Rambus Delivers High-Speed SerDes Interface Solutions on GLOBALFOUNDRIES FX-14™ ASIC Platform for Data Center and Enterprise October 13, 2017Rambus Inc. (NASDAQ: RMBS), a leading provider of semiconductor and IP products, today announced the availability of a suite of silicon-proven, high-speed SerDes solutions including 16G MPSL (multi-protocol serial link), 30G C2C (chip-to-chip) and 30G VSR (very short reach) PHYs developed for GLOBALFOUNDRIES high-performance FX-14™ ASIC platform.
GLOBALFOUNDRIES Introduces New Automotive Platform to Fuel Tomorrow’s Connected Car October 12, 2017AutoPro™ provides a full range of technologies and manufacturing services to help carmakers harness the power of silicon for a new era of ‘connected intelligence’ Santa Clara, Calif., October 12, 2017 — GLOBALFOUNDRIES today unveiled AutoPro™, a new platform designed to provide automotive customers a broad set of technology solutions and manufacturing services that minimize certification efforts and speed time-to-market. The company offers the industry’s broadest set of solutions for a full range of driving system applications, from informational Advanced Driver Assistance Systems (ADAS) to high-performance real-time processors for autonomous cars. Today, the automobile semiconductor market is approximately $35 billion, and is expected to grow to an estimated $54 billion by 2023. This is driven by a need for new technologies that promise to enhance the driving experience such as navigation, remote roadside assistance, and advanced systems that combine data from multiple sensors with high-performance processors that make control decisions. “As vehicles move rapidly toward greater autonomy, auto manufacturers and parts suppliers are designing new ICs,” said Gregg Bartlett, senior vice president of the CMOS Business Unit at GF. “GF’s diverse automotive platform combines a range of technologies and services that meet the complexity and requirements for applications that enable connected intelligence for the automotive industry.” Building on 10 years of automotive experience, the company’s AutoPro technology platform includes offerings in silicon germanium (SiGe), FD-SOI (FDX™), CMOS and advanced FinFET nodes, combined with a broad range of ASIC design services, packaging and IP. GF’s CMOS and RF solutions deliver an optimal combination of performance, integration and power efficiency for advanced sensors (radar, lidar, cameras), ADAS and autonomous processing (sensor fusion and AI compute) and body and powertrain control, with embedded eNVM technology for in-vehicle MCUs, as well as connectivity and infotainment systems. The company’s BCD and BCDLite® technologies provide high-voltage capabilities, with a path to supporting 48 volts that enable automotive power solutions for electric powertrain, Hybrid-electric (HEVs) and Internal Combustion Engine (ICE) vehicles. These automotive solutions are available now, with additional access to quality and service across GF’s manufacturing fabs in the U.S., Europe, and Asia. GF AutoPro solutions support the full range of AEC-Q100 quality grades from Grade 2 to Grade 0. AutoPro Service Package In addition to GF’s technology platform, the company has initiated its AutoPro Service Package designed to ensure technology readiness, operational excellence and a robust automotive-ready quality system to continually improve quality and reliability throughout the product life-cycle. GF’s Service Package builds on the company’s proven automotive quality and operational controls, providing customers access to the latest technologies which are designed to meet strict automotive quality requirements defined in the ISO, International Automotive Task Force (IATF), Automotive Electronics Council (AEC), and VDA (German) standards. GF is currently working with major OEM customers and suppliers to develop and produce chips of the optimum quality and reliability as required by the various automotive applications. Audi “Vorsprung is our promise. To deliver an unmatched mobility experience the need for strong semiconductor manufacturing partners is greater than ever. The GF Automotive portfolio and program, focused on providing innovative technologies and manufacturing capabilities combined with an automotive mindset, is important for the automotive industry. It is an essential program to deliver our next generation car electronics faster and reliable.”Berthold Hellenthal, Head of Audi Semiconductor Strategy, Progressive SemiConductor Program – PSCP Silicon Mobility “The automotive sector is rapidly evolving and innovative technology will be a critical component for paving the way for the autonomous, electrified and connected car. Our long standing relationship with GF, a global foundry with a roadmap committed to the future automotive market, helps enable our customers to have the highest quality, reliability and support for the manufacturing of our automotive products.”Bruno Paucard, CEO of Silicon Mobility u-blox “As a global leader in positioning technology, it’s important for u-blox to partner with innovative companies that deliver customized semiconductor solutions for our chipsets. We have a long-standing and close collaboration with GF, and we look forward to working together to support new applications such as autonomous cars, enhanced safety, and high-bandwidth secure wireless connectivity.”Thomas Seiler, CEO at u-blox ABOUT GF GLOBALFOUNDRIES is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GLOBALFOUNDRIES makes possible the technologies and systems that transform industries and give customers the power to shape their markets. GLOBALFOUNDRIES is owned by Mubadala Investment Company. For more information, visit https://www.globalfoundries.com. Contacts: Erica McGillGLOBALFOUNDRIES(518) 795-5240[email protected]
Rambus在面向数据中心和企业的格芯 FX-14™ASIC平台上推出高速SerDes接口解决方案 October 12, 2017Rambus Inc. (NASDAQ: RMBS), a leading provider of semiconductor and IP products, today announced the availability of a suite of silicon-proven, high-speed SerDes solutions including 16G MPSL (multi-…
Cadence宣布格芯22FDX™工艺技术的数字签名流程支持Body-Bias Interpolation October 12, 2017Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its digital and signoff flow, from synthesis to timing and power analysis, supports body-bias interpolation for the GLOBALFOUNDRIES 22FDX™ process technology.
ArterisIP Joins GLOBALFOUNDRIES FDXcelerator Partner Program October 10, 2017ArterisIP, the innovative supplier of silicon-proven commercial system-on-chip (SoC) interconnect IP, today announced it has joined the GLOBALFOUNDRIES FDXcelerator™ Partner Program.
ArterisIP 加入格芯FDXcelerator合作伙伴项目 October 10, 2017ArterisIP, the innovative supplier of silicon-proven commercial system-on-chip (SoC) interconnect IP, today announced it has joined the GLOBALFOUNDRIES FDXcelerator™ Partner Program.
sureCore Joins GLOBALFOUNDRIES FDXcelerator™ Partner Program October 9, 2017sureCore Ltd., the Low Power SRAM IP leader, today announced it has joined the GLOBALFOUNDRIES (GF) FDXcelerator™ Partner Program and will make both their best-in-class Low Power “PowerMiser” and Ultra Low Voltage “EverOn” SRAM offerings available on GF’s 22nm FD-SOI (22FDX®) process technology.
sureCore加入格芯FDXcelerator™合作伙伴项目 October 9, 2017sureCore Ltd., the Low Power SRAM IP leader, today announced it has joined the GLOBALFOUNDRIES (GF) FDXcelerator™ Partner Program and will make both their best-in-class Low Power “PowerMiser” and
GTC 2017 and the Future of Technology: Part 1 October 6, 2017By: Dave Lammers When I was flying west to attend the 2017 GLOBALFOUNDRIES Technology Conference, I couldn’t help but think of a trip 10 years earlier, to the 2007 SEMICON West. In the press room there, tech journalist Katherine Derbyshire showed off her brand-new iPhone, and several of us huddled around watching her double-tap, type on the screen, and perform feats of wizardry that were beyond those of us that had mere Blackberries. For several years now, we’ve all been thinking about the future of technology. Will people really turn over their wheels to ADAS cars? Will neural networks learn complex tasks? Will augmented reality become so adept that doctors can offer better diagnoses? And will these capabilities run over 5G wireless networks that run circles around today’s links? There were some answers at the 2017 GTC event in Santa Clara. Just as the 4G wireless rollout delivered users the fast access to the Web that propelled so many new mobile applications – think Uber and others – the still-developing 5G networks will be needed to provide the performance required to spur autonomous driving, cloud-based applications, smart cities, and a host of others. GF’s CEO, Sanjay Jha said, “5G is set to transform all industries, and our customers are already gearing up for the future.” The moniker “5G” will evolve over time, starting out with gigabit-capable versions of the 4G LTE standard and then offering fixed-point and mobile capabilities that go beyond the long-term extension (LTE) roadmap. Jha mentioned the ability to go from today’s megabits-per-second of sustained wireless bandwidth to gigabits-per-second rates, at sub-5 nanosecond latencies. To get there, GF will offer enhanced versions of its RF SOI, SiGe, and FDX technologies. And behind these networks will be new power solutions based on the BCD and BCD Lite offerings. Bami Bastani, senior vice president of the RF business unit, said the 5G networks will need to support two segments, one in the sub-6 GHz realm and a millimeter wave segment that operates at 28 GHz and higher. The 5G networks will include picocells in urban areas for point-to-point transfers, and, eventually, mobile networks with enough robustness to support tomorrow’s automobiles. As 5G networks grapple with millimeter waves, Bastani said “the level of integration increases, and the demands increase on linearity and robustness.” Cristiano Amon, executive vice president of Qualcomm, noted how whole new industries developed, based on the widespread Internet connectivity that the 4G networks supported over the last decade. “The digital economy came of age with the smartphone,” Amon said, and with future economics gains to come from 5G networks, companies such as Qualcomm are “investing heavily” in solving the design challenges that 5G represents. Amon predicted that 5G capabilities would “enter into the PC space, with no separation between the PC and the mobile space.” And he sees China playing a very important part of Qualcomm’s efforts: “There is so much excitement in China in mobile handsets and in advancing the industry to 5G. Partnering with China has been a very important part of Qualcomm’s success,” he said. Ten years from now, as technologists fly to the 2027 GTC event, is there anyone who seriously doubts they will be riding to the venue in ADAS-enabled cars, surfing the Web on 5G-enabled phones, and learning about the newest technologies on augmented-reality systems? All of these things will take time. And patience, by the way, was another noteworthy theme of GTC 2017. Foundries take time to develop, both in terms of technology and their ability to offer EDA tools and IP, to meet customer deadlines and ensure quality. GTC 2017 was in effect a statement that GF has matured into a reliable manufacturing partner. In 2017, as AMD’s chief technology officer and senior vice president Mark Papermaster said at the GTC event, AMD has seen great success with a newly designed lineup of processors and graphics solutions, created in a partnership with the 14nm FinFET technology ramped successfully at GF’s Malta, N.Y. fab. And executives from Skyworks and Qorvo also took the stage at GTC 2017 to say that they have succeeded by partnering with GF in the wireless space as well. Those success stories are good indicators that future successes are in store, for GF and for all of us. About Author Dave Lammers Dave Lammers is a contributing writer for Solid State Technology and a contributing blogger for GF’s Foundry Files. Dave started writing about the semiconductor industry while working at the Associated Press Tokyo bureau in the early 1980s, a time of rapid growth for the industry. He joined E.E. Times in 1985, covering Japan, Korea, and Taiwan for the next 14 years while based in Tokyo. In 1998 Dave, his wife Mieko, and their four children moved to Austin to set up a Texas bureau for E.E. Times. A graduate of the University of Notre Dame, Dave received a master’s in journalism at the University of Missouri School of Journalism.
New 8SW RF SOI Platform Leads the Industry October 2, 2017By: Shankaran Janardhanan The world’s first mainstream RF SOI foundry platform manufactured on 300mm wafers offers an unmatched combination of best-in-class performance, cost effectiveness and flexibility GF recently announced some exciting news for designers of RF front end modules. At our flagship annual technology conference, GTC, we unveiled a 300mm RF SOI platform for 4G LTE and sub-6 GHz mobile/wireless applications, which we are calling 8SW. It offers impressive technical specifications and gives our customers unbeatable economic and time-to-market advantages. But actually, those aren’t its only noteworthy features. What’s also noteworthy is the fact that it is a tangible result of something intangible by nature but vitally important nonetheless – the unique relationships, mutual respect and deep trust we and our customers share. In a nutshell, we couldn’t have developed it without the support and close working relationships we have with our customers. With the acquisition of IBM’s Microelectronics business, GF not only gained deep technical knowledge in RF but it has fostered and built upon a legacy of customer intimacy. The result is a new chip-manufacturing technology with a comprehensive set of advanced features that gives customers exactly what they need the most. Our new 8SW RF-SOI platform provides an unparalleled combination of best-in-class performance, cost effectiveness and the flexibility needed to build chips for the complex front-end modules (FEMs) required by rapidly evolving mobile/wireless communication applications. It’s not only the best combination of switching, LNA (low-noise amplifier) and logic capabilities on the market, but as a 300mm RF SOI process it uses larger wafers and more sophisticated tooling, bringing compelling economic, design and time-to-market advantages. It also features all-copper interconnect for more current-carrying capacity and efficiency. The new 8SW platform features switching speeds of sub 85fs, which is about 25 percent faster than our existing 200mm RF-SOI process. For LNAs, it offers peak fMAX of more than 250GHz. Logic circuitry is extremely dense and can operate at either 1.2V or 1.8V, with a power reduction of more than 70 percent versus the previous platform. Source: Adapted from The5th Generation Mobile Wireless Networks In addition, overall die size can be as much as 20 percent smaller. Combined with the fact that 300mm wafers are larger and yield more chips, the result is that the new 8SW process enables much more cost-efficient and faster design/development cycles because there is more wafer area available to use for test sites, design variations and multiple simultaneous projects. Time-to-market is also increased because 300mm production tools reduce variability by more than 30 percent versus the 200mm process. Working Closely With Customers In developing the 8SW RF SOI platform, we’ve taken dual product- and customer-centric approaches. We worked closely with customers because we needed to understand their detailed knowledge of application requirements as we developed the 8SW platform. One example of this approach was our recognition of the need to focus our development efforts on continuously improving LNA performance as signals come out of transceiver and move into the front end modules. This focus was a direct result of our close work with customer design teams to ensure the 8SW platform would meet rapidly developing advanced 4G LTE requirements. The new 8SW platform is manufactured at GF’s 300mm production line in East Fishkill, NY, providing customers with ample capacity because it leverages a partially-depleted SOI technology base that has been in high-volume production since 2008. About Author Shankaran Janardhanan Shankaran, GF’s Director of Product Line Management for RF, has made many contributions to the technical development and business success of RF products over his entire career. In his current role he has global product responsibility for GLOBALFOUNDRIES’ industry-leading portfolio of RF solutions. He was previously GF’s manager of RF business development and field applications. Before that he was at TowerJazz, where he had various roles in design engineering, technology and product management for RF and MEMS products, and where he managed the design support function. He has an M.B.A. from University of California–Berkeley and an M.S. in electrical engineering from Temple University.