BAE Systems collaborates with GlobalFoundries to produce radiation-hardened single board computers for space August 23, 2021The RAD510 will provide more advanced processing while demanding less power from its spacecraft than the industry standard RAD750
GlobalFoundries Sets “Journey to Zero Carbon” Goal to Reduce Greenhouse Gas Emissions by 25% while Expanding Global Manufacturing Capacity August 19, 2021Malta, New York, August 19, 2021 – GlobalFoundries (GF), the global leader in feature-rich semiconductor manufacturing, today announced its goal to reduce greenhouse gas emissions by 25% from 2020 to 2030, as the company expands its global manufacturing capacity. Building on GF’s history of environmental responsibility and ongoing greenhouse gas emissions reduction, this new Journey to Zero Carbon initiative reinforces the company’s commitment to sustainable and environmentally efficient manufacturing operations. To meet the goal of reducing absolute greenhouse emissions by 25%, GF will apply a variety of approaches and investments tailored to its global manufacturing footprint. These approaches include enhancing manufacturing emission controls, further improving energy efficiency, and sourcing renewable and lower-carbon energy. The 25% reduction goal encompasses all of GF’s fabs and will include its newest fab currently under construction in Singapore. “We recognize climate change is an unprecedented global challenge, and Journey to Zero Carbon is GF’s commitment to growing responsibly and reducing our emissions in a meaningful way,” said GF CEO Tom Caulfield. “GF has a proven track record of environmentally responsible manufacturing and operations, and Journey to Zero Carbon is the natural next step for us to take. It’s the right thing do to – for our business, for our global team, and for our planet.” GF’s Journey to Zero Carbon initiative supports the aims of the Paris Agreement, which calls for significant reductions by 2030 on a path to global “Net Zero” greenhouse gas emissions by 2050. GF’s announcement is aligned with the company’s “Journey to Zero” efforts aimed at workplace safety and environmental responsibility. To learn more about GF’s Journey to Zero Carbon and other environmental, social and corporate governance initiatives, please view our 2021 Corporate Responsibility Report at: https://gf.com/about-us/corporate-responsibility About GF GlobalFoundries (GF) is one of the world’s leading semiconductor manufacturers and the only one with a truly global footprint. GF delivers feature-rich solutions that enable its customers to develop innovative products for high-growth markets. GF provides a broad range of feature-rich process technology solutions with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF is a trusted technology source to its customers across the globe. GF is owned by Mubadala Investment Company. For more information, visit www.gf.com. ### Media Contact Michael Mullaney GlobalFoundries +1-518-305-1597 [email protected]
格芯确立“零碳之路”目标，在扩大全球制造产能的同时减少25%的温室气体排放 August 19, 2021纽约马耳他，2021年8月19日 – 全球领先的特殊工艺半导体制造商格芯（GF）今日宣布其“零碳之路”目标，即在扩大全球制造产能的同时，从2020年至2030年减少25%的温室气体排放。这一全新的“零碳之路”计划秉承了格芯致力于履行环境责任和温室气体减排的悠久传统，加强了该公司努力实现可持续发展和高效环保制造业务运营的承诺。 为了达到将绝对温室气体排放减少25%的目标，格芯将应用针对其全球制造工厂量身定制的各种不同方法并为此进行投资。这些方法包括增强制造排放控制，进一步提高能源效率，以及采购可再生的低碳能源。25%的减排目标涵盖了格芯所有的晶圆厂，包括目前正在新加坡建设的新晶圆厂。 格芯首席执行官Tom Caulfied表示：“我们认识到，气候变化是一场前所未有的全球性挑战，格芯的‘零碳之路’计划旨在努力履行更多环境责任和有效减少排放。格芯在制造运营过程中的环境责任方面一向都表现出色，‘零碳之路’是我们即将采取的下一个举措。对于我们的企业、我们的团队及至我们生活的地球而言，这都是正确的做法。” 格芯的“零碳之路”计划将帮助我们实现《巴黎协定》的目标，该协定呼吁到2030年大幅减少碳排放，到2050年实现“净零”温室气体排放。格芯本次宣布的消息符合该公司“零碳之路”计划的宗旨，也就是确保工作场所安全和履行环境责任。 要详细了解格芯的“零碳之路”以及其他环境、社会和公司治理计划，请查看我们的2021年企业责任报告：https://gf.com/about-us/corporate-responsibility 关于格芯 格芯（GF）是全球领先的半导体制造商之一，也是唯一一家真正实现全球运营的半导体制造商。格芯提供功能丰富的解决方案，赋能客户为高增长的市场领域开发普适芯片。格芯拥有广泛的工艺平台及特性，并提供独特的融合设计、开发和生产为一体的服务。格芯拥有遍布美洲、亚洲和欧洲的规模生产足迹，以其灵活性与应变力满足全球逾250家客户的动态需求。格芯隶属Mubadala Investment Company。如需了解更多信息，请访问www.globalfoundries.com/cn。
Exciting visit August 12, 2021 Armin Laschet, Chairman of the CDU Germany, with GF Managing Director Dr. Manfred Horstmann and employees from our team at a press event in Fab 1 in Dresden. During his summer tour at our site today, the candidate for chancellor found out more about semiconductor production and the expansion plans for our factory.
Joint press release: TU Dresden, University of Manchester and GlobalFoundries achieve breakthrough in AI cloud systems July 27, 2021 Source: TU Dresden TU Dresden, University of Manchester, Racyics GmbH and Globalfoundries (GF) today announced the tapeout of the SpiNNaker2 chip – a new artificial intelligence chip inspired by the human brain. Based on the SpiNNaker infrastructure developed by the University of Manchester, the hybrid AI architecture realized at the TU Dresden, the adaptive body-bias IP platform ABX by Racyics and using the 22FDX solution by Globalfoundries, SpiNNaker2 is a neuromorphic AI Real-time processor with unprecedented efficiency and sub-millisecond latency for event-based systems. SpiNNaker2 is designed to scale up to a cloud system with 70,000 chips under real-time operation, making it a key building block for real-time AI at extremely high data rates. SpiNNaker2 will have a disruptive impact on AI applications such as smart cities, 5G, tactile internet and autonomous driving because no other current hardware meets the simultaneous requirements of low latency, high throughput and energy efficiency. The complete 10 million processor machine SpiNNaker2, called “SpiNNcloud,” is used at the TU Dresden for research purposes. At the same time, the startup “SpiNNcloud Systems GmbH” wants to make SpiNNaker2 commercially available. Artificial intelligence is having an ever-increasing impact on our daily lives. However, current AI hardware and algorithms are only partially inspired by the human brain. Even the best AI hardware currently is a far cry from the 20-watt power consumption, low latency, and unparalleled high-throughput processing power offered by the human brain. SpiNNaker2 is a multiprocessor system for event-based real-time processing of both classic AI and future event-based calculation paradigms inspired by the brain’s holistic, efficiency-optimized and demand-oriented processing. SpiNNaker2 was developed as part of the EU research project “Human Brain Project.” The backbone of the system is a bespoke, lightweight communications infrastructure that scales from edge devices to large server cloud applications without suffering the inherent slowdown typically associated with scaling computations to cloud size. Prof. Steve Furber (University of Manchester): “There is still a lot to learn from biology if we want to exploit the full potential of AI in the future. SpiNNaker2 is designed to bridge the gap between realistic brain models and AI so that both can increasingly benefit from each other.” With the SpiNNaker2 chip, a SpiNNcloud with 70,000 chips and 10 million cores is to be set up at the TU Dresden, which, together with local initiatives such as the CeTI Cluster of Excellence and other national and international partners, is to research applications ranging from autonomous driving to data processing in real time in a smart city, tactile internet applications to biomedical processing. “Our holistic, economy-optimized system design, combined with a unique hybrid AI framework, enables real-time AI on an unprecedented scale. We will use the SpiNNaker2 machine at the TU Dresden to conduct cutting-edge research on novel machine learning, but we are also proud to be able to offer this unique AI commercially through our startup SpiNNcloud Systems,” explains Prof. Christian Mayr, Chair of Highly Parallel VLSI -Systems and Neuromicroelectronics at the Faculty of Electrical Engineering and Information Technology at the TU Dresden. SpiNNaker2 was realized in the 22FDX ecosystem using Racyics GmbH’s Adaptive Body Biasing IP (ABX) platform to leverage the full potential of 22FDX. This IP platform enables SpiNNaker2 to operate at the minimum power point of the processing units at 0.50V with additional support for dynamic voltage and frequency scaling for high performance on demand. SpiNNaker2 thus uses the advanced power-saving properties of 22FDX, Globalfoundries Dresden’s flagship technology. The complete chip design was performed by the TU Dresden team using makeChip, a design environment for 22FDX provided by Racyics. This approach was crucial for the academic group, 22FDX™, GlobalFoundrie’s unique 22nm FD-SOI technology, proves to be the ideal basis for modern AI chips directly inspired by the human brain with its worldwide unique low power consumption and optimized transistor performance. GF’s 22FDX™ technology, manufactured in Dresden, enables highly efficient neuromorphic real-time calculations with a latency of less than one millisecond, as required for AI applications such as smart cities, 5G, tactile internet, autonomous driving. The 22FDX-based SpiNNaker2 chip shows the synergies that are possible when European cutting-edge AI research meets European semiconductor technology: For the first time, the existing gap between AI optimized purely for numerical performance and real brain-inspired AI is closed. “As the world’s leading specialty foundry, Globalfoundries enables world-class teams to achieve commercial breakthroughs. SpiNNaker2 is tangible proof of the outstanding performance achieved by combining the latest advances in brain-inspired artificial intelligence and our high-performance 22FDX technology,” says Dr. Manfred Horstmann, head of Globalfoundries Dresden. The tapeout was financially supported by ERDF and the Free State of Saxony in the ‘SpiNNcloud’ project (application number: 100373652). We thank ARM for IP use. Information for journalists: Globalfoundries Karin Rath’s email: [email protected] TU Dresden Prof. Christian Mayr Email: [email protected] University of Manchester Jordan Kenny Email: [email protected] Racyics GmbH Holger Eisenreich Email: [email protected] SpiNNcloud Systems GmbH Christian Eichhorn Email: [email protected]
A New GF Brand for a New Era of More July 19, 2021by Michelle Leyden Li, Vice President and Head of Global Brand and Marketing People around the world rely on semiconductor chips every day, throughout the day, and most don’t even know it. Chips are everywhere – inside everything from appliances to thermostats, smartphones to automobiles, and industrial equipment to medical devices. In fact, just one automobile may have as many as 1,500 chips. These incredibly complex feats of human ingenuity power our world, fuel the global economy and enrich our lives. At GlobalFoundries (GF), we know that our role as one of the world’s leading semiconductor chip manufacturers is vital to humanity, and we don’t take that role lightly. In fact, over the last few years we’ve transformed our company to ensure that our customers can rely on us to deliver innovative, feature-rich process technology solutions for manufacturing chip designs, used in the most demanding and in-demand applications. For example, if you have a 5G-enabled smartphone, chances are that 5G signal passes through a chip manufactured by GF. Reliable access to semiconductor chips has also become imperative to countries’ economic and national security. GF is one of only five companies in the world that can manufacture chips at scale for these increasingly complex and vital supply chains, and it’s the only one with a global footprint, providing our customers with unimpeded access to a trusted technology source. Today, we’ve reached an exciting point in our journey as we introduce a new GF brand. Our new brand is the culmination of our transformation journey and the embodiment of the new GF. I’m excited to share it with you. Delivering a new era of more Four essential components make our company and brand story uniquely ours: First, we are redefining innovation and semiconductor manufacturing. We believe that semiconductor manufacturing innovation is about making chips smarter, not just smaller. That’s why we work hand in hand with our customers, collaborating to develop and manufacture feature-rich solutions that provide the leadership performance vital to many growing markets. Unlike compute-centric chips, feature-rich chips enable specific features such as touchscreens, streaming movies and secure pay, and new generations of these chips will require greater security and lower power consumption even as they enable our customers to push the envelope of innovation. GF innovation and semiconductor manufacturing expertise makes that possible. Second, our global manufacturing footprint advantage. GF’s manufacturing facilities are geographically dispersed with large manufacturing centers in North America, Europe and Asia. Our global footprint provides a level of flexibility and accessibility that no other semiconductor manufacturer can offer its customers. Third, collaboration and partnership with our customers. We’ve reinvented the customer-supplier dynamic in the semiconductor industry to enable a more tightly aligned partnership. We are leading the transformation to a more evolved “fabless/foundry” model that is predicated on long-term collaboration. It makes it possible for our customers to focus on chip design innovations that advance critical applications, while we focus on process technology feature innovations ensuring that those designs can be manufactured in high volume and within critical time-to-market windows. This new model ensures predictability, repeatability, and sustainability for GF and our customers, which is now more vital than ever. Fourth, diversity throughout our company. We have the most diverse workforce in the global semiconductor manufacturing industry, which increases our ability to innovate and enables better collaboration with our customers worldwide. GF would not be one of the world’s leading semiconductor companies without the diversity of ideas, thought and backgrounds that the approximately 15,000 members of our global workforce bring to meeting and exceeding the needs of our customers each and every day. A new visual identity that represents the new GF while honoring our heritage GF’s new visual identity captures the essence of who we are as a company, and what and how we contribute to society, while honoring our heritage: Our logo: our new brand logo is the combination of a logomark and a word mark. The logomark is a reductive design of our two-letter GF name and the reductive nature of the design represents our brand story. The left-hand side of the “g” in the logomark is fashioned using a half circle and a quarter circle. The circle shapes are representative of a globe highlighting our global footprint as well as a semiconductor wafer. The middle shape is shared between the “g” and the “f,” signifying partnership and collaboration, core indicators of the relationships we have with our customers. Two squares that define the remainder of the “f” signify the chips, and stacked one on top of the other, make an equal sign that we use to communicate our brand story. Our colors: our new visual identity retains use of the color orange, allowing GF to retain our earned brand equity in that color, while reflecting our bold personality as well as our optimism and warmth. We have added yellow and purple to our color palette to communicate our warmth and our boldness. Our visual imagery: our new brand steers away from the industry norm of techie and graphic abstract images, and instead focuses on the scope and humanity of GF. These global, people-centric, inspired images reiterate our global footprint and presence. Overall, GF’s new visual identity has been meticulously crafted to be bold, innovative, inviting and simple. Our brand reflects who we are, highlighting the vital role we play in the world. In fact, at the very moment you are reading this, it’s likely you’re just a few feet away from a chip manufactured by GF. That’s a true story, and it’s our story.
GlobalFoundries Plans to Build New Fab in Upstate New York in Private-Public Partnership to Support U.S. Semiconductor Manufacturing July 19, 2021 Malta, New York, July 19, 2021 – GlobalFoundries (GF), the global leader in feature-rich semiconductor manufacturing, today announced its expansion plans for its most advanced manufacturing facility in upstate New York over the coming years. These plans include immediate investments to address the global chip shortage at its existing Fab 8 facility as well as construction of a new fab on the same campus that will double the site’s capacity. The announcement was made as the company convened leaders from government and industry to progress the national discussion around solving U.S. semiconductor supply chain challenges. CEO Tom Caulfield was joined by U.S. Senate Majority Leader Chuck Schumer, U.S. Secretary of Commerce Gina M. Raimondo, former Pentagon officials, and executives from leading companies throughout the semiconductor supply chain. GF will invest $1 billion to immediately add an additional 150,000 wafers per year within its existing fab to help address the global chip shortage. Following that, GF plans to construct a new fab that will create more than 1,000 new direct high-tech jobs and thousands more indirect jobs including high-paying construction jobs for the region. Following the successful investment model of Fab 8, GF is planning to fund the new facility through private-public partnerships including customers, federal and state investments. This new capacity will serve the growing demand for secure, feature-rich chips needed by high-growth markets including automotive, 5G connectivity and the Internet of Things. The facility will also support national security requirements for a secure supply chain. These investments to expand GF’s U.S. manufacturing footprint are part of the company’s broader global expansion plans that include the recently announced new fab in Singapore and $1 billion planned investment to expand in Germany, all to meet the growing demand from customers worldwide. “Our expansion and job creation in Malta requires a new economic model, based on the bold public-private partnerships being championed in Washington by visionary leaders Senator Schumer and Secretary Raimondo, as well as close collaboration with our customers,” said GF CEO Tom Caulfield. “Our industry is expected to grow more in the next decade than it did in the past 50 years and GF is stepping up to do its part as we work together to address the growing demand for technology innovation for the betterment of humanity. We are honored to be joined by government and automotive leaders, national security experts, and our valued customers to continue the critical discussions needed to create a reliable supply of American-made chips to support the U.S. economy and national security.” “I’ve led the fight to establish historic federal incentives for semiconductor manufacturing and R&D to strengthen the domestic semiconductor supply chain that is critical to our national security and global competitiveness, including addressing the chip shortage impacting industries across the economy, all in hopes of bringing us to announcements like this today,” said Sen. Schumer. “As Majority Leader, I worked hard with companies like GlobalFoundries to craft and pass the bipartisan U.S. Competition and Innovation Act, providing $52 billion to expand the domestic semiconductor industry and supercharge the GlobalFoundries expansion of Fab 8 and building a new fab in Malta. Today’s announcement is a win-win-win: a win for jobs in the Capital Region, a win for GlobalFoundries, and a win for U.S. government, automakers, and other critical industries that desperately need chips.” GF employs more than 15,000 worldwide with 7,000 people across the U.S., and nearly 3,000 at its headquarters in Malta, New York. GF has invested more than $15 billion in its Fab 8 facility over the last decade to support innovation and increase manufacturing capacity. As an accredited supplier of advanced semiconductors to the U.S. government, GF delivers secure and reliable semiconductor solutions at Fab 8, which is compliant with the U.S. International Traffic in Arms Regulations (ITAR). Moreover, GF offers the highest industry, customer and government criteria for secure manufacturing, worldwide, through its GF Shield program. About GF GlobalFoundries (GF) is one of the world’s leading semiconductor manufacturers and the only one with a truly global footprint. GF delivers feature-rich solutions that enable its customers to develop innovative products for high-growth markets. GF provides a broad range of feature-rich process technology solutions with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF is a trusted technology source to its customers across the globe. GF is owned by Mubadala Investment Company. For more information, visit www.gf.com. ### Media Contacts Erica McGillGlobalFoundries(518) 795-5240[email protected] Michael MullaneyGlobalFoundries(518) 305-1597[email protected]
全新的格芯品牌，开创更加广阔的新纪元 July 19, 2021全球各地的人们每天都在依赖半导体芯片，而且大多数人甚至没有意识到这一点。芯片无处不在，从电器到恒温器、从智能手机到汽车、从工业设备到医疗设备，都要使用芯片。事实上，仅仅一辆汽车就可能使用多达1500个芯片。这些令人难以置信的复杂芯片是人类智慧的壮举，它成就了我们的世界，为全球经济提供了动力，也丰富了我们的生活。作为全球领先的半导体芯片制造商之一，格芯®（GLOBALFOUNDRIES®）清楚地知道，我们的角色对人类至关重要，我们不会轻视这一角色。 事实上，在过去的几年里，我们已经对公司进行了转型，确保我们的客户可以依赖我们提供功能丰富的创新工艺技术解决方案，用于芯片设计制造，满足要求最严格、需求量最大的应用。举例而言，如果您有一部5G智能手机，那么里面很可能会使用格芯制造的芯片来接收5G信号。 半导体芯片的可靠供应也成为各国经济和国家安全的当务之急。芯片供应链变得日益复杂，同时也变得愈加重要，而格芯是世界上仅有的五家能够为这些供应链规模化.生产芯片的公司之一，也是唯一一家拥有全球生产足迹的公司，能够为我们的客户提供了畅通可靠的技术来源。 今天，我们迎来了一个激动人心的时刻——我们推出了一个全新的格芯品牌。我们的新品牌是我们转型之旅的巅峰，也是新格芯的化身。我很高兴与大家分享这个消息。 开创更加广阔的新纪元 四个基本要素构成了我们公司和品牌独特的故事： 首先，我们正在重新定义创新和半导体制造。我们认为，半导体制造的创新是让芯片更智能，而不仅仅是尺寸更小。这就是为什么我们与客户携手合作，共同开发和制造功能丰富的解决方案，为许多不断增长的市场提供至关重要的领先性能。与以计算为核心的芯片不同，功能丰富的芯片能够实现一些特定的功能，如触摸屏、流媒体电影和安全支付，这类新一代芯片虽然使我们的客户能够推动创新，但也将需要更高的安全性和更低的功耗。格芯的创新和半导体制造专长让这一切成为可能。 第二，我们的全球制造规模优势。格芯的生产设施分布在全球各地，在北美、欧洲和亚洲都有大型的生产中心。我们的全球布局为客户提供了其他半导体制造商无法提供的灵活性和便利性。 第三，与客户的密切协作和合作。我们重塑了半导体行业的客户与供应商动能，以实现更紧密的伙伴关系。我们正在引领行业向一种更先进的“无晶圆厂/代工厂”模式演进，这种模式建立在长期合作的基础上。在这种模式下，我们的客户能够专注于推进关键应用的芯片设计创新，而我们则专注于工艺制程功能创新，确保这些设计可以在关键的问市窗口期实现大批量生产。这种新模式确保了格芯和我们客户合作的可预测性、可重复性和可持续性，这几点现在比以往任何时候都更加重要。 第四，公司的多元化。我们拥有全球半导体制造业最多元化的员工队伍，这提高了我们的创新能力，使我们能够更好地与全球客户合作。我们在全球各地共有约15000名员工，他们拥有多元化的想法、思想和背景，每天帮助我们满足和超越客户的需求。没有这些他们，格芯就不可能成为世界领先的半导体公司之一。 新的形象标识代表了新的格芯，同时也致敬了我们的传统 格芯的新形象标识反映了我们作为一家公司的本质，体现了我们对社会的贡献以及贡献的方式，同时也致敬了我们的传统： 我们的企业标识：我们的新品牌徽标是一个图标和一个文字标志的结合。图标是我们公司名中两个字母“GF”的简化设计，设计的简化本质代表了我们的品牌故事。 图标中“g”的左半部分采用了一个半圆和一个四分之一圆。这两个圆形代表地球，突出了我们的全球布局，同时也代表了半导体晶圆。 中间的形状由“g”和“f”共用，象征着伙伴关系和协作，是我们与客户关系的核心指标。 “f”的剩余部分由两个正方形堆叠而成，表示芯片，同时两个正方形构成了一个等号，用来传达我们的品牌故事。 我们的色彩：我们的新形象标识保留了原来的橙色，使格芯保留了我们在使用该颜色时积累的品牌资产，同时反映了我们大胆的个性以及我们的乐观和温暖。我们还加入了黄色和紫色来表达我们的热情和大胆。 我们的视觉形象：我们的新品牌摆脱了技术和图形抽象图像的行业惯例，转而关注格芯的眼界和人性化。这些充满灵感的图像寓意全球并以人为中心，重申了我们的全球布局和业务。 总体而言，格芯的新形象标识经过精心设计，兼具大胆和创新，同时简洁又引人注目。我们的品牌反映了我们是谁，突出了我们在全球扮演的重要角色。 事实上，就在您阅读这篇文章的这一刻，格芯生产的芯片可能就陪伴在您的左右。这是一个真实的故事，也是我们的故事。
Alan Shaffer Joins GlobalFoundries Government Security Committee July 14, 2021 High-ranking, former Pentagon official further strengthens the company’s commitment to the U.S. government and national security needs Malta, New York, July 14, 2021 – GlobalFoundries® (GF®) today announced that the Honorable Alan Shaffer has joined the company’s Government Security Committee (GSC), effective immediately. The GSC, formed six years ago, is an integral component of GF’s long-standing program for the secure production of the U.S. Government’s most sensitive semiconductor products. Complementary to GF SHIELD, GF’s comprehensive program for safeguarding governmental and commercial customers’ most confidential and valuable information and products, the Committee advises GF’s leadership and board of directors on key issues of security, government and political affairs. “Over the last months, a chip shortage has put an intense spotlight on our industry and on just how critical U.S. semiconductor manufacturing is to ensure long-term supply to meet exploding demand,” said Saam Azar, senior vice president of Corporate Development, Legal and Government Affairs. “Secretary Shaffer brings a wealth of experience to GF’s GSC, further expanding our expertise in security and intelligence matters, and increasing GF’s reach across industries and the national security community.” Shaffer has had wide ranging leadership roles in the Department of Defense (DoD), most recently serving as the Deputy Under Secretary of Defense for Acquisition and Sustainment (A&S). His accomplished and impactful career as a government leader, public official, and respected authority has earned Shaffer both the Distinguished and the Meritorious Presidential Rank Awards for “sustained extraordinary accomplishment.” On the GSC, Shaffer joins a distinguished group of former senior government officials and semiconductor industry leaders advising GF from a unique set of perspectives and diverse expertise. The committee is chaired by Ken Krieg, former Under Secretary of Defense for Acquisition, Technology and Logistics; and includes Tim Hutchinson, former U.S. Senator from Arkansas; Lou Lupin, former Qualcomm Executive Vice President and General Counsel; and Mike Cadigan, GF’s senior vice president of Customer Design Enablement and long-time IBM executive. As an accredited supplier of advanced semiconductors to the U.S. government, GF is supporting secure government programs to deliver chips for defense, aerospace, and other applications vital to the national interest. In 2021, GF announced a new agreement with the DoD to provide a secure and reliable supply of semiconductor solutions manufactured at GF’s most advanced semiconductor manufacturing facility in Malta, New York. The Malta fab is also compliant with the U.S. International Traffic in Arms Regulations (ITAR). GF is convening a distinguished group of leaders from industry and government to continue the national discussion around solving semiconductor supply chain and national security challenges on Monday, July 19 at GF’s Fab 8 facility in Malta, New York. As a part of the event, GSC advisors, Ken Krieg, Al Shaffer and Mike Cadigan will participate in a panel discussion with other government and industry experts providing insight on national security needs for semiconductor supply chains. About GlobalFoundries GF is one of the world’s leading semiconductor manufacturers and the only one with a truly global footprint. GF delivers feature-rich solutions that enable its customers to develop pervasive chips for high-growth market segments. GF provides a broad range of platforms and features with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF has the flexibility and agility to meet the dynamic needs of customers across the globe. GF is owned by Mubadala Investment Company. For more information, visit globalfoundries.com. Contact: Erica McGillGLOBALFOUNDRIES(518) 795-5240[email protected]
Western Digital Appoints Dr. Thomas Caulfield and Miyuki Suzuki to Its Board of Directors July 8, 2021Western Digital Corp. (NASDAQ: WDC) today announced that Dr. Thomas (Tom) Caulfield and Miyuki Suzuki have been appointed to its board of directors effective July 6, 2021. Caulfield, currently CEO of GLOBALFOUNDRIES® and Suzuki, a Japanese-based, Fortune 100 business leader, bring semiconductor and global operating experience that complements Western Digital’s growth and innovation strategy.
