QuickLogic Joins GLOBALFOUNDRIES FDXcelerator(TM) Partner Program November 30, 2016SUNNYVALE, CA — (Marketwired) — 11/30/16— QuickLogic Corporation (NASDAQ: QUIK), a developer of ultra-low power programmable sensor processing, display bridge and programmable logic solutions, today announced that it has joined GLOBALFOUNDRIES’ FDXcelerator™ Partner Program, a collaborative ecosystem that facilitates 22FDX system-on-chip (SoC) design and reduces time-to-market for customers. “QuickLogic’s partnership with GLOBALFOUNDRIES adds a unique dimension to the FDX program by offering customers ultra-low power embedded FPGA (eFPGA) Intellectual Property, complete software tools and a compiler,” said Brian Faith, president and CEO at QuickLogic Corporation. “This new capability provides users with a high level of design and product flexibility which will help lower costs and allow products to be easily customized to meet various and evolving market requirements.”
FX-14™ Methodology: A Formula for First-Time-Right Success November 28, 2016 GLOBALFOUNDRIES’ VP of the ASIC product line shares how the team’s rigorous approach to design implementation and methodology were critical factors in achieving first-time silicon success for a major networking customer. Designing complex ASICs and delivering them on time is no easy task. It requires a powerful combination of design expertise, proven methodologies, and robust process technology. One year ago, with the launch of GF’ first ASIC platform, FX-14®, we gained competitive ground with a new pipeline of ASIC offerings on our 14nm FinFET process technology (14LPP). Since then, we have combined a rich legacy of ASIC expertise from our acquisition of IBM Microelectronics with manufacturing scale and improved access to IP and design tools to enable a new generation of customers to easily adapt their chip designs to the FX-14 offering. GF has decades of high-speed interconnect, memory, processor, and packaging innovation Today, I am pleased to share an exciting milestone in our journey: We have achieved first-time-right silicon success for a lead product using our FX-14™ ASIC platform, with a major networking customer (to remain anonymous) bringing up a board in one week and declaring a fully functional ASIC chip. Such an aggressive schedule would be impressive for any product, but this is no ordinary chip—the highly complex design incorporated a high-performance ARM® 64-Bit core, a DDR memory subsystem including DDR memory controllers and PHYs, multiple high-speed backplane SerDes covering a broad range of interface standards, dense 1- and 2-port SRAMs, high-frequency I/Os, and PLLs. How did we accomplish this? A key factor in our approach is the use of an integrated test chip based methodology to rigorously vet our design implementation and methodology well in advance of customer product tapeout. Our ASIC design-for-test features include full scan, IEEE 1149.1 and 1149.6 JTAG boundary scans, and complex IP that meets the IEEE 1687 standard. Additionally, we use a three-phase netlist signoff process with stringent entrance and exit milestone requirements. This type of ASIC platform rigor before product tapeout is essential to enabling first-time customer success. Another key contributor was the maturity of the 14LPP manufacturing technology at our Fab 8 facility in upstate New York, which is in high-volume production on multiple products. By leveraging the FX-14 design platform, the team was able to turn around defect-free parts quickly in order to guarantee first-time-right silicon, while also achieving a power reduction of more than 50 percent over the customer’s previous design. Achieving first-time-right silicon success and fast board bringup for such a complex chip demonstrates the power of GF’ ASIC FX-14 design system. This, along with our proven expertise and design methodology, helps ensure that our customers can design with confidence and achieve a fast path to volume production. Today, we have many customer designs underway in FX-14 across a number of segments, including wired networking, wireless base station, compute, storage, and aerospace and defense applications. We are committed to partnering with these and other customers to help them bring their most complex designs to market.
Anokiwave公司利用格芯的高性能SiGe技术为下一代无线市场开发毫米波产品 November 14, 2016San Diego CA, 14 November, 2016: Anokiwave, Inc., an innovative company providing highly integrated IC solutions for mmWave markets and active antenna based solutions, today announced a collaboration with GLOBALFOUNDRIES to deliver the world’s most advanced Silicon Core IC solutions for the emerging mmWave active antenna markets.
Anokiwave Inc. Leverages GLOBALFOUNDRIES High-Performance SiGe Technologies to Develop Millimeter-Wave Technologies for Next-Generation Wireless Markets November 14, 2016San Diego CA, 14 November, 2016: Anokiwave, Inc., an innovative company providing highly integrated IC solutions for mmWave markets and active antenna based solutions, today announced a collaboration with GLOBALFOUNDRIES to deliver the world’s most advanced Silicon Core IC solutions for the emerging mmWave active antenna markets. Active antennas have been used in military phase-array radar systems for many years and are now being deployed in record numbers in a wide range of commercial applications. The highly anticipated roll out of 5G infrastructure is expected to utilize active antenna technologies in both base stations as well as handsets.
Executive Perspective: The Beginning of a Virtuous Circle for GLOBALFOUNDRIES FDX™ Technology November 3, 2016By Alain Mutricy In our highly competitive industry, it is imperative for a company to continually challenge itself to move forward, otherwise it will surely find itself falling behind. At GLOBALFOUNDRIES, this means we are thinking big and embarking on technological paths we have not taken before to provide differentiated value to our customers. Our fully depleted SOI technologies, which we call FDX™, are one example. You’ve heard a lot from us lately about FDX technology. Our 22nm and 12nm FDX processes are ideal for low-power, mobile and highly integrated SoC applications, the sweet spot in the market for many of our customers. We originally developed the 22FDX® technology for IoT systems, which we estimate to be a $50B market opportunity for semiconductors by 2020 (Source: McKinsey & Company,based on volume forecast by Gartner, iSuppli, Strategy Analytics). It delivers the performance of 14/16nm FinFET technology on demand leveraging a software-controlled back-bias technology—yet it also supports ultra-low power systems and an ultra-low-leakage library for battery-operated IoT solutions. The process technology has been designed to integrate high-performance digital libraries with high-performance analog and RF circuits. First IP and silicon implementations have demonstrated the fact that beyond IoT, the 22FDX platform is ideal for low-to mid-range smartphone single-chip integration. Also, with the 22FDX platform we have broken the old paradigm of semiconductor technology development, which went as follows: the most advanced node would be developed for high-performance digital logic implementation. Then, more or less two years later, analog and RF would complement the process toolkit, as leading-edge performance customers were already moving to the next digital node. Finally, add another two years and you may have the ability to integrate non-volatile-memory (NVM). Which means, of course, that systems which would benefit from NVM integration could only integrate logic IP with four-year old performance capabilities. The 22FDX platform enables our customers to break free of this constraint, and to design intelligent, fully integrated (e.g., lowest power and system cost), and connected (e.g. with RF systems on-chip) systems. We see customers working on 28nm today, but also 55nm and 40nm customers (with RF and/or NVM) considering switching directly to 22FDX to leverage this competitive advantage for themselves. We’re already working with scores of customers on FDX technology, and a good number are in the early prototyping phase. While our unique FDX technology is the foundation of our offerings, we have also challenged ourselves to find ways to help customers bring their FDX-based products to market as easily and as quickly as possible. In particular, to make available tools and IP that enable customers to leverage the software-controlled body-bias capabilities of our FDX technology. To do this, we have developed the FDXcelerator Partner Program. It is a collaborative effort that provides customers with the comprehensive support and resources they need to get FDX-based SoCs to market as fast as possible. Think of it as an entire ecosystem of pre-qualified, committed expert partners and suppliers who, along with GF, stand ready to provide whatever customers may need to create and bring to market innovative SoC solutions quickly and cost-effectively. Such strong, strategic partnerships are crucial for any business, large or small. For example, let me make a comparison with something on the personal side. More than 15 years ago, I started a business within Texas Instruments aimed at developing microprocessor solutions for cellular phones, with the early vision that cell phones would become “smart,” have high-level operating systems, the ability to download applications and share media, and larger screens. We called it the OMAP processor. (How this world has changed in these past 15 years!!!) Despite a strong technology advantage versus the competition, with much more performance for multimedia and graphic, at ultra-low-power, OMAP in the early days represented a new type of dual-core solution to program. Our customers were viewing a competitor’s leading microprocessor solution as a safer bet, easier to implement, although the technology could not provide the needed battery life that would make smartphones become a mainstream technology. We launched a similar ecosystem network called the OMAP Technology Center program, to break the design barriers for our customers by bringing the best-of-the-best technology partners with optimized software solutions and tools to OMAP technology. In no time, our partners adapted their resources, skills, tools and their multimedia software or base-port software solutions to support the OMAP platform and take advantage of the emergence of the smart phone market with OMAP, which became quickly the market leader. OMAP customers were all winning in their markets, as they could develop at an accelerated pace. OMAP Technology Centers—our partners—grew very fast and shared in the success. So, back to our topic here: While we estimate that 22FDX SoC design complexity and the level of effort required is much lower than that of FinFET technology, designing with the full leverage of the software-controlled body-bias is a new approach to SOC design. Not complex, but different. (FinFET design complexity is about twice that of 28nm, according to a Gartner study.) We couldn’t have done it so well nor so quickly without expert help, which is precisely the goal of our FDXcelerator Program here. So far, we’ve announced seven world-class program partners and there is a backlog of others who want to join. Each partner we’ve evaluated and selected has committed to offer our customers specific, dedicated resources, and the program now encompasses: Tools (EDA) – Modules that leverage differentiated FD-SOI body-bias features, built into industry-leading design flows Design elements (IP) – Complete libraries, including foundational IP, interfaces and complex IP to enable foundry customers to start designs quickly with validated IP elements Platforms (ASIC) Reference solutions – System-level expertise in emerging application areas to speed time-to-market Packaging and test solutions (OSAT) – Enabling state-of the art SOC delivery Other resources – Design consultation and other services dedicated to FDX technology This all adds up to unique benefits and added-value that is only available with FDX technology from GF. I see the FDXcelerator Partner Program as a key toolbox for our customers to accelerate their time-to-market. It is the catalyst for a virtuous circle in the use of FDX technology, whereby the support we offer encourages more customers to migrate to FDX technology, and their ideas and participation in turn stimulate the ecosystem to grow further, which in turn draws in more customers, and so on. We are simultaneously creating the opportunity for business success for our partners and time-to-market advantage for our customers, by enabling them to have solutions and resources at hand to increase their design productivity on FDX technology. It’s exciting to be at the beginning of such a transformative effort. I’m proud to be a valued partner with our customers, and I can’t wait to see them win in the marketplace with our technology! Excluding “classic internet devices” such as laptops and smartphones. Also excludes automotive applications. Rough preliminary estimate with indicative split by device type. Integration of simple devices with communication features and memory in SoCs assumed and accounted for in communications category, embedded memory under logic.
New Generation of Server Chips is Shaking Up the Data Center Landscape October 25, 2016 By Sanjay Charagulla Cloud computing and high-performance computing (HPC) are changing the data center industry in a big way. The biggest drivers in this space are consumerization and big data, putting our trajectory on steroids. Global cloud IP traffic will more than quadruple over the next 5 years, growing at a CAGR of 33 percent from 2014 to 2019, and accounting for more than 80 percent of total data center traffic. Also, more than 86 percent of workloads will be processed by cloud data centers. As the rapid pace of change continues, server computing and data storage requirements will continue to grow at a significant rate across the data centers, resulting in data center OEMs deploying more and more servers and storage. Source: Cisco VNI Global Cloud Index, 2016 It was only a few years ago when companies were debating if they were ready for the cloud. Today, it’s no longer a question of if – it’s about how much they can get out of the cloud services. Server processor shipments are estimated to grow by an average rate of nearly 25 percent CAGR for the next four years, reaching a total of about 25 million processors. For example, out of 11+ million servers shipped last year, x86 chipsets were used in 9.8 million of them. In the second quarter of 2016, Intel accounted for 99.7 percent of x86 server-chip shipments. The cloud is also forcing changes to long established players in the hardware and software worlds. Recently, IBM unveiled new details of its Power9 chip —the next addition to the line of microprocessors the company plans to use in its own servers—and AMD announced its new Zen technology for server chips. Here is IBM’s official Power processor roadmap from last year, and see how AMD’s Zen microarchitecture is different from its other server cores. As data server companies seek to increase power and performance while reducing costs, chipmakers are up to the challenge to find ways to increase speed and functionality to devices while keeping costs low. For example, because of its competitive power and performance, with a ~10 percent lower die size, GLOBALFOUNDRIES’ advanced 14nm FinFET technology (14LPP), supports a wide range of products from mobile devices to servers, such as AMD and IBM’s server chip products. Enabled chip x86 processor performance by 3GHz+, the GF’s 14nm FinFET technology taps the benefits of three-dimensional, fully-depleted FinFET transistors, and offers impressive gains over 28nm bulk CMOS with up to 50 percent increase in performance and a 65 percent reduction in total power. Source: GF Technology Conference 2016 The IBM and AMD announcements along with GF competitive advanced node technology, represent new competition to Intel’s dominance in the server market. In a recent strategy shift, IBM’s Power9 architecture will be offered to other hardware companies. Subsequently, IBM Power9 processors are not only targeting to HPC and enterprise server markets, but also enabling solutions for big data analytics, artificial intelligence, cognitive and hyper-cloud computing platforms. At a Silicon Valley technical conference this summer, AMD rolled out a demonstration of the performance with a head-to-head comparison of its Zen Core, claiming a 5x improvement in cache bandwidth with the redesigned memory subsystem. Overall, it is a core that contributes a 75 percent higher capacity to schedule instructions and a 50 percent greater ability to execute and issue them. With the advent of cloud computing, large service providers such as Google, Facebook, and Amazon are opting for systems based processors and open-source or in-house applications. Earlier this year, Google announced that they are working with Rackspace to co-develop an open server architecture design specification based on IBM’s new Power9 CPUs. The partnership with Nvidia should also help IBM’s Power9 become popular in servers as well as in supercomputers. Along with these two server giants, many other ARM processor-based chip vendors and other startups are building ARM server chips to target cloud datacenter markets. ARM estimates that 13 companies already are using its technology in chips for servers and other data-center hardware, which are expected to compete predominantly in single-socket and dual-socket servers with Intel server chip products. Server companies and other ARM based chip vendors are aiming at Intel’s chip dominance, targeting the~$12B server market for scale-out data centers. Overall in the next few years, these processor technologies and new solutions could begin driving a 15–25 percent growth in the server chip market.
Aquantia宣布针对超大规模数据中心与云计算环境的突破性100G技术 October 24, 20162016年10月24日 格芯合作延展铜互联技术至100G带宽，降低高性能数据中心的网络连接成本 新闻提要 · 借助格芯在行业内最高性能的56Gbit/s SerDes，Aquantia最新的QuantumStream™技术为世界展现了第一个单线100Gbit/s直连方案。 · QuantumStream™来自Aquantia专利验证的内互连接结构性创新，提供超低延迟的性能，对下一代超大规模结构尤为重要。 · Aquantia和格芯合作推出高达800Gbit/s的以太网直连线路连接。 · 合作包括将QuantumStream™的 IP授权于格芯使用，扩大产品生态系统，维持云计算的革命。 加州圣何塞，2016年10月24日— Aquantia公司，数据中心和企业基建的高速以太连接方案先锋领头羊，今天揭开了QuantumStream™ 的面纱。QuantumStream™ 是一项高性能连接结构的全新技术， 对下一代超大规模数据中心拥有革命性的潜力。QuantumStream™ 由Aquantia通过与格芯的战略性合作得到开发，发明了100Gbit/s带宽全电气化技术，为网络应用提供了超低延迟。Aquantia的技术提供了带宽和性能上的能级跳跃，使用单铜线完成了原本被认为只可通过光学传导达到的目标。本技术的公开将推动系统商和数据中心运营商向更高性能和超大规模结构的新技术靠近，同时仍维持电气基础内连接的可靠性、低成本和易用性。QuantumStream™ 目标达到服务器内部和服务器之间高达3米的连接性，很好的补充了超大规模数据中心长距离光学传播解决方案。 “作为一名LinkedIn全球基建结构和策略部的首席工程师，我专注于设计下一代的数据中心。我一直相信100G连接会被广泛利用，只要它达到每十亿字节每秒1美元的价格点，”Yuval Bachar说道。“Aquantia拥有了创新的100G技术，铜连接提供更低的数据成本。低成本将改变服务器连接的生态，对于所有追求每Gbit/s成本小于一美元却拥有更高连接速度的人来说，都具有明显吸引力。” “至今，行业观察者表示只有光学连接能满足100Gbit/s和更高的需求。但是光学技术本身的高成本就是一道巨大到障碍，”Aquantia的CEO Faraj Aalaei说道，“我们在复杂高速铜收发器上的专业经验，结合格芯稳固的SerDes领先技术及其14纳米FinFET技术，将在产品会规划上完成100G连接的目标，提供给客户对具独特性的最佳的组合，并能够领先于市场的需求。” 策略合作致使100Gbit/s内联技术突破。 格芯拥有超过20年的深度高速串联解串器（SerDes）设计专业经验。一块SerDes集成电路是交换器、服务器、路由器、数据中心的储存设备、IT环境之间数据传输的基础，同时也能控制多个渠道（例如光纤、电子铜缆线和背板）。格芯的FX-14™专用定制集成电路平台在14纳米超低功率（LPP）制程技术上设计，提供包括了以56Gbit/s速度传输数据的最新一代SerDes的优化后IP组合。 在合作下，格芯向Aquantia的专家组提供了通向56Gbit/s IP核心的渠道。Aquantia结合了56Gbit/s IP核心和其混合模式信号处理（MMSP）和多核信号处理（MCSP）专利铜内联结构创新。铜内联结构在过去的十年内得到发展，并提供独特的100G内联高性能SerDes方案。此外，Aquantia将向格芯提供通向QuantumStream™ IP的渠道，共同打造客户的ASIC，并扩大支持革命性方案的设计生态环境。 双方合作致力于打破目前的电路连接100Gbit/s带宽的固有技术障碍。另外，Aquantia的 QuantumStream™ 技术利用传统DAC缆线可轻易提供数百亿字节每秒的带宽，解决了目前面向互联网与数据中心产业最大挑战之一。 QuantumStream™是短距离的理想选择 · 100G，3米直连电缆SFP · 400G，3米直连电缆QSFP · 800G，3米直连电缆OSFP 关于超大规模数据中心的一项关于交换器和服务器连接性的分析显示，大量数据都集中在几米距离之内。据Crehan研究公司称，绝大多数直连服务器和储存以太网连接在超大规模数据中心内都处于3米以内。由于百米甚至公里外的数据连接方案无法满足近距离连接，所以需要一个既满足远距离连接又实现近距离应用连接的互补解决方案。传统上，电子内联在近距离空间提供了最低成本与最低功耗的选择，而光学方案得利于低损耗的光纤，则一般用于长距离的应用。 对于追求更高密度交换器与服务器配置的行业趋势，很多100G的光学传输方案被提出以作为应对的方案。Aquantia的 QuantumStream™技术作为大型服务器和交换器短距离传输的100G互补型解决方案，首次在铜导线应用上成为现实。 “为满足数据和带宽需求的大量增长，格芯延续对网络和技术改进的投入，带来了同类级别最佳的高速SerDes方案，为客户带来巨大的利益”，格芯全球销售与业务发展部高级副总裁Mike Cadigan说道。“Aquantia铜内联技术上的创新设计和专业经验，结合我们世界级的FX-14 ASIC平台和SerDes IP组合，将维持电气连接在超大规模数据中心标志性地位。” 关于Aquantia Aquantia是高速半导体连接方案的领先开发者和全球供应商。得益于长达10年以上的技术领先和执行，Aquantia的市场领先产品组合打造了世界上最新的计算、数据中心和企业基建应用。Aquantia基于提供高性能、低功耗、高密度和高品质硅方案的结构创新，提供了拓展的产品组合，并能够满足不断变化的市场需求。Aquantia总部坐落于加州硅谷，汇集富有冒险精神的领导和精通策略的投资者。 了解更多详情，请登录www.aquantia.com QuantumStream™ 为Aquantia Corp注册商标。 关于格芯 格芯是提供全方位服务的领先半导体晶圆制造商，为世界上最具创新意识的科技公司提供独特的设计，开发和制造服务。格芯的生产制造业务遍布全球三大洲。格芯使技术和系统转型成为可能，并且帮助客户拥有塑造市场的力量。 格芯是Mubadala Development Company旗下公司。欲了解更多信息，请访问公司官方网站 https://www.globalfoundries.com。
Aquantia Announces Breakthrough 100G Technology for Hyperscale Data Centers and Cloud Computing Environments October 24, 2016Collaboration with GLOBALFOUNDRIES to extend copper interconnects to 100G bandwidth lowering the cost of high-performance data center connectivity NEWS HIGHLIGHTS Aquantia’s new QuantumStream™ technology delivers the world’s first single-lane 100Gbit/s direct attach solution by leveraging the industry’s highest performance 56Gbit/s SerDes from GF. QuantumStream™ is enabled by Aquantia’s proven and patented architectural innovations in interconnect technology and delivers ultra-low latency performance critical in next-generation hyperscale architectures. Aquantia and GF’s collaboration to enable up to 800Gbit/s Ethernet Direct-Attach Cable connections. The collaboration includes licensing of Aquantia’s QuantumStream™ IP to GF, expanding the ecosystem of products, thus continuing the cloud computing revolution. San Jose, Calif., October 24, 2016 – Aquantia Corp., pioneer and market leader in high-speed Ethernet connectivity solutions for data centers and enterprise infrastructure, today unveiled QuantumStream™ technology, a new class of high-performance connectivity architecture that has the potential to revolutionize next-generation hyperscale data centers. QuantumStream™ technology, which is being developed by Aquantia through a strategic collaboration with GF, is creating a 100Gbit/s bandwidth all-electrical technology to deliver low latency to networking applications. Aquantia’s technology delivers a quantum leap in bandwidth performance over a single lane of copper previously believed to be solely the realm of optical techniques. The availability of this technology will enable system vendors and data center operators to push towards higher performance and newer topologies in hyperscale architectures while keeping the reliability, low-cost and ease-of-use of electrical-based interconnects. QuantumStream™ technology is aimed at inter and intra rack connectivity up to 3 meters complementing longer reach optical connectivity solutions used in hyperscale data centers. “As a principal engineer in global infrastructure architecture and strategy at LinkedIn, my focus is on designing next generation data centers. I have long believed that 100G connectivity would be widely deployed when it reaches a price point of one dollar per gigabit per second for optical interconnects,” said Yuval Bachar. “Aquantia has come up with a very innovative 100G technology to deliver on lower cost per gigabit utilizing copper connectivity. Lower prices will transform the economics of in rack connectivity in hyper scale data centers, which obviously is of great interest to everyone looking to achieve below one dollar per 1Gbit/s on an accelerated path within the rack.” “As a principal engineer in global infrastructure architecture and strategy at LinkedIn, my focus is on designing next generation data centers. I have long believed that 100G connectivity would be widely deployed when it reaches a price point of one dollar per gigabit per second for optical interconnects,” said Yuval Bachar. “Aquantia has come up with a very innovative 100G technology to deliver on lower cost per gigabit utilizing copper connectivity. Lower prices will transform the economics of in rack connectivity in hyper scale data centers, which obviously is of great interest to everyone looking to achieve below one dollar per 1Gbit/s on an accelerated path within the rack.” “To date, industry watchers have projected that only optical connectivity will serve the needs of 100Gbit/s and beyond. This presents a huge barrier since optical technologies are intrinsically higher cost,” said Faraj Aalaei, CEO of Aquantia. “Our expertise in complex high-speed copper transceivers, coupled with the legacy of robust SerDes leadership with GF’s 14nm FinFET technology will enable a continuous roadmap to the required 100G connectivity and provide our customers with the best combination to differentiate and stay ahead of evolving marketplace demands.” Strategic Collaboration, Results in Breakthrough 100Gbit/s Interconnect Technology GF has more than 20 years of deep technical expertise in high-speed Serializer-Deserializer (SerDes) design. A SerDes integrated circuit is a fundamental building block responsible for the transport of data between switches, servers, routers and storage equipment in data centers and IT environments, over a variety of channels such as optical fibers, electrical copper cables, and backplanes. GF’s FX-14™ Application-Specific Integrated Circuit (ASIC) platform, designed on the company’s most advanced 14nm Low Power Plus (LPP) process technology, delivers an optimized IP portfolio, including the latest generation of SerDes, which is capable of transporting data at speeds of 56Gbit/s. Under the collaboration, GF provides access to its 56Gbit/s IP core to Aquantia’s team of experts. Aquantia combines the 56Gbit/s IP core with its patented Mixed-Mode Signal Processing (MMSP) and Multi-Core Signal Processing (MCSP) architectural innovations of high-speed interconnect over copper, which it has developed over the past decade to deliver a unique 100G interconnect high-performance SerDes solution. In addition, Aquantia will provide access to its QuantumStream™ IP to GF for incorporation into its customers’ ASICs, therefore expanding the ecosystem of solutions supporting this revolutionary interface. The collaboration seeks to break through the perceived technical barriers in continuing the current electrical connectivity roadmap to 100Gbit/s bandwidth. In addition, Aquantia’s QuantumStream™ technology is easily leveraged to deliver multiples of 100Gbit/s of bandwidth on conventional DAC cables, resolving one of the most significant challenges facing the networking and data center industries today. QuantumStream is Ideal for Short Distance 100G over 3m Direct Attach Cable SFP 400G over 3m Direct Attach Cable QSFP 800G over 3m Direct Attach Cable OSFP An analysis of the deployment of switch and server connectivity in hyperscale data centers shows that a large concentration of them are within a few meters. According to Crehan Research, the majority of direct server and storage Ethernet network connections in hyperscale data centers are currently within 3 meters. Since interconnect solutions that are optimized for hundreds of meters or even a couple of kilometers would not be adequate for a few meters, this leads to the need for complementary solutions for connectivity over short-reach applications and long-reach connections. Traditionally, electrical interconnects have delivered the lowest-cost and -power options for the short reach space whereas optical solutions have been deployed in longer reach applications thanks to low-loss of optical fibers. Responding to a sweeping industry trend toward higher density switch and server configurations, a number of optical solutions have already been proposed for 100G. Aquantia’s QuantumStream™ technology, a complementary 100G solution for mass server and switch connectivity at shorter reaches over copper lane implementations is now possible for the first time. “To meet the tremendous growth in bandwidth and data demands, GF is continuing its commitment to investing in network and technology enhancements including a best-in-class high-speed SerDes solution that will bring tremendous benefits to our customers,” said Mike Cadigan, senior vice president of global sales and business development at GF. “Aquantia’s innovative design expertise in high-speed copper interconnect technologies, combined with our world-class FX-14 ASIC platform and SerDes IP portfolio, will enable the continuation of electrical interconnect paradigms for hyperscale data centers.” About Aquantia Aquantia is a leading developer, and global supplier of high-speed semiconductor connectivity solutions. Backed by more than a decade of technology leadership and execution, Aquantia’s market leading product portfolio enables the world’s most innovative computing, data center and enterprise infrastructure applications. Aquantia addresses ever-changing market needs by providing an extensive portfolio, based on architectural innovations that deliver high performance, low power consumption, high density and high-quality silicon solutions to its customers. Aquantia is headquartered in Silicon Valley, Calif., with strong venture capital and strategic investors. For more information, visit www.aquantia.com QuantumStream™ is a trademark of Aquantia Corp. About GF GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as one of the largest foundries in the world, providing a unique combination of advanced technology and manufacturing to more than 250 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s 300mm fabs and 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by Mubadala Development Company. For more information, visit https://www.globalfoundries.com. Aquantia:Sabrina Joseph408-726-1493[email protected] GF:Erica McGill518-305-5978[email protected] Cautionary Statement This press release contains forward-looking statements concerning Aquantia including, among other things, the extent to which its products provide technological advantages and will be accepted by the market. Forward-looking statements herein are based on current beliefs, assumptions, and expectations, speak only as of the date hereof and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Factors that could cause actual results to differ materially from current expectations include, without limitation, technological and business developments in the data center and Ethernet enterprise markets for ICs.
INVECAS将在GLOBALFOUNDRIES FDX™技术上为明天的智能系统启用ASIC设计 September 29, 20162016年9月29日 INVECAS与GLOBALFOUNDRIES合作，在22FDX®和12FDX™技术上提供IP和端到端ASIC设计服务 加利福尼亚州圣克拉拉市 2006年9月29日 INVECAS Inc.和格芯今天宣布，INVECAS将提供IP和端到端ASIC设计服务。此服务将作为晶圆厂的FDXcelerator™ 合作伙伴计划的一部分，该计划旨在促进22FDX SoC设计来实现未来的智能系统。该合作加速了FDX技术在物联网（IoT），移动，射频连接和网络市场的应用中的应用。 INVECAS将与格芯的技术团队密切合作，针对公司的22FDX制程来开发和验证一系列IP。此外，INVECAS将提供全面的ASIC设计服务，帮助客户在SoC设计上拥有强烈的信心和超低的风险。 “我们的目标是提供经硅片验证的IP解决方案和系统级专业知识，以解决当今ASIC设计师面临的难题，”INVECAS公司董事长兼首席执行官Dasaradha Gude表示。 “我们很高兴成为格芯FDXcelerator计划的初始合作伙伴，这是一项突破性的举措，旨在使广泛的客户能够加快22FDX量产时间。 “我们很高兴扩大与INVECAS的战略关系，并欢迎他们作为FDXcelerator合作伙伴计划的初始成员，”格芯的产品管理高级副总裁Alain Mutricy说。“除了全面的FDX优化IP产品组合，我们的客户现在可以接触INVECAS全套服务，以及时和高质量地实现他们的SoC设计。“ 随着下一代12FDX™技术在最近被公布，FDXcelerator合作伙伴计划建立了格芯在业界首创的FD-SOI产品规划图，这是一个设计人员在高级节点上的的低成本的路径。通过参与FDXcelerator并继续扩展其IP产品以支持更广泛的FDX客户，INVECAS在FDX平台的采纳和增长方面处于领先地位。此外，FDXcelerator合作伙伴计划扩大了公司之间的技术合作，包括围绕质量，资格认证和研发方法的紧密联系。 更多信息将在未来几个月与FDX设计社区共享。如果您有兴趣进一步了解FDXcelerator的客户和合作伙伴，可以访问www.globalfoundries.com/FDXcelerator。 关于INVECAS INVECAS从在美国和印度的开发中心为格芯客户提供半导体IP和硅实现服务。该公司在提供高性能和高能效IP方面拥有良好的业绩记录，并在领先的流程中始终如一地实现了多项设计的成功。欲了解更多信息，请访问https://www.invecas.com。 关于格芯 GF是世界上第一个具有真正意义上足迹遍布全球的全方位服务晶圆制造商。该公司于2009年3月成名，并迅速实现了规模化，成为世界最大的晶圆生产商之一，为250多个客户提供先进技术和独特制造的组合。格芯在新加坡，德国和美国经营，是唯一提供跨越全球三大洲的制造中心，并提供足够灵活和高度安全的代工厂。该公司的300mm晶圆厂和200mm晶圆厂提供从主流到前沿的全系列制程技术。格芯的制造业务遍及全球，而格芯位于美国，欧洲和亚洲的半导体业务中心的大量的研发和设计实现人员为格芯的全球制造业务提供全面的支持。格芯由Mubadala Development Company拥有。欲了解更多信息，请访问https://www.globalfoundries.com。 联系人： Jason Gorss 电话：（518）698-7765 [email protected]
INVECAS to Enable ASIC Designs for Tomorrow’s Intelligent Systems on GlobalFoundries FDX™ Technology September 29, 2016 INVECAS to Collaborate with GlobalFoundries to Provide IP and End-to-End ASIC Design Services on 22FDX® and 12FDX™ Technologies Santa Clara, CA, September 29, 2016-INVECAS Inc. and GF announced today that INVECAS will provide IP and end-to-end ASIC design services as a part of the foundry’s FDXcelerator™ Partner Program, an ecosystem designed to facilitate 22FDX SoC designs for tomorrow’s intelligent systems. The collaboration accelerates the adoption of FDX technology in applications spanning Internet-of-Things (IoT), mobile, RF connectivity, and networking markets. INVECAS will work closely with GF’s technology teams to develop and verify a range of intellectual property (IP) for the company’s 22FDX process. Moreover, INVECAS will offer comprehensive ASIC design services to help customers realize SoC designs with high confidence and low risk. “Our objective is to provide silicon-proven IP solutions and system-level expertise to address the difficult issues of design complexity facing ASIC designers today,” said Dasaradha Gude, chairman and CEO, INVECAS. “We are glad to be an initial partner in GF’s FDXcelerator Program, a ground-breaking initiative to enable a broad range of customers and accelerate time-to-volume for 22FDX.” “We are pleased to expand our strategic relationship with INVECAS and welcome them as an initial member of the FDXcelerator Partner Program,” said Alain Mutricy, senior vice president of product management at GF. “In addition to the comprehensive portfolio of FDX-optimized IP, our customers can now access INVECAS’ full suite of services to realize their SoC designs on time and with highest quality.” With the recent announcement of the company’s next-generation 12FDX™ technology, the FDXcelerator Partner Program builds upon GF’s industry-first FD-SOI roadmap, a lower-cost migration path for designers on advanced nodes. By participating in FDXcelerator and continuing to expand its IP offering to support a wider range of FDX customers, INVECAS is well-positioned as a leader in the adoption and growth of the FDX platform. Moreover, the FDXcelerator Partner Program broadens the technology collaboration between the companies, including tighter interlock around quality, qualification and development methodology. More information will be shared with the FDX design community in the months to come. Customers and partners interested in learning more about FDXcelerator can visit here. ABOUT INVECAS INVECAS offers semiconductor IP and silicon realization services for GF customers from its development centers in the US and India. The company has a strong track record in delivering high performance and power-efficient IP and has consistently achieved first-time success with multiple designs on leading-edge processes. For more information, visit https://www.invecas.com. About GF GF is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as one of the largest foundries in the world, providing a unique combination of advanced technology and manufacturing to more than 250 customers. With operations in Singapore, Germany and the United States, GF is the only foundry that offers the flexibility and security of manufacturing centers spanning three continents. The company’s 300mm fabs and 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia. GF is owned by Mubadala Development Company. For more information, visit https://www.gf.com. Contacts:Erica McGillGF(518) 305-5978[email protected]
