & Strategy, was part of AMD’s management team a decade ago. “If you look at it from a historical perspective, Llano had one of the first large pieces of graphics IP that was integrated with the APU. At that time, no smart phone processor was delivering anything like it. But getting it going came in fits and starts, and there were super, super challenges in getting that part going.” Bartlett said the main lesson GF management learned was to manage the amount of risk being taken. “Right out of the chute, GF was trying to be something that was going to be hard to do, introduce a revolutionary new silicon technology. We tried to change our chip architecture, while at the same time making technological innovations. I look at our company today, and can say we have learned a lot about working with customers to better manage technology innovation with customer design innovation.” From Three to 300 Customers Then in 2010 GF’s management, with backing from the leadership at the Mubadala fund, acquired Chartered Semiconductor. GF and the Dresden fab had produced just a few different parts for a small group of customers who needed the leading-edge technology offered in the fab, and Bartlett said GF’s management realized it needed to learn to deal with multiple customers with various process technologies. “We asked ourselves then: How do you change a fab with three customers to one with 30 customers, and then 300 customers? How do you change your business processes? The answer was, of course: not easily. Chartered brought us skills and processes to deal with hundreds of customers all at once,” Bartlett said, praising the “customer orientation” that Chartered’s Singapore team brought into the GF culture. GLOBALFOUNDRIES acquired the Singapore site from Chartered Semiconductor on January 13, 2010. Chartered Semiconductor originally opened the fab in 1995. It was one of the first 200mm fabs. Source: GF “What Chartered had figured out was how to always have contingency plans for customers to ensure they hit their market introductions,” he said. Bartlett gave credit to the leaders at the Mubadala investment fund, saying they were “willing to make the large investment in acquiring Chartered, knowing how transformative the acquisition was.” The acquisition gave GF several 200 and 300mm fabs in Singapore, and roughly 200 customers. The acquisition began a transformation of the new foundry, creating a process of dealing with many dozens of customers. “This was an inorganic transformation that accelerated our ability to operate as a global foundry. Today, Singapore is a very successful part of our corporation and has proliferated processes and talent across our company,” Bartlett said. A ‘Very Fortuitous” Cooperation Building on lessons learned from Dresden’s work on the 32/28nm node, five years later the new Malta fab faced the challenge at the 14nm node, when FinFETs were first introduced. This time, GF and AMD came through it smoothly, with Moorhead describing the happy endpoint: “When the first versions of (the AMD 14nm) Ryzen came out, as an industry analyst I had to ask myself, ‘What is not going to work?’ It is one thing to ship a few thousand samples, but shipping hundreds of thousands, and then millions, is a different thing. It was a super-impressive ramp, to say the least. And to do that while outperforming many of Intel’s products on cache cell size, on performance of the transistors, on power consumption and the amount of heat, was truly remarkable.” GF’s groundbreaking ceremony to officially start construction of the Admin 2 office building as part of Fab 8 in Saratoga County, New York. Source: GF Learning to Collaborate To achieve that 14nm success, GF went through an honest self-appraisal. Bartlett, who by then was GF’s chief technology officer, recalls that at the time, members of the IBM technology alliance all had come up with different answers to the 14nm node. IBM was pursuing an SOI-based process that included its deep-trench embedded DRAM, while GF and Samsung went their separate ways toward bulk CMOS finFET 14nm processes. While GF and Samsung were holding intermittent discussions about if and how to cooperate, they realized cooperation was a good way to manage supply risk for a very large customer in the mobile space. This brought GF and Samsung together to collaborate on deployment of a single technology between the two companies. When it became apparent that there was a deal, that turned out to be very beneficial,” Bartlett said. By working with Samsung on 14nm, GF accelerated its transition to go into high-volume manufacturing. At the same time, GF was able to grow the technology development team in Malta that is now differentiating that platform for more applications and customers today. A First Step Toward Differentiation with FD-SOI Bartlett said that when GF was in the process of acquiring IBM Microelectronics, management concluded it needed a technology diversification strategy, something different than what its main competitor was doing at the 28nm node. “FD-SOI was our first conscious choice to differentiate on a technology platform. Rather than go imitate the industry leader, we decided to drive a superior technology solution for market segments we believed needed FDSOI such as IoT and integrated RF,” Bartlett said. GF’s 22FDX platform technology relies on planar transistors as well as fully-depleted SOI wafersSource: GF That ability to make tough decisions, to be flexible, was needed again last year, when GF’s new management team, led by Tom Caulfield, concluded that it needed to pivot away from 7nm to be more relevant to our customers. This pivot freed development resources, allowing more investment in the technology platforms that the majority of GF’s customer base was using, including 12nm FinFET, 22FDX®, RF, silicon photonics and other platforms. Moorhead said he believes the 22FDX process has power advantages for edge processing that will play a major role as 5G RF and data processing converge. “The opportunity for GF is huge. 5G — and all of the associated circuitry that goes with it – will be fundamentally connected to the Internet of Things. That is going to define the next ten years. It gets us to hyper-connectivity,” Moorhead said. I asked Bartlett if GF’s experiences over its first decade had created a battle-tested workforce, better able to meet future challenges. “We’ve learned a lot from our first ten years of existence, understanding which decisions we got right, and which ones we got wrong and why. And when we got them wrong, to have gone through them together as one GF team means we are better able to deal with future challenges.” he said. “Will we make mistakes going forward? Very likely, but not because we hadn’t considered the risks. When I look at our company today, we have learned a lot about how you support our customers, how you manage the risk you are taking, and most importantly about being relevant to the customers where their needs align with core capabilities. We know who we are, where our core competencies are and are excited for a future going on offense with those capabilities.” In the final installment in this series, we will examine the future of GF and how its differentiated portfolio will enable its customers and change the industry that’s changing the world. About Author Dave Lammers Dave Lammers is a contributing writer for Solid State Technology and a contributing blogger for GF’s Foundry Files. Dave started writing about the semiconductor industry while working at the Associated Press Tokyo bureau in the early 1980s, a time of rapid growth for the industry. He joined E.E. Times in 1985, covering Japan, Korea, and Taiwan for the next 14 years while based in Tokyo. In 1998 Dave, his wife Mieko, and their four children moved to Austin to set up a Texas bureau for E.E. Times. A graduate of the University of Notre Dame, Dave received a master’s in journalism at the University of Missouri School of Journalism.
CSEM joins GLOBALFOUNDRIES’ FDXcelerator™ Program bringing ultra-low-Power IP to 22FDX® process September 24, 2019CSEM, a leader in low-power RFIC design and embedded systems, announced today at GLOBALFOUNDRIES (GF) annual Global Technology Conference (GTC) that CSEM is developing ultra-low power Bluetooth Low Energy® (BLE), CMOS radar mmWave IP and embedded machine-learning accelerators on GLOBALFOUNDRIES (GF) 22nm FD-SOI (22FDX®) platform.
Evaluation Boards Now Available for Flex Logix EFLX® 4K eFPGA on GLOBALFOUNDRIES’ Most Advanced FinFET Platform September 24, 2019Flex Logix Technologies, Inc., the leading supplier of embedded FPGA (eFPGA) IP and software, today announced that it has received working first silicon of its validation chip for the EFLX 4K eFPGA IP cores running on GLOBALFOUNDRIES (GF) 12nm Leading-Performance (12LP) FinFET platform and newly announced 12LP+ solution. The chip is currently in characterization and Flex Logix will be demonstrating the evaluation board at the GLOBALFOUNDRIES Technology Conference (GTC 2019) on Tuesday, September 24 in Santa Clara California.
格芯推出适合云端和边缘人工智能应用的12LP+ FinFET解决方案 September 24, 2019该创新解决方案基于格芯最先进的FinFET平台，具有一流的性能、能够满足不断变化的人工智能需求的多项全新重要特性、引人注目的经济效应和业界领先的Arm物理IP 加利福尼亚州圣克拉拉，2019年9月24日——作为先进的特殊工艺半导体代工厂，格芯(GlobalFoundries)今日在其全球技术大会上宣布推出12LP+，这是一种适合人工智能训练和推理应用的全新创新解决方案。12LP+为芯片设计者提供了性能、功耗和尺寸的一流组合，以及一系列新的重要特性、成熟的设计和产品生态系统、经济高效的开发和快速的上市时间，适合快速增长的云端和边缘人工智能应用。 格芯的新型12LP+基于格芯现有的12nm领先性能（12LP）平台，与基础12LP平台相比，性能提高20%或功耗降低了40%，而且逻辑区面积减少了15%。一个重要特性是具有高速、低功耗的0.5V SRAM位单元，用于支持处理器和存储器之间进行高速、节能的数据传输，对于计算和有线基础设施市场中的人工智能应用来说，这是一项重要要求。 12LP+还具有一些其他重要特性，使客户能够充分抓住人工智能市场上的机遇，其中包括面向人工智能应用的参考设计包以及设计/技术联合开发（DTCO）服务，这两者能够让客户全面地看待人工智能电路设计，从而实现低功耗并降低成本。另一个重要特性是包含用于2.5D封装的新中介层，这有助于实现高带宽存储器与处理器的集成，从而实现快速、节能的数据处理。 12LP+解决方案采用Arm® Artisan® 物理IP和ARM针对人工智能应用为格芯开发的POP™IP。Arm提供的这两种解决方案也将应用于格芯的12LP平台。 Arm物理设计部门总经理兼研究员Gus Yeung表示：“人工智能、汽车和高端消费电子移动等诸多快速增长的应用推动了市场对高性能SoC的迫切需求。凭借广泛采用的ARM Artisan物理IP和先进的处理器设计，格芯的12LP+可以帮助设计人员轻松、快速且经济高效地推出相关产品来把握这一需求从市场中获利。” 格芯数字技术解决方案副总裁Michael Mendicino表示：“格芯的战略是为客户提供差异化的解决方案，12LP+正是为此而推出的，与替代方案相比，该方案能够在不中断工作流程的情况下非常经济高效地拓展设计。例如，作为一种先进的12nm技术，我们的12LP+解决方案已经为客户提供了他们期望从7nm工艺中获得的大部分性能和功率优势，但他们的NRE（非重复性工程）成本平均只有一半左右，这大大节省了成本。此外，由于12nm节点技术使用时间更长，也更为成熟，因此客户能够快速地进行流片生产并充分利用对人工智能技术日益增长的需求。” 12LP+ PDK现已上市，并且格芯已经在与多个客户展开合作。从格芯的纽约马耳他8号晶圆厂获悉，预计2020年下半年将流片，2021年将量产。 关于格芯 格芯是全球领先的特殊工艺半导体代工厂，提供差异化、功能丰富的解决方案，赋能我们的客户为高增长的市场领域开发创新产品。格芯拥有广泛的工艺平台及特性，并提供独特的融合设计、开发和生产为一体的服务。格芯拥有遍布美洲、亚洲和欧洲的规模生产足迹，以其灵活性与应变力满足全球客户的动态需求。格芯为阿布扎比穆巴达拉投资公司(Mubadala Investment Company)所有。欲了解更多信息，请访问 https://www.globalfoundries.com/cn。
GLOBALFOUNDRIES’ GlobalFoundries Technology Conference 2019 in Silicon Valley to Spotlight Specialized Solutions for Emerging Markets September 24, 2019A rich program of talks, panels and partner exhibits will provide 700+ attendees with insights and networking opportunities in 5G, artificial intelligence, autonomous vehicles and other emerging areas Santa Clara, Calif., September 24, 2019 – At its annual Global Technology Conference (GTC) today, GLOBALFOUNDRIES (GF), the world’s leading specialty foundry, will feature its wide range of specialized application solutions for the industry’s fastest-growing market segments. More than 700 expected attendees will be able to gain insight into how GF is helping clients shape our world, from the solutions we create to enabling the products they deliver. GF’s CEO Tom Caulfield will kick-off the event with a keynote address on, ‘The Future of Innovation,’ which will explore how there are – and always have been – many different paths toward true innovation. Dr. Aart de Geus, Chairman and co-CEO of Synopsys will then take the stage to share how technology is changing the way we live and work, and how strategic partnerships are critical to helping clients innovate from silicon to software. The conference stage will feature GF executives who will share insights on how GF’s multiple technology platforms plus a host of specialized features and turnkey services from GF and its ecosystem partners lead to unique, innovative solutions. Speakers include: ‘High-Growth Markets Enabled by Specialized GF Solutions,’ by Dr. Bami Bastani, Sr. VP and GM of Mobile and Wireless Infrastructure SBU ‘Si Technology Innovation in the Era of Specific Application Solutions,’ by Gregg Bartlett, Sr. VP of Global Engineering and Technology ‘The Journey to a Differentiated Ecosystem,” by Mike Cadigan, Sr. VP of Customer Design Enablement In the afternoon, talks and panel discussions with industry leaders including executives from Lightmatter, Marvell, NXP and VeriSilicon along with members of GF’s management and technical teams will detail the specific needs and opportunities in emerging market segments. In addition, these presentations will showcase how GF’s platforms and application solutions are enabling three targeted market segment groups, automotive, industrial and multi-market (AIM); mobile and wireless infrastructure (MWI); and computing and wired infrastructure (CWI). Attendees will experience a full day of tech that will feature more than 35 event sponsors and GF ecosystem partners, giving attendees the opportunity to learn about their offerings. Platinum sponsors for GTC 2019 are Analog Bits, Cadence Design Systems, Mentor and Synopsys. Gold sponsors are Arm, Dolphin Integration and Flex Logix™. About GTC GLOBALFOUNDRIES’ annual Global Technology Conference features keynotes from industry leaders and presentations from senior members of the GF management and technical teams, with a special emphasis on how the company achieves time-to-volume leadership by leveraging global collaboration with clients and partners. GTC 2019 began Tuesday, September 24 in the heart of California’s Silicon Valley, kicking off a series of GTC 2019 events at strategic international venues including Munich, Singapore and Taiwan. For more information on GTC 2019, visit: https://www.globalfoundries.com/. About GF GLOBALFOUNDRIES (GF) is the world’s leading specialty foundry. We deliver differentiated feature-rich solutions that enable our clients to develop innovative products for high-growth market segments. GF provides a broad range of platforms and features with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF has the flexibility and agility to meet the dynamic needs of clients across the globe. GF is owned by Mubadala Investment Company. For more information, visit globalfoundries.com. Contact: Erica McGillGLOBALFOUNDRIES(518) 795-5240[email protected]
GLOBALFOUNDRIES Introduces 12LP+ FinFET Solution for Cloud and Edge AI Applications September 24, 2019Innovative solution based on GF’s most advanced FinFET platform offers best-in-class performance, key new features to address evolving AI requirements, compelling economics and industry-leading physical IP from Arm Santa Clara, Calif., September 24, 2019 – GLOBALFOUNDRIES (GF), the world’s leading specialty foundry, announced today at its Global Technology Conference the availability of 12LP+, an innovative new solution for AI training and inference applications. 12LP+ offers chip designers a best-in-class combination of performance, power and area, along with a set of key new features, a mature design and production ecosystem, cost-efficient development and fast time-to-market for high-growth cloud and edge AI applications. Derived from GF’s existing 12nm Leading Performance (12LP) platform, GF’s new 12LP+ provides either a 20% increase in performance or a 40% reduction in power requirements over the base 12LP platform, plus a 15% improvement in logic area scaling. A key feature is a high-speed, low-power 0.5V SRAM bit cell that supports the fast, power-efficient shuttling of data between processors and memory, an important requirement for AI applications in the computing and wired infrastructure markets. Other key features of 12LP+ that enable clients to capitalize on AI market opportunities are a design reference package for AI applications and design/technology co-development (DTCO) services, both of which allow clients to look at AI circuit designs from a holistic perspective in order to achieve lower power budgets and reduced costs. Another key feature is a new interposer for 2.5D packages, which facilitates the integration of high-bandwidth memory with processors for fast, power-efficient data processing. The 12LP+ solution makes use of Arm® Artisan® physical IP as well as POP™ IP for AI applications, developed for GF by Arm. Both solutions from Arm will also be applied to GF’s original 12LP platform. “AI, automotive and high-end consumer mobility are just a few of the growing applications creating urgent demand for high-performance SoCs,” said Gus Yeung, general manager and fellow, Physical Design Group, Arm. “Supported by the widely-used Arm Artisan physical IP and advanced processor designs, GLOBALFOUNDRIES’ 12LP+ will help designers deliver products that monetize this demand easily, quickly and cost-effectively.” “The rollout of 12LP+ is a result of GF’s strategy to provide clients with differentiated solutions that extend the ability to scale designs with no disruption to work flows very cost-efficiently compared to alternatives,” said Michael Mendicino, vice president of Digital Technology Solutions at GF. “For example, as an advanced 12nm technology, our 12LP+ solution already offers clients a majority of the performance and power advantages they would expect to gain from a 7nm process, but their NRE (non-recurring engineering) costs will average only about half as much, a significant savings. Additionally, because the 12nm node has been running longer and is much more mature, clients will be able to tape-out quickly and take advantage of the growing demand for AI technology.” The 12LP+ PDK is available now and GF is already working with several clients. Tape outs are expected in the second half of 2020 and volume production is set for 2021 from GF’s Fab 8 in Malta, New York. About GF GLOBALFOUNDRIES (GF) is the world’s leading specialty foundry. We deliver differentiated feature-rich solutions that enable our clients to develop innovative products for high-growth market segments. GF provides a broad range of platforms and features with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF has the flexibility and agility to meet the dynamic needs of clients across the globe. GF is owned by Mubadala Investment Company. For more information, visit globalfoundries.com. Contact: Erica McGillGLOBALFOUNDRIES(518) 795-5240[email protected]
Analog Bits and Aragio Solutions Team Up with GLOBALFOUNDRIES to Deliver Automotive IP Solutions September 24, 2019IP providers further strengthen ability to serve clients’ automotive IP needs on GLOBALFOUNDRIES’ 22FDX® platform Santa Clara, Calif., September 24, 2019 – GLOBALFOUNDRIES (GF), Analog Bits and Aragio Solutions (Aragio) announced today at GF’s annual Global Technology Conference (GTC) that they are collaborating to develop a portfolio of I/O libraries on GF’s 22nm FD-SOI (22FDX®) platform. The portfolio is designed to maximize energy efficiency and reliability while creating differentiated IP solutions that meet the varying standards of automotive applications. This latest collaboration extends GF’s ecosystem of suppliers for its 22FDX platform, with Synopsys being the first IP partner to announce development of its automotive-grade DesignWare® IP on this process. Analog Bits and Aragio will develop a portfolio of automotive Foundation, Analog and Interface IP for GF’s 22FDX process. The addition of Aragio’s silicon-proven low-leakage libraries and Analog Bits’ programmable interconnect solutions on GF’s 22FDX, is expected to further reduce design effort and accelerate AEC-Q100 qualification of system-on-chips (SoCs) for automotive applications such as advanced driver assistance systems (ADAS) and infotainment. “Analog Bits’ industry-leading PLL and sensor technology, in combination with sophisticated circuit techniques and innovative I/O design, provide area- and power-efficient IP solutions that customers can easily integrate into their SoC designs,” said Mahesh Tirupattur, executive vice president at Analog Bits. “Our close collaboration with GF gives us the opportunity to help our mutual customers deliver a unique low-power capability with the best possible PPA for demanding applications such automotive.” “GF’s advanced 22FDX platform gives our IP circuit designers the flexibility to be creative as they push for state-of-the-art performance in terms of speed, power, low-leakage, functionality and I/O size,” said Glen Haas, Aragio Solutions’ Chief Technologist. “GF provides a range of solutions that enable Aragio to address the full complement of world-wide market segments from Automotive G1 and G2 to battery-powered IoT applications. The flexible reverse body bias gives our designers another tool to use to provide unique solutions to our clients.” “Customers are expanding their product portfolios and are looking for connectivity solutions to match the evolving needs of power-sensitive applications in rapid-growth markets,” said Mark Ireland, vice president of Ecosystem Partnerships at GF. “Our collaboration with Synopsys, Analog Bits and Aragio will help us to deliver a strong IP portfolio of differentiated power, performance and reliability designs while shortening our clients’ time-to-market for automotive SoCs on 22FDX.” GF’s 22FDX provides a fast path-to-product solution that includes silicon-qualified IP. The platform is in volume production on GF’s 300mm line at Fab 1 in Dresden, Germany. Design kits with these additional features will be available on GF’s 22FDX starting Q4 2019. For more information on GF’s automotive solutions go to globalfoundries.com. About Analog Bits Founded in 1995, Analog Bits, Inc. is a leading supplier of mixed-signal IP with a reputation for easy and reliable integration into advanced SOCs. Our products include precision clocking macros such as PLLs, Sensors, programmable interconnect solutions such as multi-protocol SERDES and programmable I/O’s as well as specialized memories such as high-speed SRAMs and TCAMs. With billions of IP cores fabricated in customer silicon, from 0.35- micron to 7nm processes, Analog Bits has an outstanding heritage of “first-time-working” with foundries and IDMs. About Aragio Solutions Aragio is an industry leading provider of I/O library solutions focused on robust ESD and LU immunity. Our I/O library solutions enable dependable high-performance operation. We provide uniform I/O pad sets for a wide range of CMOS process technologies and applications, and our I/O library solutions feature unique macro cell designs as well as general-purpose and specialty I/O libraries. Aragio Solutions is the registered tradename of Solid Silicon Technology, LLC. To learn more about the company, please visit: www.aragio.com About GF GLOBALFOUNDRIES (GF) is the world’s leading specialty foundry. We deliver differentiated feature-rich solutions that enable our clients to develop innovative products for high-growth market segments. GF provides a broad range of platforms and features with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF has the flexibility and agility to meet the dynamic needs of clients across the globe. GF is owned by Mubadala Investment Company. For more information, visit globalfoundries.com. Contact: Erica McGillGLOBALFOUNDRIES(518) 795-5240[email protected]
