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GlobalFoundries and GlobalWafers Partnering to Expand Semiconductor Wafer Supply

Long-term $800 million supply deal includes $210 million capital expansion, creation of more than 75 new jobs in Missouri and will provide specialized wafers for GF’s manufacturing facilities in New York and Vermont

Malta, New York, June 7, 2021 – GlobalFoundries® (GF®), the global leader in feature-rich semiconductor manufacturing, and GlobalWafers Co., Ltd. (GWC), one of the top silicon wafer manufacturers in the world, today announced an $800 million agreement to add 300mm silicon-on-insulator (SOI) wafer manufacturing and expand existing 200mm SOI wafer production at GWC’s MEMC facility in O’Fallon, Missouri.

The silicon wafers produced by GWC are key input materials for semiconductors and an integral part of GF’s supply chain. The wafers are used in GF’s multi-billion dollar manufacturing facilities, or fabs, where they are used to manufacture the computer chips that are pervasive and vital to the global economy. Today’s announcement expands GF’s domestic silicon wafer supply from the United States.

In particular, the 300mm wafers made at GWC’s MEMC site in Missouri will be used at GF’s most advanced manufacturing facility, Fab 8 in Malta, New York, and the 200mm wafers made at the Missouri site will be used at GF’s Fab 9 in Essex Junction, Vermont. These wafers will be used to create feature-rich semiconductor solutions to meet the sharply growing demand for GF’s advanced RF technologies across a range of applications including 5G smartphones, wireless connectivity, automotive radar, and aerospace.

The long-term agreement includes nearly $210 million in capital expenditures to expand GWC’s MEMC facility in Missouri, and will create more than 75 new jobs. The 300mm pilot line is on track to be completed in Q4 this year. The agreement is strengthened by $9.4 million in investments and support from the State of Missouri, as well as support from the City of O’Fallon, Ameren Missouri, Spire, and Greater St. Louis, Inc.

GF is investing $1.4 billion in 2021 alone to expand its manufacturing capacity, to meet the needs of customers and address the growing global demand for computer chips. As part of this growth, GF will require an increased supply of wafers like those made by GWC. GWC is one of the world’s leading manufacturers of 200mm SOI wafers and has a long and ongoing relationship with GF for supplying 200mm SOI wafers. In February 2020, GWC and GF announced intentions to collaborate closely to significantly expand GWC’s existing 300mm SOI wafer manufacturing capacity. Today’s announcement signals a significant step forward in that collaboration.

Today’s announcement comes at a time when the United States is seeking to fortify and expand its semiconductor supply chain, which enables the $91 trillion world economy. Only 12 percent of the world’s semiconductor manufacturing capacity is in the United States. Critical to increasing the number of chips manufactured in the U.S., and making U.S. chip manufacturing more globally competitive, are federal investments like those enabled by the bipartisan-supported U.S. Innovation and Competition Act and the already passed CHIPS for America Act.

“Semiconductors are critical to our national security and economic competitiveness,” said U.S. Sen. Roy Blunt of Missouri, an instrumental supporter of the U.S. Innovation and Competition Act. “The supply chain of these computer chips is highly complex and largely dominated by other countries. We need to begin making more chips at home to protect U.S. industries from chip shortages like we have seen in recent months. Today’s announcement is good news for semiconductor manufacturing and will create steady, good-paying, high-tech jobs for Missourians.”

“As a trusted semiconductor manufacturer and supplier to the U.S. government, and the world leader in RF semiconductor technology, GF has been leading the charge to accelerate U.S. semiconductor manufacturing and boost our capacity to meet the growing global demand for chips,” said GF CEO Tom Caulfield. “The kind of partnership we are announcing today with GWC is only possible thanks to Congressional leadership and the renewed national interest in growing U.S. semiconductor manufacturing capacity.”

“We are proud to deepen our strategic partnership with GF, and to expand our important role in the U.S. semiconductor supply chain,” said Doris Hsu, Chairman and CEO of GWC. “We thank the State of Missouri for its support. We also thank our incredible O’Fallon team, whose dedication and hard work have enabled our success and growth. We look forward to ramping up our 300mm pilot line this year, and accelerating our build-out with GF.”

“We’re proud to see a Missouri business step up to address the critical semiconductor need we are seeing in countless industries all across our state and nation,” said Missouri Governor Mike Parson. “MEMC’s expansion will strengthen the global semiconductor supply chain, promote American manufacturing, and support good-paying jobs right here in Missouri.”

“For more than six decades, we have been the home of MEMC and its manufacturing of world class silicon wafers,” said O’Fallon Mayor Bill Hennessy. “O’Fallon takes pride in providing a business and family-friendly environment with a high quality of life that supports MEMC’s success. We are thrilled by this new partnership between GlobalWafers and GLOBALFOUNDRIES and the positive impact it will have on our city, state and nation.”

GF employs more than 7,000 people across the U.S. Over the past 12 years the company has invested $15 billion in U.S. semiconductor development, and it is doubling its planned investment in 2021 to expand global capacity and support growing demand from the U.S. government and industry customers for secure processing and connectivity applications.

About GlobalFoundries

GF is the world’s leading semiconductor manufacturer and the only one with a truly global footprint. GF delivers feature-rich solutions that enable its customers to develop pervasive chips for high-growth market segments. GF provides a broad range of platforms and features with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF has the flexibility and agility to meet the dynamic needs of customers across the globe. GF is owned by Mubadala Investment Company. For more information, visit www.globalfoundries.com.

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Media Contact

Michael Mullaney
GlobalFoundries
(518) 305-1597
[email protected]

Frictionless Networking: A Megatrend that Requires Powerful RF Solutions

Frictionless networking, virtualization, and hierarchical AI are three technological megatrends that will transform how we live and work. This article on frictionless networking is the first in a series examining how GlobalFoundries solutions enable each of these megatrends.

Although the transistor debuted nearly three quarters of a century ago, paving the way for solid-state integrated circuits and ushering in the electronics revolution, the last two years may have been the most momentous ones ever in the industry’s history.

In 2019, geopolitical tensions brought a sharp focus to the strengths and vulnerabilities of the global semiconductor supply chain. Because of the need for a reliable supply of chips for all manner of products, semiconductors suddenly became a flashpoint for industrial, commercial and foreign-relations policies.

Then, driven by the Covid-19 pandemic in 2020, awareness of the raw power of the world’s digital infrastructure grew, as people began to depend on it more heavily than ever before to fight the contagion, to run companies remotely, to educate students, to socialize, and for many other things large and small.

Tom CaulfieldGlobalFoundries (GF) CEO Tom Caulfield said that ever since society realized supply chain issues and the pandemic weren’t short-term crises, there’s been a deepening awareness of the importance of digital technologies and how they will forever change our lives.

“It’s amazing to see not only how pervasive and resilient the digital infrastructure had become over the last decade, and yet how little of its full potential was exploited until COVID-19,” he said. “We started to imagine not a new normal, but a better normal. This better normal will come from exploiting the capabilities of our pervasive, expanding and improving digital infrastructure. …. This is not just an opportunity for our industry, it’s our calling.”

As a result, GF sees three megatrends and one enormous hurdle that have emerged, Caulfield said, and GF solutions are critical to all of them. The first is frictionless networking – a ubiquitous “always-on, seamless, intelligent and secure connection, 24 hours, seven days a week” – which we’ll explore in greater depth below in this blog.

The second megatrend is pervasive deployment of virtualization. “Network function virtualization (NFV) is a great example,” Caulfield said. “This is where network processing is done in the cloud, and data is transported from dumb access points to the cloud for processing. This results in significant scale advantages similar to the value proposition of cloud storage and computing we enjoy today. NFV significantly improves bandwidth and speed, and it does it at a much lower cost and power point. Also, given the flexible nature of a virtualized network, the time and effort to deploy new services can be enhanced, as the new feature will come via a software push versus a hardware upgrade to the user.”

The final megatrend is hierarchical artificial intelligence (AI), or “AI Everywhere,” from devices to sensors, from the edge to the cloud. “Data is the new gold, but it is only ore if we can extract it from a raw, unstructured format and use it to gain insights, take action and make decisions,” Caulfield said. “The amount of structured and unstructured data generated in just the last two years alone is greater than all of the data generated before, yet we only use 3% of all this data. Hierarchical AI is the key to extracting value from immense, unstructured data by parsing it to extract important information, then compressing it for more efficient transport to compute and storage.”

While each megatrend has its own hurdles and challenges, and reducing power consumption is a make-or-break issue for all of them, the move to a digital future is unstoppable.

Frictionless Networking is Coming

Peter Gammel“Our vision for future network connectivity is that you’re not even going to know what network you’re connected to, your device will automatically find it, authenticate it and optimize it for bandwidth, latency and other critical attributes,” said Peter Gammel, Vice President and CTO of GF’s Mobile and Wireless Infrastructure Business Unit. “We call this frictionless networking because when we talk about how we see connectivity playing out in the years to come as wireless systems make use of increasingly fast RF and mmWave spectrum, we don’t want to get lost in the details of 5G, 6G, Wi-Fi, Bluetooth, or some other network protocol.

“Instead, the key point is this: No matter how you connect, the last hop between a network and your device is always going to be wireless,” he said, “and that means even though there’s already been a virtual explosion of radio frequency (RF) content in all sorts of devices, the trend is only going to accelerate.”

Gammel said it isn’t just smartphones, tablets and PCs that will depend on frictionless networking capabilities. A universe of diverse products will need it to function, in applications as varied as Industry 4.0 (i.e., smart, automated manufacturing); the Internet of Things (IoT); wearables for health and wellness; automotive systems like advanced driver assistance (ADAS); and others too numerous to mention.

The challenges are enormous. Data traffic at key network hubs is on a steep incline – up to 40% in some cases – and those rates are only going to increase in the coming years, Gammel said in a keynote address at the 2021 IEEE International Reliability Physics Symposium. “Future networks will require extreme capacity and data rates, much higher spectral efficiency, ultra-low latency, much higher reliability and robust security.”

 
 
 

The Best RF Technology Will Carry the Day

That’s all well and good, but anyone who has experienced difficulty in connecting to a network might wonder how we will ever reach a state of frictionless networking. What will it take to get there?

“I’ve been in this industry for 40 years, and the way you measure success has never changed: It always comes down to leadership in RF technologies, which are essential to the performance and power consumption of front-end modules (FEMs) and power amplifiers, the most critical elements of a wireless communications system,” Gammel said.

He said that to maximize the use of available spectrum, the push is on to drive output power as close to reliability limits as possible. That plays to GF’s strengths as the longstanding leader in many different RF technologies, including RF-SOI (RF silicon on insulator), FD-SOI (fully depleted silicon on insulator) and SiGe (silicon germanium) solutions.

“Our RF SOI solutions are the go-to choice for integrated FEMs and beamformers in 5G base stations and smartphones,” Gammel said. “Meanwhile, because our 22FDX™ FD-SOI solution combines RF, analog, embedded memory, and advanced logic in one chip, they offer unmatched peak performance and energy efficiency for the integration of FEM elements like data converters, LNAs, power amplifiers (PAs) and switches with a transceiver.”

In addition, he said, GF’s SiGe solutions are widely used in Wi-Fi and cellular power amplifiers, and SiGe technology provides a path to the terahertz frequencies needed for future network architectures.

 
 
 

“The Best is Yet to Come”

Gammel laid out what he sees as the other necessary ingredients for frictionless networking. “Turnkey assembly and test capabilities are going to become more important as the industry moves to terahertz frequencies, because the interface between circuits and packaging becomes more critical to performance. Do you put the antenna on the package or on the die, and what is the best configuration?” he said.

Open interfaces are another requirement. “Proprietary interface protocols never win. Open interfaces are critical in building an ecosystem, and we’re seeing this already in network infrastructure and in standards-setting activities,” he said. One example is the 5G Open Radio Access Networks (Open RAN) initiative.

Also, non-terrestrial networks that make use of satellites in low-Earth orbit (LEO) constellations are key to delivering connectivity to underserved geographies. “The commercial deployment of LEO constellations isn’t science fiction, it’s happening. The Starlink constellation from SpaceX is an example,” he said.

“Much work remains to be done and many technology innovations are still required to leverage the vast, untapped spectrum from 100 GHz to 1 THz, but we have made great progress already and the best is yet to come,” Gammel said.

The next article in this series will focus on the virtualization megatrend.

平顺的网络：一个需要强大射频解决方案的大趋势

平顺的网络、虚拟化和分层人工智能，这三大技术趋势将改变我们的生活和工作方式。本文围绕平顺的网络而展开，是系列文章的一部分，该系列文章将探讨格芯®（GLOBALFOUNDRIES®）解决方案如何让这些大趋势得以实现。

尽管晶体管在近75年前就首次亮相，为固态集成电路铺平了道路，并迎来了电子革命，但过去两年可能才是行业历史上最重要的两年。

2019年，地缘政治的紧张局势使人们更加关注全球半导体供应链的优势和短板。由于各种产品都需要可靠的芯片供应，半导体突然成为工业、商业和外交政策的一个热点。

随后，在2020年新冠疫情的推动下，人们愈发认识到全球数字化基础设施的强大力量，因为人们变得比以往任何时候都更加依赖它来对抗疫情、远程运营公司、开展线上教学、社交，以及处理许多其他大小事情。

Tom Caulfield格芯首席执行官Tom Caulfield表示，自从社会意识到供应链问题和疫情不是短期危机以来，人们对数字技术的重要性及其将如何永远改变我们生活的认识便不断加深。

他说：“令人惊讶的是，虽然数字化基础设施在过去的十年里变得如此普及和富有弹性，但直到新冠肺炎疫情的爆发，它的潜力才得以充分发掘。我们开始想象的不是‘新常态’，而是‘更好的常态’。这种更好的常态就是利用我们广泛普及的能力扩展和改进数字化基础设施。….这不仅是我们行业的发展良机，也是我们的使命。”

因此，Caulfield说道，格芯发现在这个进程中出现了三个大趋势和一个大阻碍，而格芯解决方案对所有这些都至关重要。第一个大趋势是平顺的网络，这是一种无处不在的“全天候、不间断、7X24小时的安全智能化连接”——我们将在本文稍后更深入地探讨这个问题。

第二个大趋势是虚拟化部署的普及。Caulfield说：“网络功能虚拟化（NFV）就是一个非常好的例子。在这些领域，网络处理在云端进行，且数据从‘哑’接入点传输至云端进行处理。这样就产生了巨大的规模优势，类似于我们现在享受的云存储和云计算价值主张。NFV能够以明显更低的成本和功率大幅提升网络带宽和速度。同时，鉴于虚拟化网络的灵活特性，部署新服务所需的时间和精力得以缩减，因为新功能将通过向用户进行软件‘推送’而不是硬件升级的方式来实现。”

最后一个大趋势是从器件到传感器、从网络边缘到云端的分层人工智能，也即“无处不在的人工智能”。Caulfield表示：“数据是一种新型黄金，但只有当我们将数据从一种原始、非结构化格式中提取出来，并利用它来获得见解、采取行动和做出决策时，才能找到金矿。仅过去两年产生的结构化和非结构化数据的数量就比之前产生的所有数据都要多，然而我们只使用了所有这些数据中的3%。分层人工智能是从大量非结构化数据中提取价值的关键，它通过解析数据来提取重要信息，然后压缩数据以提高计算和存储的传输效率。”

虽然每个大趋势都有其自身的阻碍和挑战，而降低功耗是决定所有大趋势成败的一个关键问题，但向数字化未来的发展步伐是势不可挡的。

平顺的网络即将到来

Peter Gammel格芯移动和无线基础架构业务部副总裁兼首席技术官Peter Gammel表示：“我们对未来网络连接的设想是，您甚至不用知道要连接什么网络，您的设备会自动找到它，对它进行认证，并针对带宽、延迟和其他关键属性进行优化。我们之所以称之为平顺的网络，是因为当我们谈到随着无线系统使用越来越快的射频和毫米波频谱，我们要如何看待未来几年的连通方式时，我们不想迷失在5G、6G、Wi-Fi、蓝牙或其他一些网络协议的细节中。”

“关键在于：无论您通过什么方式连接，网络和设备之间的最后一跳都是采用无线方式，”他说。“这意味着，即使各种设备中的射频（RF）内容已经有了实质性的爆炸增长，但这一趋势只会加速。”

Gammel表示，不仅仅是智能手机、平板电脑和个人电脑将依赖于平顺网络功能。各种不同的产品都将需要它来发挥作用，比如工业4.0（即自动化智能制造）应用、物联网（IoT）、可穿戴医疗保健设备、先进驾驶辅助（ADAS）等汽车系统，以及众多其他应用。

挑战是巨大的。Gammel在2021年IEEE国际可靠性物理学研讨会（IEEE International Reliability Physics Symposium）的主题演讲中说道，关键网络枢纽的数据流量会急剧增长，在某些情况下增长高达40%，而且这些比率在未来几年只会更高。“未来的网络将需要极高的容量和数据速率、更高的频谱效率、超低延迟、更高的可靠性和强大的安全性。”

出色的射频技术将扛起大旗

一切听起来都是那么好，但任何经历过网络连接困难的人可能都会想，我们要如何达到平顺的网络状态。要怎样才能实现这个目标呢？

Gammel说：“我已经在这个行业工作了40年，在这里，衡量成功的方法从未变过，那就是：最后都要归结于在射频技术方面的领导地位，这对前端模块（FEM）及功率放大器的性能和功耗至关重要，而这些又是无线通信系统中最关键的元件。”

他说道，为了最大限度地利用可用频谱，我们正在努力使输出功率尽可能地接近可靠性极限。这就发挥了格芯作为多种不同射频技术的长期领导者的优势，包括RF-SOI（射频绝缘体上硅）、FD-SOI（全耗尽绝缘体上硅）和SiGe（硅锗）解决方案。

Gammel说：“我们的RF SOI解决方案是5G基站和智能手机中集成FEM和波束形成器的首选。同时，由于我们的22FDX™ FD-SOI解决方案将射频、模拟、嵌入式存储器和先进逻辑整合到一个芯片中，它们为数据转换器、LNA、功率放大器（PA）和带收发器的开关等FEM元件的集成提供了出色的峰值性能和能效。”

此外，他表示，格芯的SiGe解决方案广泛用于Wi-Fi和蜂窝功率放大器，SiGe技术为未来网络架构所需的太赫兹频率提供了一条途径。

“更好的还在后头”

Gammel提出了他认为平顺的网络中必不可少的其他因素。他说：“随着行业向太赫兹频率发展，统包式组装和测试能力将变得更加重要，因为电路和封装之间的接口对性能而言变得更加关键。是把天线放在封装上还是放在裸片上？最好的配置是什么？”

另一个必要因素是开放式接口。他说：“专有接口协议永远不会占上风。开放式接口对于构建生态系统至关重要，我们已经在网络基础设施和标准制定活动中看到了这一点。”一个例子是5G开放式无线接入网（Open RAN）倡议。

此外，利用近地轨道（LEO）星座卫星的非地面网络是向信号覆盖不佳的地区提供连接的关键所在。他说：“LEO星座的商业部署不是科幻小说，而是现实。来自SpaceX的星链（Starlink）星座就是一个例子。”

Gammel表示：“要利用从100 GHz到1 THz的大量尚未开发的频谱，还有很多工作要做，并需要进行技术创新，但我们已经取得了很大的进展，更好的还在后头。”

本系列的下一篇文章将重点介绍虚拟化大趋势。敬请期待！

Raytheon Technologies和格芯携手加快5G无线连接技术发展

双方达成战略协作并签订许可协议，共同开发新的氮化镓技术，助力发展未来的无线网络

马萨诸塞州沃尔瑟姆和佛蒙特州伯灵顿，2021年5月19日 – 领先的航空航天和国防科技公司Raytheon Technologies（NYSE：RTX）和全球领先的特殊工艺半导体制造商格芯®（GLOBALFOUNDRIES®，GF®）将协作开发新型硅基氮化镓（GaN-on-Si）半导体并实现其商业化。这种半导体将为5G和6G移动及无线基础设施应用带来颠覆性的射频性能。

根据协议，Raytheon Technologies将授权格芯使用其专有的硅基氮化镓技术和专业知识，在其位于佛蒙特州伯灵顿的Fab 9厂开发这种新型半导体。氮化镓是一种独特的材料，用于制造可耐受高热量和高功率水平的高性能半导体。这种优点使得它非常适合处理5G和6G无线信号，因为这些信号需要比传统无线系统更高的性能水平。

“Raytheon Technologies是推动射频砷化镓技术发展的先驱之一，该技术已经广泛应用于移动和无线市场。同样，在推动氮化镓在先进军事系统中的使用方面，我们也处于前沿，”Raytheon Technologies首席技术官Mark Russell表示，“我们与格芯®（GLOBALFOUNDRIES®）达成的协议不仅展现了我们共同的目标，即以低廉的成本为客户提供高性能的通信技术，同时还将继续证明我们在先进国防技术上的投资如何改善人们的生活，并且保护人们的安全。”

“在这种重要5G实现技术的国内生产方面，格芯®（GLOBALFOUNDRIES®）设在埃塞克斯的晶圆厂处于领先地位，这令我倍感自豪。对于佛蒙特州及至整个美国，这都是一场胜利，”美国参议院拨款委员会主席Patrick Leahy参议员表示，“对于美国的半导体供应链和竞争能力而言，世界一流制造商格芯®（GLOBALFOUNDRIES®）与技术创新领导者Raytheon Technologies之间的这次协作是一大利好消息，在佛蒙特州开发的这种技术将掀起我们生活中的一场革命。”

“格芯®（GLOBALFOUNDRIES®）的创新推动了四代无线通信技术的演进，让40多亿人能够进行通信交流。我们与Raytheon Technologies的协作是一个非常重要的举措，旨在确保关键未来5G应用解决方案的开发和制造能力，”格芯首席执行官Tom Caulfield说道，“此次合作将涉及到众多应用领域，从支持人

工智能的手机和无人驾驶汽车到智能电网，以及政府对数据和网络的访问，这种应用对国家安全至关重要。”

凭借格芯出色的制造能力，结合在射频、测试和封装方面的差异化服务，新的GaN产品将能提升射频性能，同时维持生产和运营成本，让客户能够达到全新功耗水平和功率附加效率（PAE），以满足不断演进的5G和6G射频毫米波工作频率标准。

与Raytheon Technologies的此次协作是格芯的最新战略性合作，它进一步证明了格芯公司致力于通过提供差异化解决方案来重新定义创新前沿，而业界的其他公司仍在采用日趋困难的传统技术升级。

作为深受客户信赖的半导体制造工厂，自2005年以来，格芯在Fab 9厂聘用了将近2,000名员工，在美国聘用了超过7,000名员工。过去10年内，该公司在美国半导体发展方面投资了150亿美元，并计划在2021年将投资增加一倍，目的是提高全球生产能力，满足美国政府和工业客户在安全处理和连接应用方面不断增长的需求。

关于格芯

格芯®（GLOBALFOUNDRIES®）是全球领先的半导体制造商，也是唯一一家真正实现全球运营的半导体制造商。格芯提供功能丰富的解决方案，赋能客户为高增长的市场领域开发普适芯片。格芯拥有广泛的工艺平台及特性，并提供独特的融合设计、开发和生产为一体的服务。格芯拥有遍布美洲、亚洲和欧洲的规模生产足迹，以其灵活性与应变力满足全球客户的动态需求。格芯隶属Mubadala Investment Company。如需了解更多信息，请访问www.globalfoundries.com。

关于Raytheon Technologies

Raytheon Technologies Corporation是一家航空航天和国防公司，致力于为全球各地的商业、军事、政府机构用户提供先进的系统和服务。该公司旗下拥有四家行业领先的企业，包括Collins Aerospace、Pratt & Whitney、Raytheon Intelligence & Space和Raytheon Missiles & Defense，其提供的解决方案推动在航空电子、网络安全、定向能源、电力推进、特超声和量子物理等领域内不断取得突破。该公司是在2020年由Raytheon Company和United Technologies Corporation航空航天业务部门合并组成，总部位于马萨诸塞州沃尔瑟姆。

媒体联系人

Raytheon Technologies and GlobalFoundries Partner to Accelerate 5G Wireless Connectivity

Strategic collaboration and licensing agreement to develop new Gallium Nitride technology will enable future wireless networks

Waltham, Mass. and Burlington, Vt., May 19, 2021 – Raytheon Technologies (NYSE: RTX), a leading aerospace and defense technology company, and GlobalFoundries® (GF®), the global leader in feature-rich semiconductor manufacturing, will collaborate to develop and commercialize a new gallium nitride on silicon (GaN-on-Si) semiconductor that will enable game-changing radio frequency performance for 5G and 6G mobile and wireless infrastructure applications.

Under the agreement, Raytheon Technologies will license its proprietary gallium nitride on silicon technology and technical expertise to GF, which will develop the new semiconductor at its Fab 9 facility in Burlington, Vermont. Gallium nitride is a unique material used to build high-performance semiconductors that can handle significant heat and power levels. This makes it ideal to handle 5G and 6G wireless signals, which require higher performance levels than legacy wireless systems.

“Raytheon Technologies was one of the pioneers advancing RF gallium arsenide technology which has been broadly used in mobile and wireless markets, and we have similarly been at the forefront of advancing gallium nitride technology for use in advanced military systems,” said Mark Russell, Raytheon Technologies’ chief technology officer. “Our agreement with GlobalFoundries not only demonstrates our common goal to make high performance communications technologies available at an affordable cost to our customers, it continues to prove how investments in advanced defense technologies can improve lives, as well as defend them.”

“I am proud that GlobalFoundries’ fab in Essex is leading the way in domestic production of this important 5G-enabling technology and beyond. This is a win for Vermont and a win for the United States,” said Senator Patrick Leahy, Chairman of the Senate Appropriations Committee. “This collaboration between a world-class manufacturer, GlobalFoundries, and Raytheon Technologies, a leader in technological innovation, is good news for the nation’s semiconductor supply chain and competitiveness. The technology that will be produced by Vermonters will be a revolution in our lives.”

“GlobalFoundries’ innovations have helped drive the evolution of four generations of wireless communications that connect over 4 billion people. Our collaboration with Raytheon Technologies is an important step to ensuring the development and manufacturing capability of solutions for critical future 5G applications,” said GF CEO Tom Caulfield. “This partnership will enable everything from AI-supported phones and driverless cars to the smart grid, as well as governments’ access to data and networks which are essential to national security.”

Combined with GF’s manufacturing excellence and differentiated services in RF, testing, and packaging, the new GaN offering will increase RF performance while maintaining production and operational costs, enabling customers to achieve new levels of power and power-added efficiency to meet evolving 5G and 6G RF millimeter-wave operating frequency standards.

This collaboration with Raytheon Technologies is the latest of several strategic partnerships for GF and is further evidence of the company’s commitment to redefine the leading-edge by delivering differentiated solutions, while the rest of the industry continues to pursue traditional and increasingly difficult technology scaling.

As a Trusted semiconductor manufacturing facility since 2005, GF employs nearly 2,000 people at Fab 9, and more than 7,000 people across the U.S. Over the past 10 years the company has invested $15 billion in U.S. semiconductor development and is doubling its planned investment in 2021 to expand global capacity and support growing demand from the U.S. government and industry customers for secure processing and connectivity applications.

About GF

GF is the world’s leading semiconductor manufacturer and the only one with a truly global footprint. GF delivers feature-rich solutions that enable its customers to develop pervasive chips for high-growth market segments. GF provides a broad range of platforms and features with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF has the flexibility and agility to meet the dynamic needs of customers across the globe. GF is owned by Mubadala Investment Company. For more information, visit www.globalfoundries.com.

About Raytheon Technologies

Raytheon Technologies Corporation is an aerospace and defense company that provides advanced systems and services for commercial, military and government customers worldwide. With four industry-leading businesses ― Collins Aerospace, Pratt & Whitney, Raytheon Intelligence & Space and Raytheon Missiles & Defense ― the company delivers solutions that

push the boundaries in avionics, cybersecurity, directed energy, electric propulsion, hypersonics, and quantum physics. The company, formed in 2020 through the combination of Raytheon Company and the United Technologies Corporation aerospace businesses, is headquartered in Waltham, Massachusetts.

Media Contacts

GlobalFoundries
Erica McGill
+1-518-795-5240
[email protected]

Raytheon Technologies
Chris Johnson
C: +1 202-384.2474
[email protected]

与格芯发明大师Shesh Mani Pandey的对话

在格芯，获得“发明大师”头衔的同事至少要拥有20项美国授权专利，并且在技术成就和IP资产创造方面拥有出色的记录。

发明大师表彰计划是一个强大的平台，旨在奖励多产员工并激励有意提交发明申请专利的其他员工。

在激励并指导同事的同时，发明大师还担任顾问，是格芯技术领导者和法律团队在各种技术、战略和知识产权主题方面的强大资源。

我们与马耳他团队的格芯发明大师Shesh Mani Pandey进行了交谈，以了解发明的过程并进一步了解格芯的创新精神。

问：您在格芯的职位是什么？

Shesh：我目前是纽约马耳他Fab 8设备团队的一名高级技术人员。我在半导体行业工作了25年多，担任过各种管理和技术开发职位。我在格芯的所有晶圆厂都工作过，包括新加坡、德国和美国，2012年从德累斯顿搬到Fab 8。我的技术专业知识领域为TCAD（计算机辅助设计技术）和体硅CMOS、FinFET、FD-SOI、纳米线及其他平台的器件设计

能否给我们讲讲您是如何获得“发明大师”称号的？

我在2019年被授予“发明大师”称号。这是我长久以来的一个梦想，终于得以实现。我是多年前在一个人的电子邮件签名中看到“发明大师”这个头衔的，从那以后就念念不忘。当格芯在2018年启动“发明大师”计划时，我再次受到了触动。为了得到这个头衔，我开始努力工作，并加入格芯的发明家精英团体。

专利在您的职业生涯中扮演什么角色？专利让您发生了什么样的改变？

专利在个人、专业和财务方面都有帮助。就个人而言，能够成为公司少数几个拥有这个头衔的人之一，会觉得很有成就感。专利反映了我们在日常工作中的专业知识和经验。

从专业角度来说，专利可能会有助于职业生涯的成长。在财务方面，格芯针对发明者有很多激励措施。

您是如何想出创意的？

我经常从手头项目中遇到的难题以及其他感兴趣的项目中获得发明创意的点子。我喜欢靠近问题而不是远离它。遇到问题时，我们会思考解决这些问题有哪些可能的解决方案，进而就有可能产生发明。概括来讲就是，靠近问题，挑战自己，学习新事物。

您认为成为一名发明家的关键要素是什么？

对我来讲，首先是热情。一个人必须满怀热忱。我觉得一切都是这样。另外，一个人必须有创造力，能跳出思维定势。除此之外，还要清楚地了解主题和流程。团队合作非常有帮助，因为解决某个具体问题时通常涉及多个领域，而一个人不太可能对所有方面都了如指掌。此外，还需要在感兴趣的领域投入足够的时间、拥有丰富的经验，以观大局。

您对新的发明者有什么建议？

第一个发明创意总是最难实现的。格芯拥有成熟的流程可以为发明者提供一臂之力。有想法，但是不知道接下来要做什么？那就联系任何一位知识产权法律团队成员、发明者或发明大师，这样就能顺利进行下去。要充满热情，保持好奇心，具有创造力和竞争力！

Q&A with GF Master Inventor Shesh Mani Pandey

At GlobalFoundries, the title of Master Inventor is reserved for colleagues with at least 20 issued U.S. patents and who have a demonstrated track record of technical accomplishments and intellectual property (IP) asset creation.

The program is a powerful platform for honoring prolific employees as well as motivating other employees who may have been thinking about submitting their inventions for patenting.

Along with inspiring and mentoring their colleagues, Master Inventors serve as advisors and are a resource for GF’s technology leaders and legal team on a range of technical, strategic, and IP topics.

We spoke with GF Master Inventor Shesh Mani Pandey, from our Malta team, to learn about the process of inventing and to get a closer look at the spirit of innovation at GF.

Q: What is your role at GF?

Shesh: I am currently a senior member of the technical staff with the Fab 8 device team in Malta, New York. I’ve been in the semiconductor industry for more than 25 years, in various management and technology development roles. I have experience working at all of GF’s fabs – in Singapore, Germany, and the U.S. – and moved to Fab 8 from Dresden in 2012. My technical expertise is in TCAD (technology computer-aided design) and device design for bulk CMOS, FinFET, FD-SOI, nanowires, and other platforms

Can you tell us about your Master Inventor experience?

I was named a Master Inventor in 2019. It was a dream come true, as this was on my mind for a long time. I saw the title “Master Inventor” in someone’s email signature many years ago, and never forgot it. When GF started its Master Inventor program in 2018, it clicked with me again. I started working hard to achieve this title and join GF’s elite group of inventors.

What role does patents play in your career? How has patenting changed you?

It helps in all personal, professional, and financial aspects. Personally, you get all the satisfaction that you are one of the few people in our company who has this title. It reflects your expertise in your day-to-day work, and your experience.

Professionally, it may help you to grow in your career. Financially, GF has many incentives for inventors.

How do you come up with ideas?

I often get ideas for inventions from challenging issues that arise in the projects I am working on, and from other projects that interest me. I love to be close to issues. When there are problems, we think about possible solutions to address those problems, and that leads to possible inventions. Be close to problems, and challenge yourself to learn new things.

What do you think are the critical components of being an inventor?

For me, the first thing is passion. One has to be passionate about it. I feel that is true for everything. One has to be creative and think outside the box. Other than that, there should be a clear understanding of the subject and process. Working as a team helps significantly, as you may not be the expert of all the topics needed to solve a particular problem. Also, you need enough experience and time invested in your area of interest, in order to see the big picture.

What advice would you give to new inventors?

Your first idea is always the most difficult hurdle. GF has a well-established process to help you. Have an idea, but don’t know what to do next? Please contact any IP Legal team member, inventor, or Master Inventor and it will be smoothly executed. Be passionate, curious, creative and competitive!

PsiQuantum与格芯携手打造全球首台全规模量子计算机

此次合作是全球在光子量子计算领域的首个制造里程碑

加利福尼亚州帕洛阿尔托和纽约马耳他，2021年5月5日——今日，专研100万及以上量子比特计算机的领先量子计算公司PsiQuantum™和全球领先的工艺多样的半导体制造商格芯®（GLOBALFOUNDRIES®，GF®）共同宣布其合作关系取得了重大突破，双方将携手打造全球首台全规模商用量子计算机。目前，两家公司正在制造构成Q1系统基础的硅光和电子芯片，这是PsiQuantum路线图中的第一个系统里程碑，旨在提供具有100万以上量子比特（量子信息的基本单位）的商用量子计算机。

PsiQuantum和格芯展现了出色的核心量子部件（例如：单光子源和单光子探测器）生产能力，遵循格芯先进半导体制造厂的标准制造流程，完成高精度量产。两家公司还在格芯位于纽约北部的两家300mm晶圆厂安装了专有生产和制造设备，以生产数千个Q1硅光芯片，并在位于德国德累斯顿的Fab 1生产先进的电子控制芯片。

量子计算技术有望推动药物研发、材料科学、可再生能源、气候变化减缓和可持续农业等众多行业的巨大进步。PsiQuantum的Q1系统代表着硅光技术的重大突破，该公司也将硅光技术视为打造规模超过100万量子比特以及提供纠错、容错的通用量子计算机的唯一途径。

Q1系统由PsiQuantum杰出的光子量子计算专家团队历时五年潜心研发而成。该团队的使命是将量子计算变为现实，带来改变世界的巨大效益，而这基于以下两点基本认识：1) 一台有用的量子计算机需要100万及以上物理量子比特，才能完成原本不可能完成的计算任务；2) 人们已在半导体行业投入了50多年的时间和数万亿美元，充分利用这些资源是创造商用量子计算机的唯一途径。

“在过去一年里，我们经历了堪比十年的技术变革。现在，由于数字化转型和数据爆炸，我们面临着需要量子计算来进一步加速计算复兴的问题，”格芯计算和有线基础设施战略业务部高级副总裁兼总经理范彦明（Amir Faintuch）表示，“PsiQuantum和格芯的合作意味着PsiQuantum光子量子计算专业知识与格芯硅光制造能力的强强联合，这将改变气候、能源、医疗保健、材料科学和政府等各行各业以及各大技术应用领域。”

格芯领先的硅光制造平台赋能PsiQuantum开发出的量子芯片可以经测量和测试保证性能的长期可靠。这对于能够执行需要数百万或数十亿量子门操作的量子算法而言至关重要。PsiQuantum正与各大公司的研究人员、科学家以及开发人员通力合作，探索和测试涵盖能源、医疗保健、金融、农业、交通和通信等多个行业的量子应用。

PsiQuantum首席战略官兼联合创始人Pete Shadbolt表示：“这是量子和半导体行业的重大成就，证明了可以使用先进半导体晶圆厂的标准制造工艺在硅芯片上构建量子计算机的关键部件。最初设想PsiQuantum的未来时，我们发现系统微缩是一大关键问题。我们与格芯一同验证了硅光制造路径，有信心通过五年左右的时间，让PsiQuantum完全具备组装成品所需的所有生产线和流程。”

PsiQuantum与格芯的合作正在重新定义这一前沿技术，实现从电子到光子的转变，而全球的其它领域还在继续追逐传统的节点微缩。此外，双方的合作得到了安全的本土供应链的支持，在确保美国成为量子计算领域全球领导者方面发挥着关键作用。格芯作为唯一一家全球运营的半导体制造商，提供了广泛的平台和功能丰富的解决方案，赋能我们的客户为高增长的市场领域开发普适产品。 如需了解关于格芯的更多信息，请访问www.globalfoundries.com/cn。

如需了解更多有关Q1系统及其底层架构的信息，可阅读PsiQuantum的相关博客。如需了解更多有关PsiQuantum的信息，请访问www.psiquantum.com。

关于格芯

格芯®（GLOBALFOUNDRIES®）是全球领先的半导体制造商之一，也是唯一一家真正实现全球运营的半导体制造商。格芯提供功能丰富的解决方案，赋能客户为高增长的市场领域开发普适芯片。格芯拥有广泛的工艺平台及特性，并提供独特的融合设计、开发和生产为一体的服务。格芯拥有遍布美洲、亚洲和欧洲的规模生产足迹，以其灵活性与应变力满足全球逾250家客户的动态需求。格芯隶属Mubadala Investment Company。如需了解更多信息，请访问www.globalfoundries.com。

关于PsiQuantum：

PsiQuantum矢志建造全球首台商用量子计算机，其动力来自硅光技术和量子体系结构的突破。PsiQuantum认为硅光技术是扩展至100万以上量子比特以及实现纠错、容错的通用量子计算机的唯一途径。随着量子芯片在一级半导体制造厂中投入生产，PsiQuantum在提供量子计算能力方面独具优势，将与客户和合作伙伴一起推动气候、医疗保健、金融、能源、农业、交通和通信等领域的发展。如需了解更多信息，请访问www.psiquantum.com。

媒体联系人：

格芯
Erica McGill
+1-518-795-5240
[email protected]

PsiQuantum
Gabriele Collier
+1 650-701-6080
[email protected]

© 2021 PsiQuantum。PsiQuantum及其徽标是PsiQuantum, Corp.在美国和其它国家/地区的商标。所有其它商标均为其各自所有者的财产。

PsiQuantum and GlobalFoundries to Build the World’s First Full-scale Quantum Computer

Partnership Achieves World-first Manufacturing Milestone in Photonic Quantum Computing

PALO ALTO, Calif. and Malta, New York – May 5, 2021 – PsiQuantum™, the leading quantum computing company focused on delivering a 1 million-plus qubit quantum computer, and GlobalFoundries® (GF®), the global leader in feature-rich semiconductor manufacturing, today announced a major breakthrough in their partnership to build the world’s first full-scale commercial quantum computer. The two companies are now manufacturing the silicon photonic and electronic chips that form the foundation of the Q1 system, the first system milestone in PsiQuantum’s roadmap to deliver a commercially viable quantum computer with one million qubits (the basic unit of quantum information) and beyond.

PsiQuantum and GF have now demonstrated a world-first ability to manufacture core quantum components, such as single-photon sources and single-photon detectors, with precision and in volume, using the standard manufacturing processes of GF’s world-leading semiconductor fab. The companies have also installed proprietary production and manufacturing equipment in two of GF’s 300mm fabs to produce thousands of Q1 silicon photonic chips at its facility in upstate New York, and state-of-the-art electronic control chips at its Fab 1 facility in Dresden, Germany.

Quantum computing is expected to deliver extraordinary advances across a multitude of industries including pharmaceutical development, materials science, renewable energy, climate mitigation, sustainable agriculture, and more. PsiQuantum’s Q1 system represents breakthroughs in silicon photonics, which the company believes is the only way to scale to 1 million-plus qubits and beyond and to deliver an error-corrected, fault-tolerant, general-purpose quantum computer.

The Q1 system is the result of five years of development at PsiQuantum by the world’s foremost experts in photonic quantum computing. The team made it their mission to bring the world-changing benefits of quantum computing into reality, based on two fundamental understandings: 1) A useful quantum computer capable of performing otherwise impossible calculations requires 1 million-plus physical qubits; and 2) Leveraging the 50-plus years and trillions of dollars invested in the semiconductor industry is the only path to create a commercially viable quantum computer.

“In the past year, we have experienced a decade of technological change. Now, due to the digital transformation and the explosion of data we are faced with problems that require quantum computing to further accelerate the Renaissance of Compute,” said Amir Faintuch, senior vice president and general manager of Compute and Wired Infrastructure at GF. “PsiQuantum and GF’s partnership is a powerful combination of PsiQuantum’s photonic quantum computing expertise and GF’s silicon photonics manufacturing capability that will transform industries and technology applications across climate, energy, healthcare, materials science, and government.”

GF’s leading silicon photonics manufacturing platform enables PsiQuantum to develop quantum chips that can be measured and tested for long-term performance reliability. This is critical to be able to execute quantum algorithms, which require millions or billions of gate operations. PsiQuantum is collaborating with researchers, scientists and developers at leading companies to explore and test quantum use cases across a range of industries, including energy, healthcare, finance, agriculture, transportation and communications.

“This is a major achievement for both the quantum and semiconductor industries, demonstrating that it’s possible to build the critical components of a quantum computer on a silicon chip, using the standard manufacturing processes of a world-leading semiconductor fab,” said Pete Shadbolt, chief strategy officer and co-founder of PsiQuantum. “When we first envisioned PsiQuantum, we knew that scaling the system would be the existential question. Together with GlobalFoundries, we have validated the manufacturing path for silicon photonics and are confident that by the middle of this decade, PsiQuantum will have completely stood up all the manufacturing lines and processes necessary to begin assembling a final machine.”

The PsiQuantum and GF partnership is redefining the leading-edge by enabling the move from electrons to photons, while the rest of the world continues to chase traditional node scaling. Moreover, the partnership is playing a critical role in ensuring the United States becomes a global leader in quantum computing, supported by a secure, domestic supply chain. As the only semiconductor manufacturer with a global footprint, GF provides a broad range of platforms with feature-rich solutions enabling customers to develop pervasive products for high-growth market segments.

For more information about GF, visit www.globalfoundries.com.

For more information about the Q1 system and its underlying architecture, read PsiQuantum’s blog here. For more information about PsiQuantum, visit www.psiquantum.com.

About GF

GlobalFoundries (GF) is one of the world’s leading semiconductor manufacturers and the only one with a truly global footprint. GF delivers feature-rich solutions that enable its customers to develop pervasive chips for high-growth market segments. GF provides a broad range of platforms and features with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF has the flexibility and agility to meet the dynamic needs of its more than 250 customers across the globe. GF is owned by Mubadala Investment Company. For more information, visit www.globalfoundries.com.

About PsiQuantum:

PsiQuantum is on a mission to build the world’s first commercially viable quantum computer, powered by breakthroughs in silicon photonics and quantum architecture. PsiQuantum believes silicon photonics is the only way to scale beyond one million qubits and deliver an error-corrected, fault-tolerant, general-purpose quantum computer. With quantum chips now being manufactured in a tier-one semiconductor fab, PsiQuantum is uniquely positioned to deliver quantum capabilities that drive advances with customers and partners across climate, healthcare, finance, energy, agriculture, transportation and communications. To learn more, visit www.psiquantum.com.

Media Contacts:

GlobalFoundries
Erica McGill
+1-518-795-5240
[email protected]

PsiQuantum
Gabriele Collier
+1 650-701-6080
[email protected]

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GLOBALFOUNDRIES Moves Corporate Headquarters to its Most Advanced Semiconductor Manufacturing Facility in New York

Malta, New York, April 26, 2021 – GLOBALFOUNDRIES® (GF®), the global leader in feature-rich semiconductor manufacturing, announced today at an onsite event with Senate Majority Leader Chuck Schumer that it will relocate its headquarters to Malta, New York, the site of Fab 8, the company’s most advanced semiconductor manufacturing facility — as the company positions itself for growth, strengthens partnerships with customers and recruits new talent. This change is effective today.

GF has invested more than $15 billion in its Fab 8 facility over the last decade to support innovation and manufacturing capacity. In 2021, the company is doubling its planned investment to expand global capacity, with $500 million targeted for Malta, NY alone.

The move from GF’s previous headquarters to its state-of-the-art fab in New York is part of the company’s commitment to address the soaring global chip demand, with a focus on semiconductor manufacturing innovation. GF will maintain a substantial presence in Santa Clara, California, in the heart of Silicon Valley, where many of GF’s leading U.S. customers and ecosystem partners are based.

“Today, GF’s Fab 8 in New York is a $15 billion advanced semiconductor manufacturing facility and one that is playing a key role in the transformation of our industry to meet rapidly accelerating demand,” said GF CEO Tom Caulfield. “As a native New Yorker, son of a NYC firefighter, and manufacturer at heart, I am personally proud to be making upstate New York GF’s new headquarters. Our amazing 3,000-person workforce, in partnership with our local, state, and federal leaders, will together build on GF’s success, solidifying the Empire State’s place as one of a few world-class semiconductor manufacturing hubs at a time when our national and economic security depends more and more on what we can make here at home.”

Caulfield added, “I would like to thank Senator Schumer for his steadfast support for GF over the years and his tireless leadership in forging a bipartisan coalition in Congress that together with the Administration fully appreciates the need for a secure and resilient domestic semiconductor supply chain. The time for the Endless Frontier Act is now, and once approved by Congress and signed into law by President Biden, GF stands ready to do our part by expanding in upstate New York and creating many more high-paying American jobs. Our ambitious goal is to double our capacity at this site in the years to come in partnership with our customers, local, state and federal governments. We can do this.”

“GlobalFoundries’ transition of its headquarters to Fab 8 in Malta is further indication of the company’s commitment to growth in New York and to the Empire State’s leadership in the semiconductor industry,” said Senate Majority Leader Chuck Schumer, who successfully passed into law new federal semiconductor manufacturing and R&D incentives in last year’s National Defense Authorization Act (NDAA). “The chips that GlobalFoundries manufactures here in Malta are critical to our national security and to our economic competitiveness across key industries. I have worked closely with GlobalFoundries over the years to look for opportunities to expand their presence in New York and I am now pushing to secure the federal funds necessary to implement programs we passed into law last year to support further expansion of domestic chip production by companies like GlobalFoundries, accelerating even more growth in the semiconductor industry across Upstate New York.”

GF employs more than 15,000 globally with 7,000 people across the U.S., and nearly 3,000 at its Fab 8 in Malta, New York. In 2020, GF announced a land purchase option to provide additional flexibility to expand Fab 8’s footprint to support growing demand from the U.S. government and industry customers.

Semiconductor chips are more pervasive than ever, becoming one of humankind’s most vital resources, from smartphones and automobiles to technology in schools and hospitals, modern society can no longer survive without them. GF is a trusted provider to 250 customers worldwide including the US Government.

About GF

GLOBALFOUNDRIES (GF) is one of the world’s leading semiconductor manufacturers and the only one with a truly global footprint. GF delivers feature-rich solutions that enable its customers to develop pervasive chips for high-growth market segments. GF provides a broad range of platforms and features with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF has the flexibility and agility to meet the dynamic needs of its more than 250 customers across the globe. GF is owned by Mubadala Investment Company. For more information, visit www.globalfoundries.com.

Media Contacts

GLOBALFOUNDRIES
Erica McGill
+1-518-795-5240
[email protected]