Nitero Demonstrates High-Speed 60GHz Wi-Fi Solution on GLOBALFOUNDRIES 65nm-LPe RF Technology

Advanced RF technologies provide cost-effective and
lower-power SoC solutions for mobile market

Las Vegas, NV, January 9, 2013 – Today at the 2013 Consumer Electronics Show (CES), Nitero, a fabless semiconductor company developing next-generation Wi-Fi solutions for mobile devices, demonstrated its innovative 60GHz Wi-Fi solution manufactured on GLOBALFOUNDRIES’ 65 nanometer (nm) Low Power Enhanced (LPe) RF platform optimized for mobile SoC applications.

Nitero’s 60GHz solution, which complements and completes today’s Wi-Fi solutions such as 802.11n and 802.11ac, eliminates the need for physical connectors and their cables, dramatically increasing ease-of-use in tablet and handset devices. The company’s multi-gigabit, ultra-low power Wi-Fi solution allows consumers to enjoy the same capabilities and flexibility of high-end notebook computers in the convenient portability of a mobile device. Compliant with the now IEEE ratified 802.11ad industry standard, the upcoming Nitero Wi-Fi solution sill support popular enabling technologies from the Wi-Fi Alliance such as Wi-Fi Direct™ and Wi-Fi CERTIFIED MiracastTM.

“We needed a collaborative partner who was fully committed to supporting the development of our cutting-edge solution and bringing it to market,” said Natalino Camilleri, vice president of RF Engineering and Operations at Nitero. “GF is the perfect fit because of its outstanding RF solutions at the 65nm-LPe process technology node and excellent customer service. GF provided us the right solution at the right time for our product.”

“Collaboration is the cornerstone of our customer relationships. We are delighted to partner with Nitero to help them bring their innovative Wi-Fi solution to market,” said Bruce Kleinman, vice president of product marketing at GF. “Our 65nm LPe RF solutions, which are built upon low-power and high-performance process technology, are optimized for mobile applications. With its vast array of device options, highly accurate silicon-validated RF models, and comprehensive design enablement tools, our customers enjoy a complete product solution with lower risk and faster time to market.”

GF’s 65nm LPe RF solution is a proven platform ideal for low-power and high-performance SoC solutions used in power-sensitive mobile applications such as GPS, Wi-Fi, Bluetooth, LTE receiver, Mobile TV and Digital Radio. In 2012, the foundry shipped over 65,000 wafers on 65nm RF technology from its Singapore 300mm Fab 7 facility.


GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as one of the largest foundries in the world, providing a unique combination of advanced technology and manufacturing to more than 160 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s three 300mm fabs and five 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by the Advanced Technology Investment Company (ATIC). For more information, visit

Media Contact:

Jason Gorss
(518) 305-9022 begin_of_the_skype_highlighting (518) 305-9022 FREE end_of_the_skype_highlighting
[email protected]

Gina Wong
GF Asia Pacific
(65) 6670-8108
[email protected]