Dolphin Integration Joins GlobalFoundries FDXcelerator™ Program to Provide Breakthrough Fabric IP October 17, 2017Dolphin has joined the GlobalFoundries FDXcelerator™ ecosystem with its breakthrough SoC Fabric IP, compliant with Dolphin Integration’s “DELTA” rules, to streamline and speed-up the design of cost-effective low-power SoC in 22FDX®.
Dolphin Integration加入格芯FDXcelerator™计划以提供突破性的Fabric IP October 16, 2017Dolphin has joined the GlobalFoundries FDXcelerator™ ecosystem with its breakthrough SoC Fabric IP, compliant with Dolphin Integration’s “DELTA” rules, to streamline and speed-up the design of cost-effective low-power SoC in 22FDX®.
GTC 2017 and the Future of Technology: Part 2 October 13, 2017By: Dave Lammers In all my years as a tech journalist, I’ve rarely been witness to a story as interesting as what is happening in the automotive sector. What could be more fascinating than the race to move beyond today’s gas-powered cars with all-too-human drivers at the wheel? Will young people, the so-called Generation X drivers, embrace autonomous driving and EVs? Will the concerns about safety, pollution and natural resources contribute to the push for EVs and the ADAS technologies? And yes, national governments are all competing to make sure that their domestic automotive industries take a pole position. GF has a lot going for it in automotive. When I moved to Austin in 1998 and started covering Motorola’s automotive semiconductors, I found managers very positive about the support from Chartered Semiconductor Manufacturing Ltd., now a part of GF. And having a fab in Dresden, located nearby Europe’s leading automotive OEMs, is another plus. To capitalize on its advantages, GF is packaging them together in a new automotive-focused platform, AutoPro™. The goal is to make sure customers have all of the foundry’s automotive technology solutions and manufacturing services available under one roof, enabling customers to quickly obtain quality certifications and minimize their time-to-market. There is little doubt that the efforts to develop ADAS and EV technologies are fast moving. Mark Granger, vice president of Automotive Product Line Management at GF, predicted at GTC 2017 that by 2020 there will be “a couple hundred thousand fully autonomous cars” on the road. “Over the next 10, 20, 30 years, autonomous cars have the chance to really save lives, and provide mobility for older drivers. Statistically the loss of life around the world (from auto accidents) is equivalent to losing a 747 (load of passengers) a week. That is a staggering statistic. If we can resolve the ADAS safety challenges, we will be doing something for the world.” To get there, Granger presented a long list of technology challenges, ranging from lidar to image processing to automotive-use 5G. And on top of ADAS, he noted the advances in electric vehicles that are likely to come in parallel. Automotive, Granger said, represents a “slew of opportunities, including sensors around the car, so the car can see and understand and react to the world around it. A car will become a data center on wheels. And much of that processing capability will be located in the car, because no one wants to be in a car that depends on a (wireless) link to drive, even in a parking garage.” Sanjay Jha, the CEO of GF, spoke about the demands that ADAS systems place on the sensors, radar and ICs to engage in “real-time management.” Noting that a car traveling at 70 mph, or 100 feet per second, must be able to see obstacles, make a decision, and engage the brakes, all within a distance of 100 feet, Jha said the ADAS systems must be able to do “an enormous amount of computation within a millisecond.” An ADAS-enabled car will include sonar and as many as 16 cameras per car. “The car must be able to take braking action while taking in data from the cameras. It will drive consumption of square kilometers of silicon in the industry, and bring in changes from Von Neumann architectures to distributed computing. This will be a huge and powerful driver for the semiconductor industry.” 22FDX® technology is aimed squarely at these ADAS-enabled cars, with Fab 1in Dresden, Germany and, later, Fab 11 in Chengdu, China positioned to supply automotive-use ICs. Granger noted that for automotive lidar, GF is working with customers on both silicon germanium- and CMOS-based lidar solutions. “We are working in Fab 1 on 22FDX and SiGe for long-range radar, 40nm CMOS or 22 FDX for short-range, and 28nm or 22nm for camera sensors. The controllers for power windows and others are on our mature nodes, and of course, with the advanced nodes we support the very hefty processing elements that will go into cars for centralized control.” Overall, the total available market (TAM) for automotive ICs will grow from $35 billion now to $54 billion by 2023. The ADAS content will grow by a 20 percent CAGR, driven by sensors and processing power, while analog and power still retain a majority of the market. “GF has a wide range of capabilities and can serve every one of these markets,” Granger said. It will be interesting to watch the role played by China, a nation with a major air pollution problem. China’s government is steering urban consumer toward EVs by reducing taxes and easing the difficult bureaucratic path to getting a car license. The race is on to see which companies, and which countries, will take the lead in tomorrow’s connected car market. With GF’s experience at its major fab sites, its diversity of technologies, and the new AutoPro platform, it appears to have the right tools to help customers win this most exciting competition. About Author Dave Lammers Dave Lammers is a contributing writer for Solid State Technology and a contributing blogger for GF’s Foundry Files. Dave started writing about the semiconductor industry while working at the Associated Press Tokyo bureau in the early 1980s, a time of rapid growth for the industry. He joined E.E. Times in 1985, covering Japan, Korea, and Taiwan for the next 14 years while based in Tokyo. In 1998 Dave, his wife Mieko, and their four children moved to Austin to set up a Texas bureau for E.E. Times. A graduate of the University of Notre Dame, Dave received a master’s in journalism at the University of Missouri School of Journalism.
Cadence Announces Digital and Signoff Flow Support for Body-Bias Interpolation for GLOBALFOUNDRIES 22FDX™ Process Technology October 13, 2017Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its digital and signoff flow, from synthesis to timing and power analysis, supports body-bias interpolation for the GLOBALFOUNDRIES 22FDX™ process technology.
Rambus Delivers High-Speed SerDes Interface Solutions on GLOBALFOUNDRIES FX-14™ ASIC Platform for Data Center and Enterprise October 13, 2017Rambus Inc. (NASDAQ: RMBS), a leading provider of semiconductor and IP products, today announced the availability of a suite of silicon-proven, high-speed SerDes solutions including 16G MPSL (multi-protocol serial link), 30G C2C (chip-to-chip) and 30G VSR (very short reach) PHYs developed for GLOBALFOUNDRIES high-performance FX-14™ ASIC platform.
GLOBALFOUNDRIES Introduces New Automotive Platform to Fuel Tomorrow’s Connected Car October 12, 2017AutoPro™ provides a full range of technologies and manufacturing services to help carmakers harness the power of silicon for a new era of ‘connected intelligence’ Santa Clara, Calif., October 12, 2017 — GLOBALFOUNDRIES today unveiled AutoPro™, a new platform designed to provide automotive customers a broad set of technology solutions and manufacturing services that minimize certification efforts and speed time-to-market. The company offers the industry’s broadest set of solutions for a full range of driving system applications, from informational Advanced Driver Assistance Systems (ADAS) to high-performance real-time processors for autonomous cars. Today, the automobile semiconductor market is approximately $35 billion, and is expected to grow to an estimated $54 billion by 2023. This is driven by a need for new technologies that promise to enhance the driving experience such as navigation, remote roadside assistance, and advanced systems that combine data from multiple sensors with high-performance processors that make control decisions. “As vehicles move rapidly toward greater autonomy, auto manufacturers and parts suppliers are designing new ICs,” said Gregg Bartlett, senior vice president of the CMOS Business Unit at GF. “GF’s diverse automotive platform combines a range of technologies and services that meet the complexity and requirements for applications that enable connected intelligence for the automotive industry.” Building on 10 years of automotive experience, the company’s AutoPro technology platform includes offerings in silicon germanium (SiGe), FD-SOI (FDX™), CMOS and advanced FinFET nodes, combined with a broad range of ASIC design services, packaging and IP. GF’s CMOS and RF solutions deliver an optimal combination of performance, integration and power efficiency for advanced sensors (radar, lidar, cameras), ADAS and autonomous processing (sensor fusion and AI compute) and body and powertrain control, with embedded eNVM technology for in-vehicle MCUs, as well as connectivity and infotainment systems. The company’s BCD and BCDLite® technologies provide high-voltage capabilities, with a path to supporting 48 volts that enable automotive power solutions for electric powertrain, Hybrid-electric (HEVs) and Internal Combustion Engine (ICE) vehicles. These automotive solutions are available now, with additional access to quality and service across GF’s manufacturing fabs in the U.S., Europe, and Asia. GF AutoPro solutions support the full range of AEC-Q100 quality grades from Grade 2 to Grade 0. AutoPro Service Package In addition to GF’s technology platform, the company has initiated its AutoPro Service Package designed to ensure technology readiness, operational excellence and a robust automotive-ready quality system to continually improve quality and reliability throughout the product life-cycle. GF’s Service Package builds on the company’s proven automotive quality and operational controls, providing customers access to the latest technologies which are designed to meet strict automotive quality requirements defined in the ISO, International Automotive Task Force (IATF), Automotive Electronics Council (AEC), and VDA (German) standards. GF is currently working with major OEM customers and suppliers to develop and produce chips of the optimum quality and reliability as required by the various automotive applications. Audi “Vorsprung is our promise. To deliver an unmatched mobility experience the need for strong semiconductor manufacturing partners is greater than ever. The GF Automotive portfolio and program, focused on providing innovative technologies and manufacturing capabilities combined with an automotive mindset, is important for the automotive industry. It is an essential program to deliver our next generation car electronics faster and reliable.”Berthold Hellenthal, Head of Audi Semiconductor Strategy, Progressive SemiConductor Program – PSCP Silicon Mobility “The automotive sector is rapidly evolving and innovative technology will be a critical component for paving the way for the autonomous, electrified and connected car. Our long standing relationship with GF, a global foundry with a roadmap committed to the future automotive market, helps enable our customers to have the highest quality, reliability and support for the manufacturing of our automotive products.”Bruno Paucard, CEO of Silicon Mobility u-blox “As a global leader in positioning technology, it’s important for u-blox to partner with innovative companies that deliver customized semiconductor solutions for our chipsets. We have a long-standing and close collaboration with GF, and we look forward to working together to support new applications such as autonomous cars, enhanced safety, and high-bandwidth secure wireless connectivity.”Thomas Seiler, CEO at u-blox ABOUT GF GLOBALFOUNDRIES is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GLOBALFOUNDRIES makes possible the technologies and systems that transform industries and give customers the power to shape their markets. GLOBALFOUNDRIES is owned by Mubadala Investment Company. For more information, visit https://www.globalfoundries.com. Contacts: Erica McGillGLOBALFOUNDRIES(518) 795-5240[email protected]
Rambus在面向数据中心和企业的格芯 FX-14™ASIC平台上推出高速SerDes接口解决方案 October 12, 2017Rambus Inc. (NASDAQ: RMBS), a leading provider of semiconductor and IP products, today announced the availability of a suite of silicon-proven, high-speed SerDes solutions including 16G MPSL (multi-…
Cadence宣布格芯22FDX™工艺技术的数字签名流程支持Body-Bias Interpolation October 12, 2017Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its digital and signoff flow, from synthesis to timing and power analysis, supports body-bias interpolation for the GLOBALFOUNDRIES 22FDX™ process technology.
ArterisIP Joins GLOBALFOUNDRIES FDXcelerator Partner Program October 10, 2017ArterisIP, the innovative supplier of silicon-proven commercial system-on-chip (SoC) interconnect IP, today announced it has joined the GLOBALFOUNDRIES FDXcelerator™ Partner Program.
ArterisIP 加入格芯FDXcelerator合作伙伴项目 October 10, 2017ArterisIP, the innovative supplier of silicon-proven commercial system-on-chip (SoC) interconnect IP, today announced it has joined the GLOBALFOUNDRIES FDXcelerator™ Partner Program.
