Executive Perspective: 22FDX: Ramping New Silicon in Old Saxony April 6, 2017 Our 300mm Fab 1 is in Dresden, in the region of Germany known as Saxony, or sometimes Old Saxony. It is quite a beautiful and tranquil area but don’t be fooled. Years ago Saxony was Germany’s leading industrial area, and more recently it is again achieving industrial prominence. GLOBALFOUNDRIES is one of the reasons why. Dresden is where we are ramping 22FDX®, our 22nm FD-SOI process, into volume production this year. 22FDX gives customers an exceptional balance of performance, power consumption and cost, making it ideal for mobile, automotive and IoT applications. I’ve been managing Fab 1 in Dresden since 2011 and the differences from then to now can hardly be overstated. When I got here our production capabilities, technical resources and mode of operation didn’t match our ambition. Today, Fab 1 is quite simply one of the best fabs in the entire world, and we have a superb staff of technical people, managers and operating personnel who are aligned on achieving world-class operational metrics and customer satisfaction. GLOBALFOUNDRIES, Fab 1, in Dresden is Europe’s Largest 300mm Factory This evolution has been driven by investment, by more efficient use of technology and by great execution. We have invested more than $12 billion in Fab 1 to date, giving us the capacity to ship 60,000 wafers per month. This quarter, Dresden shipped its one millionth wafer to a top-tier mobile customer. That is an outstanding achievement. Overall, we have shipped 2.8 million wafers from Fab 1 since 2010, the majority of which were fabricated with our advanced HKMG technology. We’ve been offering that technology longer than any other pure-play foundry. We are currently making further investments to grow production capacity by another 40% by 2020. Much of this investment is to support volume production of 22FDX, along with the next-generation 12FDX™ technology now under development. Customer tape-outs from the 12FDX process are expected by the end of 2018. Our efficient use of technology is a great advantage when it comes to volume FDX™ production. More than 70% of the FDX process steps are copied from our already well-established 28nm HKMG process flow, making it easier, faster and less risky to achieve commercial production. Being a foundry, we understand that we have one more key item on our daily agenda (besides shipping wafers on time and in spec, as well as developing tomorrow’s technologies): enhance productivity while reducing cost. That is now part of our site DNA, and I am proud that in a site-wide effort we were able to take out $100 million (USD) cost in 2016 alone. GLOBALFOUNDRIES: Clean room techs walk the bridge in Fab 1 With regard to execution, over the last five years we have placed a great focus on establishing the necessary systems, business processes and mindset to complement our state-of-the-art manufacturing plant. We have learned how to better control risk and costs while making process changes, which is critical to managing the ever-increasing complexity that comes with more customers, more products, and new processes such as FDX. It’s been an exciting journey, and the best is yet to come.
高层视角:22FDX®在德国萨克森州创造新型硅 April 6, 2017 作者: Dr. Rutger Wijburg April 6, 2017 类别: 半导体 我们在德累斯顿的300毫米1号晶圆厂位于德国的萨克森州,它通常被称为老萨克森。这是一个美丽而安静的地方,但是,多年前,多年前萨克森是德国的领先工业区。而最近它正再次被称为行业的热门地区,格芯正是这个现象背后的原因之一。 德累斯顿是我们今年将 22FDX®,即我们的 22纳米FD-SOI制程 转入批量生产。22FDX给客户带来性能、功耗和成本之间的卓越平衡,使它成为为移动、汽车和物联网应用的理想选择。 从2011年开始,我一直管理着德累斯顿的1号晶圆厂,着几年我们取得了长足的进步。当我刚来这里的时候,晶圆厂的产能、技术资源和运营模式都无法和我们的期望所匹配。如今,1号晶圆厂就是世界上最好的晶圆厂。我们拥有出色的技术人才、管理团队和运营控制者,我们齐心协力达成世界级的运营优势,满足客户的需求。 累斯顿的格芯 1号晶圆厂,欧洲最大的300毫米工厂 进化来自于投资,更高效的科技,以及卓越的执行力。至今,我们已经为1号晶圆厂投入了超过120亿美金,让我们拥有了每月生产60,000片晶圆的产能。在这个季度,德累斯顿为顶尖的移动客户提供了它生产的第100万片晶圆,这是无与伦比的成就。总体来说,自2010年以来我们已为顾客提供了280万片晶圆,其中一大部分是使用我们的HKMG技术制造的。我们提供该技术的时间,比任何一家纯晶圆制造商都长。 我们现在正进一步进行投资,以期望在2020年前提高40%的产能。投资的一大部分将用于22FDX®的生产,配以正在开发的下一代12FDX™技术。客户在12FDX™制程上的首批产品将会在2018年末完成。 我们对于技术的高效运用使我们在批量FDX™生产上具有巨大优势。超过70%的制程步骤都来自于我们成熟的28纳米HKMG制造流程,这会更容易、更快且低风险的进行商业化量产。 作为一家晶圆厂,除了准时精确的交付晶圆产品,并开发新的技术以外,我们明白我们还有一项重要的任务:那就是增加产量和降低成本。而这已经融入到我们晶圆厂的基因里了,在2016年,我们在全厂范围内节省了1亿美金的成本,对此我倍感骄傲。 格芯:无尘室技术人员走过1号晶圆厂的通道 对于管理角度来看,在过去5年中,我们对建立必要的系统、商业流程和思维模式投入了大量的精力,以此来匹配我们最先进的制造能力。我们学会了如何在改进制程的同时,更好地控制风险和成本。这对管理一个组织是特别重要的,特别是当着个组织变得越来越复杂,拥有越来越多的客户和产品,并运用了新的诸如FD的新制程。 这是一段激动人心的过程,而最美好的部分还在前方。
FD-SOI Rises to the Challenge March 29, 2017In recent days, we have seen the world’s two largest chip manufacturers announce new low-power 22nm process technologies. We are pleased to see other manufacturers following our technology solution lead. Almost two years ago, we launched our 22FDX technology for wireless, battery-powered intelligent systems. While others have been focused only on squeezing more digital performance out of the bleeding edge, we at GF have been focusing on system-level metrics with 22FDX. The 22nm node is now becoming one of the biggest battlegrounds in semiconductors, which demonstrates the unprecedented innovation that is taking place at advanced nodes that are one or two steps off of the leading edge. We chose FD-SOI over bulk planar or FinFET because it offers the best combination of performance, power and area for these applications. 22FDX is unmatched by any competing 22nm technology in several areas: The lowest operating voltage (0.4 volt) The most cost-effective CPP and MX scaling The lowest mask count The best RF performance The only technology to offer software-controlled transistor body-biasing And while others are announcing their offerings now, 22FDX is fully qualified for production at our Fab 1 facility in Dresden, Germany. We are seeing strong customer demand, with more than 50 active engagements in high-growth areas such as mobile, IoT, and automotive. Not only are we delivering 22FDX now, but we are investing for the future. In September of last year, we introduced an extension to our FDX roadmap with our next generation, the 12FDX platform, which is the only technology to provide the design flexibility and cost of a planar process down to 12nm, and yet offer 10nm FinFET-level performance. We expect others to follow our 12FDX lead! We are also making significant capacity investments. In Germany, we are building up 22FDX capacity, with plans to grow the overall fab capacity by 40 percent by 2020. And in China, we recently announced a partnership to build a 300mm fab in Chengdu to support the growth of the Chinese semiconductor market and to meet accelerating global customer demand for 22FDX. Last but not least, a robust design and IP ecosystem is coalescing around FDX. We recently launched our FDXcelerator™ Partner Program, which is designed to reduce time-to-market for customers and facilitate faster migration to FD-SOI from bulk nodes such as 40nm and 28nm. More than 20 partners have joined the ecosystem since its launch only six months ago. Clearly excitement about FDX is rising and the competition is heating up. FD-SOI has long been considered the “technology of the future,” but now all of the puzzle pieces are coming together to make the promise of FD-SOI a reality TODAY. About Author Alain Mutricy Alain Mutricy is the SVP, Product Management Group, at GLOBALFOUNDRIES. Assuming the role in 2016, he is responsible for leading the Product Management, Program Management, Strategic Marketing and Design Enablement organizations. Alain is an accomplished senior executive with more than 25 years of experience in general business management and complex technology product line management in the consumer electronics, mobile, and semiconductor industries. Prior to his current role, Alain served as Founder-Consultant, Executive Adviser, for AxINNOVACTION, a company that promotes action to unlock and accelerate innovation in big organizations and proposes a customized strategy framework to develop new products. Alain has also held the roles of Co-Founder and CEO, at Vuezr, Inc.; Senior Vice President, Portfolio and Product Management, and Senior Vice President, Motorola Handsets Platform Technology, at Motorola Mobile Devices; and Vice President at Texas Instruments, leading the cellular chipsets and OMAP organizations. Alain holds an MBA, Cum Laude, from the HEC Group in Paris, France, and a Masters Degree in Mechanical and Electrical Engineering from A&M Paris-Tech. Alain is also a founding member of the MIPI alliance, an early Director of Open Mobile Alliance, and was Board member of UIQ AB.
FD-SOI迎接挑战 March 29, 2017 作者: Alain Mutricy March 29, 2017 类别: 市场 近期,我们看到世界最大的两个芯片制造商公布了新的低功率22纳米制程技术。我们很高兴地看到其他制造商跟随我们在技术方案上的步伐。2年前,我们针对无线和电池供电的智能系统启动了22FDX®技术。 当其他人都只关注于努力压榨更多的数字性能,我们格芯已经把重点转移到22FDX®系统级别的优势上了。现在22纳米节点已成为半导体行业里最大的战场之一,展现出了先进节点上前所未有的创新,比现今的现今科技更为领先。 我们选择FD-SOI而不是传统平面或FinFET,因为它为应用提供了在性能、功率和面积之间的最佳组合。22FDX®在几个领域内都是无可比拟的: 最低的操作电压(0.4伏) 最高性价比的CPP和MX尺寸调整 最少掩膜数量 最佳射频性能 唯一提供软件控制体偏置功能的技术 当其他制造商刚刚发布他们的计划时,我们的22FDX®在德国德累斯顿已经完全通过生产验证。我们看到了来自客户的大量需求,截止目前就已经有超过50笔订单,遍及各个快速增长领域,如移动、物联网和汽车自动化市场。 我们不单只在现在提供22FDX®,我们还在为未来投资。去年九月,我们介绍了FDX规划路线图上新的延伸:12FDX®平台。该技术是唯一提供了设计灵活性和将平面制程成本降低的12纳米技术,同时提供了10nm FinFET的性能。我们期待更多制造商在这个领域能跟随这个趋势。 同时,我们也在做出大量的产能投资。在德国,我们正在增加22FDX®产能,预计在2020年前增加40%的产能。在中国,我们最近公布了在成都设立300毫米晶圆厂的合作计划,以此来支持中国的半导体市场增长,并满足国际市场对22FDX®的需求。 最后,强大的设计和IP生态系统围绕着FDX®迅速汇集。我们最近启动了我们的 FDXcelerator™ 合作项目。该项目设计为减少客户产品进入市场时间,并实现从传统40纳米和28纳米节点向FD-SOI的技术转移。其发布后的这6个月,已经有超过20位合作伙伴加入了这个生态系统 很明显,关于FDX的热潮正在不断攀升,竞争也逐渐激烈。长期以来,FD-SOI被看作是“未来的技术”。但是就在今天,我们已经具备了所有的条件,关于FD-SOI的承诺正在得以实现。
ATTOPSEMI加入了FDXcelerator计划来提供高级非易失性存储器IP给格芯的22FDX®技术平台 March 27, 2017SANTA CLARA, CA–(Marketwired – March 27, 2017) – ATTOPSEMI Technology, Ltd. today announced that it has joined GLOBALFOUNDRIES’ FDXcelerator™ Partner Program, to provide a scalable, non-volatile one-time programmable (OTP) memory IP to be compatible with GF’s 22FDX® technology. ATTOPSEMI’s leading-edge I-fuse™ OTP IP offers increased reliability, smaller cell size, low programming voltage/current, and high data security enabling customers and designers the ability to utilize an advanced OTP for harsh applications such as automotive, 3D IC, and IoT applications.
ATTOPSEMI Technology Joins FDXcelerator Program to Deliver Advanced Non-Volatile Memory IP to GLOBALFOUNDRIES 22FDX® Technology Platform March 27, 2017Leading-edge I-fuse™ brings higher reliability, smaller cell size and ease of programmability for consumer, automotive, and IoT applications.
与格芯公司市场营销与沟通部新任总裁John Volkmann深入交流 March 27, 2017我们与格芯企业营销与沟通部的新任副总裁John Volkmann一起,了解更多关于营销人员背后的故事,包括他早年的职业生涯,作为技术营销人员的不断变化的角色,以及他对新兴半导体趋势的见解。 能不能聊一聊你自己,告诉我们你是如何来格芯工作的? 我在硅谷的事业始于1990年,也就是在互联网诞生之时。我刚刚离开加利福尼亚州的莫德斯托的加州葡萄酒公司(Monto Wine)的品牌管理工作,这是我离开商学院之后的第一份工作。但是,我希望通过搬到硅谷来继续我在工程领域的事业。 我当时加入了Cunningham Communication公司,这是当时硅谷最大的科技公关公司。我后来进入了Brand Momentum 集团,该公司旨在为硅谷快速发展的科技领军企业提供品牌和定位服务。我为摩托罗拉半导体公司为做了大量的工作,该公司将我带进了半导体行业,后来我在这个行业里越走越远,也进入AMD和格芯这样的优秀企业。 十年之后,我应邀加入了AMD并带领企业营销和沟通团队。 在AMD我获得了广泛的经验,包括收购ATI Technologies,向Mubadala公司出售格芯公司,以及针对英特尔的全球反垄断诉讼。在我加入AMD的时候,我计划在那里工作2-3年,后来却在那里该服务了接近10年。在2012年初,我离开了AMD,并和合作伙伴一起在硅谷共同创立了一家营销咨询公司SeriesC(现为名为 Cunningham Collective)。后来,我被我们的客户QD Vision(一家位于波士顿附近的小型纳米材料公司)聘请为首席营销官CMO。 去年夏天,QD Vision 被三星收购,所以我开始寻找新的发展机会。格芯市场部的职位引起了我的注意,所以我和我在AMD的老朋友John Docherty联系了一下,想看看这个机会是否适合我。一个月后,我正式加入了格芯的这个团队。 这个职位有什么吸引你的地方?更重要的是,是什么吸引来到了格芯?GF? 我认为格芯是一家具有很大潜力的行业领导公司。整个晶圆制造行业的业务相对比较稳定,而在这个行业里有一个一家独大且有一点“自满”的行业领头羊,获得了过多的市场占有率。这是一个巨大的不断发展中的行业,我认为格芯是唯一能够抓住机遇并且改变这个行业的公司。这个行业的客户并不喜欢供应商拥有过多的力量,我认为在未来几年内格芯可以获得更有意义的市场份额。 作为格芯公司负责营销和沟通的副总裁,您对公司负有什么样的责任?您过去的经历将如何帮助您塑造您的行业愿景并达成格芯的目标? 这个职位非常像我五年离开AMD所担任的职位,我在AMD已经工作了9年多的时间。我有一个小而高效率且拥有高度积极性的团队,公司对这个团队有抱有很多的期望。我觉得我们有独特的任务,那便是帮助公司将我们的“故事”从强大的个人部分的集合,转变为一个有凝聚力的行业领导者的故事。而我当我加入公司的时候,我们的团队也将会拥有能力来强化公司的品牌和形象,从而重塑外界对于公司的期待。 过去这些年,您是如何看待技术营销人员这个角色的变化的? 工作职责是一致的:那就是通过相关的差异化建立和发展领导力。但是在过去五年里,环境已经彻底的改变了。例如,科技的普及使每个人的生活更加透明。对于领导人来说,没有什么所谓的“避难所”,你的一切都始终暴露在公众视野中。同样的科技也颠覆大众传媒的业务模式。“传达信息”的概念要比以前复杂得多。连贯且易于记忆的“叙事和表达”方式显得至关重要。理解搜索引擎的运行方式也显得同样重要。最后,今天的“数字居民”一代更倾向于视觉多媒体(比如Snapchat,脸书视频,YouTube)。我们需要不断地将我们的工作从书面文字转换成图像和视频。 从技术的角度来看,半导体行业最大的增长机遇和挑战是什么?您计划如何利用这些机遇和挑战来提升作为行业领导者的格芯? 技术行业就像是一辆过山车。每当我认为事情应该放缓时,一些巨大的基础性的变化趋势就出现了(例如互联网,智能手机,社交媒体和云计算的出现),这些趋势使半导体内容的需求以惊人的速度增长。今天的例子是物联网,增强现实(AR),虚拟现实(VR),以及自动驾驶汽车。在这样新兴领域占有资源的人将在至少未来十年成为行业的领导者。这是格芯的机会—不要从今天的市场中去分享市场份额,而是去赢得超越目前市场份额的新兴领域去赢得更多机会。我认为我们和其他任何的行业领导者一样优秀,且比大部分好。 John Volkmann2017年3月被聘为格芯市场沟通部的副总裁。在这一职位上,他将领导,发展和执行公司在全球范围内的战略沟通和品牌管理。在工作之余,John与妻子丹尼斯和三个孩子非常享受拥有葡萄酒和高尔夫的美好时光。
Automotive Rising! GLOBALFOUNDRIES’ 22FDX® (FD-SOI) Accelerates March 14, 2017By: Rajeev Rajan There’s no doubt about it, the ‘best of tech’ was on display at this year’s Mobile World Congress, where top manufacturers gathered in Barcelona, Spain to showcase their latest products. Considered the Mobile event, the showroom floor was flooded with the world’s coolest gadgets and devices, some far from being in (mobile) phone form-factor. Thanks to increasingly advanced chipsets and emerging 5G technologies, which are set to open a new era of connectivity, compelling new technologies are being showcased – from wearables, to VR cameras, to autonomous cars – at major tech events such as CES and MWC. Among the new tech, were products for the connected car – not something you’d typically see at this venue, but some of the biggest players in mobile are now taking interest in the connected car space, and showcasing a connected car product right alongside its new flagship smartphone. And, the brains behind the devices in these ‘smart’ cars are semiconductors. Semiconductors are rising in auto-tech and carmakers are increasingly trying to find ways to integrate consumer electronics functions such as Advanced Driver Assistance Systems, or ADAS, applications and driver-assistance technologies into their vehicles. Capabilities such as vision processing, cameras, sensors, connectivity, and mapping take ADAS and autonomous driving to a new level. A case in point, Dream Chip Technologies announcement of the industry`s first 22nm FD-SOI silicon for a new ADAS System-on-Chip (SoC) for automotive computer vision applications during MWC Barcelona. Now, ADAS SoCs have been around for more than 5 years. So what’s the big deal, you wonder? Dream Chip’s multi-processor SoC solution – developed under the European THINGS2DO project in coordination with ARM, Cadence, INVECAS, Arteris, and GF – is the industry’s first SoC designed on GF’s 22FDX® (FD-SOI) process technology. And, this is important if you’re a designer trying to figure out how to reduce complexity while watching your bottom line at the same time. As a complementary path to FinFETs, GF’s 22FDX transistors exhibit Superior RF/Analog – and a high fT and Fmax (350/325GHz), making it an ideal technology for low-power 5G and mmWave applications. Also, the technology platform’s back-biasing capability plays a role in controlling power by raising the threshold voltage and reducing leakage where appropriate, making it a power-efficient fit for wireless, battery-powered computing applications. And, what about cost? With 22nm design rules, single patterning is sufficient, eliminating double patterning and providing a cost-competitive product. Beyond the design process, there are other ‘bells and whistles’ the optimized SoC provides such as video input and output interfaces as well as common communication interfaces on two board-to-board headers. And, some of the key ADAS processing use-cases that can be realized with such an SoC include 360 degree top view, road-sign recognition, lane departure warning, driver distraction warning, blind spot detection, surround vision, flicker mitigation for digital mirroring, pedestrian detection, cruise control and emergency braking. Dream Chip Image Warping Demo (Vehicle: 4 cameras mounted on model car) In addition, Dream Chip’s SoC design incorporates multiple IPs such as foundation IPs, LPDDR4, PLL, Thermal Sensor and Process Monitor, from INVECAS as well as two LPDDR4 3200 high bandwidth memory interfaces. Dream Chip’s ADAS SoC, with GF’s 22FDX process tech, is a prime example of the brain power behind the ‘rise’ of semiconductor technologies that are fueling the growth of automotive and other global markets. These semiconductor devices are elevating consumer experiences that demand simpler, smaller, faster and increasingly lower cost end products. GF technologies, products, and solutions are differentiating key applications in these end spaces. If you missed the buzz of the Dream Chip automotive SoC at Mobile World Congress, we invite you to contact a GF sales representative or visit Dream Chip’s web site at: www.dreamchip.de to learn more. About Author Rajeev Rajan Rajeev Rajan is the Vice President of Internet of Things (IoT) at GLOBALFOUNDRIES. He is responsible for driving thought leadership and awareness of GF’s IoT solutions, which revolves around supporting go-to-market plans across the IoT portfolio as well as providing strategic direction and new market opportunities. Prior to joining GF, Rajeev was Sr. Director, Product Management and Marketing at Qualcomm Life Inc, where he led the product management and strategy for the company’s IoT/IoE and Healthcare and Life Sciences. Rajeev has also held positions of Co-Founder and CTO of 2net™, a Digital Health start-up, which has become the multi-million dollar Qualcomm healthcare company. He has held multiple technology, product, and business strategy roles at Qualcomm. He holds more than 40+ patents and is a co-author of the book Wireless Health: Remaking of Medicine by Pervasive Technologies. He currently serves as an Industrial Advisory Board Member of the Advanced Platform Technology (APT) Center, United States Department of Veterans Affairs (VA). Rajeev holds a BS in Physics from St. Xavier’s College and a MS in Computer Science from Sardar Patel University, in Gujarat, India. He received his Executive MBA from the Rady School of Management at the University of California San Diego, CA and a MS in Biomedical Engineering from Case Western Reserve University in Cleveland, Ohio.
汽车自动化的崛起,格芯22FDX®(FD-SOI)正在加速 March 14, 2017作者: Rajeev Rajan 毫无疑问, “最佳技术”正在今年的世界移动通信大会上展示,世界移动通信大会 在西班牙巴塞罗那吸引了顶尖的制造商前来展示各自的最新产品。这届的移动展会被世界上最酷的插件和设备(有的甚至与移动手机没有太大的关系)将展会完全淹没。得益于愈发先进的芯片组与注定会开启连接性新纪元的5G技术崛起,势不可挡的新技术正不断被展示出来—可穿戴设备、VR相机、无人汽车,纷纷在诸如CES 和MWC等各大活动上展出。 在新科技当中,出现了汽车连接性产品—这并非通常大家在展会上能看到的。一些移动业务的大企业现正表现出对车内连接空间的极大兴趣,在各自的新手机产品推出之时就并展示自己的车内连接产品。而此类智能汽车背后的主脑则为半导体。半导体正不断进军汽车科技业,而汽车制造商正更加努力的寻找能够集成更多消费者电子功能的方法,如:植入高级辅助驾驶系统(ADAS),应用和驾驶者辅助技术。视野图像处理、摄像头、探测器、连接仪器、拓录仪器等等高级技术将ADAS和无人驾驶带入了一个全新的境界。 在巴塞罗那的MWC活动中,Dream Chip Technology公布了公布了 业内第一款为汽车电脑成像应用的全新ADAS片上系统而设计的22纳米FD-SOI芯片,正是上述观点最合适不过的例子了。 至此,ADAS SoC已经存在长达5年。到底它有何特点?Dream Chip的多处理器SoC方案在欧洲THINGS2DO 项目下得到开发,该项目与ARM、Cadence、INVECAS、Arteris和格芯合作,此方案为业内首创在格芯22FDX® (FD-SOI)制程技术上设计的SoC。如果您正努力满足设计要求,同时又正考虑降低设计复杂性,那么此方案对您尤为重要。 作为FinFET技术的补充方案,格芯22FDX® 晶体管展现了高级射频/模拟能力 — 高fT和Fmax(350/325GHz),是其成为低功率5G和毫米波应用的理想技术。同时,本技术平台的基极偏置能力具备通过提升阈值电压来控制供电减少漏电的功能,使其成为无线和电池供电类应用的低功耗选择。 优化的SoC还提供了设计流程以外的额外功能,例如视频输入输出接口和板与板之间的公用沟通集管接口。一些关键的ADAS处理使用案例皆可在以下方面得以实现:360度鸟瞰视角、路标识别、行车道偏离警告、驾驶员干扰警告、盲点探测、全视野、数字镜像闪变噪音减少、行人探测、巡航控制和紧急刹车。 Dream Chip图像扭曲演示(车辆工具:4台摄像器固定于模型车上) 此外,Dream Chip的SoC设计集合了多个IP,例如基础IP、LPDDR4、PLL、热探测仪和流程监视器,他们来自INVECAS以及2个LPDDR4 3200高带宽内存接口口。Dream Chip的ADAS SoC,配以格芯22FDX®制程技术,是推动汽车自动化和其他覆盖全球的市场的半导体行业核心智慧的体现。半导体设备正在提升用户的体验,同时满足对更简单、更小、更快、成本更低的追求。格芯的技术、产品和方案是在这些方面带来独特性的关键因素。 如果您错过了在MWC了解Dream Chip汽车SoC的机会,我们欢迎您联系格芯的销售代表或登录Dream Chip的网址: www.dreamchip.de
QuickLogic Releases Aurora Software for Evaluation of ArcticPro eFPGA IP March 13, 2017SUNNYVALE, CA — (Marketwired) — 03/13/17 — QuickLogic Corporation (NASDAQ: QUIK), a developer of ultra-low power programmable sensor processing, embedded FPGA IP, display bridge and programmable logic solutions, today announced that it has released its new Aurora software which enables SoC developers to evaluate the integration of embedded FPGA (eFPGA) IP into devices designed for different GLOBALFOUNDRIES process nodes.