Raytheon Technologies and GlobalFoundries Partner to Accelerate 5G Wireless Connectivity May 19, 2021 Strategic collaboration and licensing agreement to develop new Gallium Nitride technology will enable future wireless networks Waltham, Mass. and Burlington, Vt., May 19, 2021 – Raytheon Technologies (NYSE: RTX), a leading aerospace and defense technology company, and GlobalFoundries® (GF®), the global leader in feature-rich semiconductor manufacturing, will collaborate to develop and commercialize a new gallium nitride on silicon (GaN-on-Si) semiconductor that will enable game-changing radio frequency performance for 5G and 6G mobile and wireless infrastructure applications. Under the agreement, Raytheon Technologies will license its proprietary gallium nitride on silicon technology and technical expertise to GF, which will develop the new semiconductor at its Fab 9 facility in Burlington, Vermont. Gallium nitride is a unique material used to build high-performance semiconductors that can handle significant heat and power levels. This makes it ideal to handle 5G and 6G wireless signals, which require higher performance levels than legacy wireless systems. “Raytheon Technologies was one of the pioneers advancing RF gallium arsenide technology which has been broadly used in mobile and wireless markets, and we have similarly been at the forefront of advancing gallium nitride technology for use in advanced military systems,” said Mark Russell, Raytheon Technologies’ chief technology officer. “Our agreement with GlobalFoundries not only demonstrates our common goal to make high performance communications technologies available at an affordable cost to our customers, it continues to prove how investments in advanced defense technologies can improve lives, as well as defend them.” “I am proud that GlobalFoundries’ fab in Essex is leading the way in domestic production of this important 5G-enabling technology and beyond. This is a win for Vermont and a win for the United States,” said Senator Patrick Leahy, Chairman of the Senate Appropriations Committee. “This collaboration between a world-class manufacturer, GlobalFoundries, and Raytheon Technologies, a leader in technological innovation, is good news for the nation’s semiconductor supply chain and competitiveness. The technology that will be produced by Vermonters will be a revolution in our lives.” “GlobalFoundries’ innovations have helped drive the evolution of four generations of wireless communications that connect over 4 billion people. Our collaboration with Raytheon Technologies is an important step to ensuring the development and manufacturing capability of solutions for critical future 5G applications,” said GF CEO Tom Caulfield. “This partnership will enable everything from AI-supported phones and driverless cars to the smart grid, as well as governments’ access to data and networks which are essential to national security.” Combined with GF’s manufacturing excellence and differentiated services in RF, testing, and packaging, the new GaN offering will increase RF performance while maintaining production and operational costs, enabling customers to achieve new levels of power and power-added efficiency to meet evolving 5G and 6G RF millimeter-wave operating frequency standards. This collaboration with Raytheon Technologies is the latest of several strategic partnerships for GF and is further evidence of the company’s commitment to redefine the leading-edge by delivering differentiated solutions, while the rest of the industry continues to pursue traditional and increasingly difficult technology scaling. As a Trusted semiconductor manufacturing facility since 2005, GF employs nearly 2,000 people at Fab 9, and more than 7,000 people across the U.S. Over the past 10 years the company has invested $15 billion in U.S. semiconductor development and is doubling its planned investment in 2021 to expand global capacity and support growing demand from the U.S. government and industry customers for secure processing and connectivity applications. About GF GF is the world’s leading semiconductor manufacturer and the only one with a truly global footprint. GF delivers feature-rich solutions that enable its customers to develop pervasive chips for high-growth market segments. GF provides a broad range of platforms and features with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF has the flexibility and agility to meet the dynamic needs of customers across the globe. GF is owned by Mubadala Investment Company. For more information, visit www.globalfoundries.com. About Raytheon Technologies Raytheon Technologies Corporation is an aerospace and defense company that provides advanced systems and services for commercial, military and government customers worldwide. With four industry-leading businesses ― Collins Aerospace, Pratt & Whitney, Raytheon Intelligence & Space and Raytheon Missiles & Defense ― the company delivers solutions that push the boundaries in avionics, cybersecurity, directed energy, electric propulsion, hypersonics, and quantum physics. The company, formed in 2020 through the combination of Raytheon Company and the United Technologies Corporation aerospace businesses, is headquartered in Waltham, Massachusetts. Media Contacts GlobalFoundriesErica McGill+1-518-795-5240[email protected] Raytheon TechnologiesChris JohnsonC: +1 202-384.2474[email protected]
与格芯发明大师Shesh Mani Pandey的对话 May 17, 2021在格芯,获得“发明大师”头衔的同事至少要拥有20项美国授权专利,并且在技术成就和IP资产创造方面拥有出色的记录。 发明大师表彰计划是一个强大的平台,旨在奖励多产员工并激励有意提交发明申请专利的其他员工。 在激励并指导同事的同时,发明大师还担任顾问,是格芯技术领导者和法律团队在各种技术、战略和知识产权主题方面的强大资源。 我们与马耳他团队的格芯发明大师Shesh Mani Pandey进行了交谈,以了解发明的过程并进一步了解格芯的创新精神。 问:您在格芯的职位是什么? Shesh:我目前是纽约马耳他Fab 8设备团队的一名高级技术人员。我在半导体行业工作了25年多,担任过各种管理和技术开发职位。我在格芯的所有晶圆厂都工作过,包括新加坡、德国和美国,2012年从德累斯顿搬到Fab 8。我的技术专业知识领域为TCAD(计算机辅助设计技术)和体硅CMOS、FinFET、FD-SOI、纳米线及其他平台的器件设计 能否给我们讲讲您是如何获得“发明大师”称号的? 我在2019年被授予“发明大师”称号。这是我长久以来的一个梦想,终于得以实现。我是多年前在一个人的电子邮件签名中看到“发明大师”这个头衔的,从那以后就念念不忘。当格芯在2018年启动“发明大师”计划时,我再次受到了触动。为了得到这个头衔,我开始努力工作,并加入格芯的发明家精英团体。 专利在您的职业生涯中扮演什么角色?专利让您发生了什么样的改变? 专利在个人、专业和财务方面都有帮助。就个人而言,能够成为公司少数几个拥有这个头衔的人之一,会觉得很有成就感。专利反映了我们在日常工作中的专业知识和经验。 从专业角度来说,专利可能会有助于职业生涯的成长。在财务方面,格芯针对发明者有很多激励措施。 您是如何想出创意的? 我经常从手头项目中遇到的难题以及其他感兴趣的项目中获得发明创意的点子。我喜欢靠近问题而不是远离它。遇到问题时,我们会思考解决这些问题有哪些可能的解决方案,进而就有可能产生发明。概括来讲就是,靠近问题,挑战自己,学习新事物。 您认为成为一名发明家的关键要素是什么? 对我来讲,首先是热情。一个人必须满怀热忱。我觉得一切都是这样。另外,一个人必须有创造力,能跳出思维定势。除此之外,还要清楚地了解主题和流程。团队合作非常有帮助,因为解决某个具体问题时通常涉及多个领域,而一个人不太可能对所有方面都了如指掌。此外,还需要在感兴趣的领域投入足够的时间、拥有丰富的经验,以观大局。 您对新的发明者有什么建议? 第一个发明创意总是最难实现的。格芯拥有成熟的流程可以为发明者提供一臂之力。有想法,但是不知道接下来要做什么?那就联系任何一位知识产权法律团队成员、发明者或发明大师,这样就能顺利进行下去。要充满热情,保持好奇心,具有创造力和竞争力!
Q&A with GF Master Inventor Shesh Mani Pandey May 6, 2021 At GlobalFoundries, the title of Master Inventor is reserved for colleagues with at least 20 issued U.S. patents and who have a demonstrated track record of technical accomplishments and intellectual property (IP) asset creation. The program is a powerful platform for honoring prolific employees as well as motivating other employees who may have been thinking about submitting their inventions for patenting. Along with inspiring and mentoring their colleagues, Master Inventors serve as advisors and are a resource for GF’s technology leaders and legal team on a range of technical, strategic, and IP topics. We spoke with GF Master Inventor Shesh Mani Pandey, from our Malta team, to learn about the process of inventing and to get a closer look at the spirit of innovation at GF. Q: What is your role at GF? Shesh: I am currently a senior member of the technical staff with the Fab 8 device team in Malta, New York. I’ve been in the semiconductor industry for more than 25 years, in various management and technology development roles. I have experience working at all of GF’s fabs – in Singapore, Germany, and the U.S. – and moved to Fab 8 from Dresden in 2012. My technical expertise is in TCAD (technology computer-aided design) and device design for bulk CMOS, FinFET, FD-SOI, nanowires, and other platforms Can you tell us about your Master Inventor experience? I was named a Master Inventor in 2019. It was a dream come true, as this was on my mind for a long time. I saw the title “Master Inventor” in someone’s email signature many years ago, and never forgot it. When GF started its Master Inventor program in 2018, it clicked with me again. I started working hard to achieve this title and join GF’s elite group of inventors. What role does patents play in your career? How has patenting changed you? It helps in all personal, professional, and financial aspects. Personally, you get all the satisfaction that you are one of the few people in our company who has this title. It reflects your expertise in your day-to-day work, and your experience. Professionally, it may help you to grow in your career. Financially, GF has many incentives for inventors. How do you come up with ideas? I often get ideas for inventions from challenging issues that arise in the projects I am working on, and from other projects that interest me. I love to be close to issues. When there are problems, we think about possible solutions to address those problems, and that leads to possible inventions. Be close to problems, and challenge yourself to learn new things. What do you think are the critical components of being an inventor? For me, the first thing is passion. One has to be passionate about it. I feel that is true for everything. One has to be creative and think outside the box. Other than that, there should be a clear understanding of the subject and process. Working as a team helps significantly, as you may not be the expert of all the topics needed to solve a particular problem. Also, you need enough experience and time invested in your area of interest, in order to see the big picture. What advice would you give to new inventors? Your first idea is always the most difficult hurdle. GF has a well-established process to help you. Have an idea, but don’t know what to do next? Please contact any IP Legal team member, inventor, or Master Inventor and it will be smoothly executed. Be passionate, curious, creative and competitive!
PsiQuantum与格芯携手打造全球首台全规模量子计算机 May 5, 2021此次合作是全球在光子量子计算领域的首个制造里程碑 加利福尼亚州帕洛阿尔托和纽约马耳他,2021年5月5日——今日,专研100万及以上量子比特计算机的领先量子计算公司PsiQuantum™和全球领先的工艺多样的半导体制造商格芯®(GLOBALFOUNDRIES®,GF®)共同宣布其合作关系取得了重大突破,双方将携手打造全球首台全规模商用量子计算机。目前,两家公司正在制造构成Q1系统基础的硅光和电子芯片,这是PsiQuantum路线图中的第一个系统里程碑,旨在提供具有100万以上量子比特(量子信息的基本单位)的商用量子计算机。 PsiQuantum和格芯展现了出色的核心量子部件(例如:单光子源和单光子探测器)生产能力,遵循格芯先进半导体制造厂的标准制造流程,完成高精度量产。两家公司还在格芯位于纽约北部的两家300mm晶圆厂安装了专有生产和制造设备,以生产数千个Q1硅光芯片,并在位于德国德累斯顿的Fab 1生产先进的电子控制芯片。 量子计算技术有望推动药物研发、材料科学、可再生能源、气候变化减缓和可持续农业等众多行业的巨大进步。PsiQuantum的Q1系统代表着硅光技术的重大突破,该公司也将硅光技术视为打造规模超过100万量子比特以及提供纠错、容错的通用量子计算机的唯一途径。 Q1系统由PsiQuantum杰出的光子量子计算专家团队历时五年潜心研发而成。该团队的使命是将量子计算变为现实,带来改变世界的巨大效益,而这基于以下两点基本认识:1) 一台有用的量子计算机需要100万及以上物理量子比特,才能完成原本不可能完成的计算任务;2) 人们已在半导体行业投入了50多年的时间和数万亿美元,充分利用这些资源是创造商用量子计算机的唯一途径。 “在过去一年里,我们经历了堪比十年的技术变革。现在,由于数字化转型和数据爆炸,我们面临着需要量子计算来进一步加速计算复兴的问题,”格芯计算和有线基础设施战略业务部高级副总裁兼总经理范彦明(Amir Faintuch)表示,“PsiQuantum和格芯的合作意味着PsiQuantum光子量子计算专业知识与格芯硅光制造能力的强强联合,这将改变气候、能源、医疗保健、材料科学和政府等各行各业以及各大技术应用领域。” 格芯领先的硅光制造平台赋能PsiQuantum开发出的量子芯片可以经测量和测试保证性能的长期可靠。这对于能够执行需要数百万或数十亿量子门操作的量子算法而言至关重要。PsiQuantum正与各大公司的研究人员、科学家以及开发人员通力合作,探索和测试涵盖能源、医疗保健、金融、农业、交通和通信等多个行业的量子应用。 PsiQuantum首席战略官兼联合创始人Pete Shadbolt表示:“这是量子和半导体行业的重大成就,证明了可以使用先进半导体晶圆厂的标准制造工艺在硅芯片上构建量子计算机的关键部件。最初设想PsiQuantum的未来时,我们发现系统微缩是一大关键问题。我们与格芯一同验证了硅光制造路径,有信心通过五年左右的时间,让PsiQuantum完全具备组装成品所需的所有生产线和流程。” PsiQuantum与格芯的合作正在重新定义这一前沿技术,实现从电子到光子的转变,而全球的其它领域还在继续追逐传统的节点微缩。此外,双方的合作得到了安全的本土供应链的支持,在确保美国成为量子计算领域全球领导者方面发挥着关键作用。格芯作为唯一一家全球运营的半导体制造商,提供了广泛的平台和功能丰富的解决方案,赋能我们的客户为高增长的市场领域开发普适产品。 如需了解关于格芯的更多信息,请访问www.globalfoundries.com/cn。 如需了解更多有关Q1系统及其底层架构的信息,可阅读PsiQuantum的相关博客。如需了解更多有关PsiQuantum的信息,请访问www.psiquantum.com。 关于格芯 格芯®(GLOBALFOUNDRIES®)是全球领先的半导体制造商之一,也是唯一一家真正实现全球运营的半导体制造商。格芯提供功能丰富的解决方案,赋能客户为高增长的市场领域开发普适芯片。格芯拥有广泛的工艺平台及特性,并提供独特的融合设计、开发和生产为一体的服务。格芯拥有遍布美洲、亚洲和欧洲的规模生产足迹,以其灵活性与应变力满足全球逾250家客户的动态需求。格芯隶属Mubadala Investment Company。如需了解更多信息,请访问www.globalfoundries.com。 关于PsiQuantum: PsiQuantum矢志建造全球首台商用量子计算机,其动力来自硅光技术和量子体系结构的突破。PsiQuantum认为硅光技术是扩展至100万以上量子比特以及实现纠错、容错的通用量子计算机的唯一途径。随着量子芯片在一级半导体制造厂中投入生产,PsiQuantum在提供量子计算能力方面独具优势,将与客户和合作伙伴一起推动气候、医疗保健、金融、能源、农业、交通和通信等领域的发展。如需了解更多信息,请访问www.psiquantum.com。 媒体联系人: 格芯 Erica McGill +1-518-795-5240 [email protected] PsiQuantum Gabriele Collier +1 650-701-6080 [email protected] © 2021 PsiQuantum。PsiQuantum及其徽标是PsiQuantum, Corp.在美国和其它国家/地区的商标。所有其它商标均为其各自所有者的财产。
PsiQuantum and GlobalFoundries to Build the World’s First Full-scale Quantum Computer May 5, 2021 Partnership Achieves World-first Manufacturing Milestone in Photonic Quantum Computing PALO ALTO, Calif. and Malta, New York – May 5, 2021 – PsiQuantum™, the leading quantum computing company focused on delivering a 1 million-plus qubit quantum computer, and GlobalFoundries® (GF®), the global leader in feature-rich semiconductor manufacturing, today announced a major breakthrough in their partnership to build the world’s first full-scale commercial quantum computer. The two companies are now manufacturing the silicon photonic and electronic chips that form the foundation of the Q1 system, the first system milestone in PsiQuantum’s roadmap to deliver a commercially viable quantum computer with one million qubits (the basic unit of quantum information) and beyond. PsiQuantum and GF have now demonstrated a world-first ability to manufacture core quantum components, such as single-photon sources and single-photon detectors, with precision and in volume, using the standard manufacturing processes of GF’s world-leading semiconductor fab. The companies have also installed proprietary production and manufacturing equipment in two of GF’s 300mm fabs to produce thousands of Q1 silicon photonic chips at its facility in upstate New York, and state-of-the-art electronic control chips at its Fab 1 facility in Dresden, Germany. Quantum computing is expected to deliver extraordinary advances across a multitude of industries including pharmaceutical development, materials science, renewable energy, climate mitigation, sustainable agriculture, and more. PsiQuantum’s Q1 system represents breakthroughs in silicon photonics, which the company believes is the only way to scale to 1 million-plus qubits and beyond and to deliver an error-corrected, fault-tolerant, general-purpose quantum computer. The Q1 system is the result of five years of development at PsiQuantum by the world’s foremost experts in photonic quantum computing. The team made it their mission to bring the world-changing benefits of quantum computing into reality, based on two fundamental understandings: 1) A useful quantum computer capable of performing otherwise impossible calculations requires 1 million-plus physical qubits; and 2) Leveraging the 50-plus years and trillions of dollars invested in the semiconductor industry is the only path to create a commercially viable quantum computer. “In the past year, we have experienced a decade of technological change. Now, due to the digital transformation and the explosion of data we are faced with problems that require quantum computing to further accelerate the Renaissance of Compute,” said Amir Faintuch, senior vice president and general manager of Compute and Wired Infrastructure at GF. “PsiQuantum and GF’s partnership is a powerful combination of PsiQuantum’s photonic quantum computing expertise and GF’s silicon photonics manufacturing capability that will transform industries and technology applications across climate, energy, healthcare, materials science, and government.” GF’s leading silicon photonics manufacturing platform enables PsiQuantum to develop quantum chips that can be measured and tested for long-term performance reliability. This is critical to be able to execute quantum algorithms, which require millions or billions of gate operations. PsiQuantum is collaborating with researchers, scientists and developers at leading companies to explore and test quantum use cases across a range of industries, including energy, healthcare, finance, agriculture, transportation and communications. “This is a major achievement for both the quantum and semiconductor industries, demonstrating that it’s possible to build the critical components of a quantum computer on a silicon chip, using the standard manufacturing processes of a world-leading semiconductor fab,” said Pete Shadbolt, chief strategy officer and co-founder of PsiQuantum. “When we first envisioned PsiQuantum, we knew that scaling the system would be the existential question. Together with GlobalFoundries, we have validated the manufacturing path for silicon photonics and are confident that by the middle of this decade, PsiQuantum will have completely stood up all the manufacturing lines and processes necessary to begin assembling a final machine.” The PsiQuantum and GF partnership is redefining the leading-edge by enabling the move from electrons to photons, while the rest of the world continues to chase traditional node scaling. Moreover, the partnership is playing a critical role in ensuring the United States becomes a global leader in quantum computing, supported by a secure, domestic supply chain. As the only semiconductor manufacturer with a global footprint, GF provides a broad range of platforms with feature-rich solutions enabling customers to develop pervasive products for high-growth market segments. For more information about GF, visit www.globalfoundries.com. For more information about the Q1 system and its underlying architecture, read PsiQuantum’s blog here. For more information about PsiQuantum, visit www.psiquantum.com. About GF GlobalFoundries (GF) is one of the world’s leading semiconductor manufacturers and the only one with a truly global footprint. GF delivers feature-rich solutions that enable its customers to develop pervasive chips for high-growth market segments. GF provides a broad range of platforms and features with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF has the flexibility and agility to meet the dynamic needs of its more than 250 customers across the globe. GF is owned by Mubadala Investment Company. For more information, visit www.globalfoundries.com. About PsiQuantum: PsiQuantum is on a mission to build the world’s first commercially viable quantum computer, powered by breakthroughs in silicon photonics and quantum architecture. PsiQuantum believes silicon photonics is the only way to scale beyond one million qubits and deliver an error-corrected, fault-tolerant, general-purpose quantum computer. With quantum chips now being manufactured in a tier-one semiconductor fab, PsiQuantum is uniquely positioned to deliver quantum capabilities that drive advances with customers and partners across climate, healthcare, finance, energy, agriculture, transportation and communications. To learn more, visit www.psiquantum.com. Media Contacts: GlobalFoundriesErica McGill+1-518-795-5240[email protected] PsiQuantumGabriele Collier+1 650-701-6080[email protected] © 2021 PsiQuantum. PsiQuantum and our logo are trademarks of PsiQuantum, Corp., in the U.S. and other countries. All other trademarks are the property of their respective holders.
GLOBALFOUNDRIES Moves Corporate Headquarters to its Most Advanced Semiconductor Manufacturing Facility in New York April 26, 2021Malta, New York, April 26, 2021 – GLOBALFOUNDRIES® (GF®), the global leader in feature-rich semiconductor manufacturing, announced today at an onsite event with Senate Majority Leader Chuck Schumer that it will relocate its headquarters to Malta, New York, the site of Fab 8, the company’s most advanced semiconductor manufacturing facility — as the company positions itself for growth, strengthens partnerships with customers and recruits new talent. This change is effective today. GF has invested more than $15 billion in its Fab 8 facility over the last decade to support innovation and manufacturing capacity. In 2021, the company is doubling its planned investment to expand global capacity, with $500 million targeted for Malta, NY alone. The move from GF’s previous headquarters to its state-of-the-art fab in New York is part of the company’s commitment to address the soaring global chip demand, with a focus on semiconductor manufacturing innovation. GF will maintain a substantial presence in Santa Clara, California, in the heart of Silicon Valley, where many of GF’s leading U.S. customers and ecosystem partners are based. “Today, GF’s Fab 8 in New York is a $15 billion advanced semiconductor manufacturing facility and one that is playing a key role in the transformation of our industry to meet rapidly accelerating demand,” said GF CEO Tom Caulfield. “As a native New Yorker, son of a NYC firefighter, and manufacturer at heart, I am personally proud to be making upstate New York GF’s new headquarters. Our amazing 3,000-person workforce, in partnership with our local, state, and federal leaders, will together build on GF’s success, solidifying the Empire State’s place as one of a few world-class semiconductor manufacturing hubs at a time when our national and economic security depends more and more on what we can make here at home.” Caulfield added, “I would like to thank Senator Schumer for his steadfast support for GF over the years and his tireless leadership in forging a bipartisan coalition in Congress that together with the Administration fully appreciates the need for a secure and resilient domestic semiconductor supply chain. The time for the Endless Frontier Act is now, and once approved by Congress and signed into law by President Biden, GF stands ready to do our part by expanding in upstate New York and creating many more high-paying American jobs. Our ambitious goal is to double our capacity at this site in the years to come in partnership with our customers, local, state and federal governments. We can do this.” “GlobalFoundries’ transition of its headquarters to Fab 8 in Malta is further indication of the company’s commitment to growth in New York and to the Empire State’s leadership in the semiconductor industry,” said Senate Majority Leader Chuck Schumer, who successfully passed into law new federal semiconductor manufacturing and R&D incentives in last year’s National Defense Authorization Act (NDAA). “The chips that GlobalFoundries manufactures here in Malta are critical to our national security and to our economic competitiveness across key industries. I have worked closely with GlobalFoundries over the years to look for opportunities to expand their presence in New York and I am now pushing to secure the federal funds necessary to implement programs we passed into law last year to support further expansion of domestic chip production by companies like GlobalFoundries, accelerating even more growth in the semiconductor industry across Upstate New York.” GF employs more than 15,000 globally with 7,000 people across the U.S., and nearly 3,000 at its Fab 8 in Malta, New York. In 2020, GF announced a land purchase option to provide additional flexibility to expand Fab 8’s footprint to support growing demand from the U.S. government and industry customers. Semiconductor chips are more pervasive than ever, becoming one of humankind’s most vital resources, from smartphones and automobiles to technology in schools and hospitals, modern society can no longer survive without them. GF is a trusted provider to 250 customers worldwide including the US Government. About GF GLOBALFOUNDRIES (GF) is one of the world’s leading semiconductor manufacturers and the only one with a truly global footprint. GF delivers feature-rich solutions that enable its customers to develop pervasive chips for high-growth market segments. GF provides a broad range of platforms and features with a unique mix of design, development and fabrication services. With an at-scale manufacturing footprint spanning the U.S., Europe and Asia, GF has the flexibility and agility to meet the dynamic needs of its more than 250 customers across the globe. GF is owned by Mubadala Investment Company. For more information, visit www.globalfoundries.com. Media Contacts GLOBALFOUNDRIES Erica McGill +1-518-795-5240 [email protected]
Attopsemi’s I-fuse OTP IP Qualified and Available on GLOBALFOUNDRIES 22FDX FD-SOI Platform April 22, 2021Attopsemi, innovator of I-fuse™ one-time programmable (OTP) IP provider, announced today that its I-fuse OTP IP is now qualified for the GLOBALFOUNDRIES® (GF®) 22FDXTM platform.
ANSYS: Ansys and GLOBALFOUNDRIES Team to Accelerate Photonic Integrated Circuit Design April 15, 2021By Milad Mahpeykar, Peter Hallschmid, Ted Anderson, and Vikas Gupta Ansys has teamed up with GLOBALFOUNDRIES© (GF©), the world’s leading specialty semiconductor manufacturer, to address the needs of the digital world through integrated photonics design. GF enables designers to leverage the power of light for advanced optical applications with a high-performance monolithically integrated photonics solution in an optimized footprint that requires only half the area of discrete solutions. This monolithic solution integrates a high performance RF CMOS and photonics components in a single chip to deliver higher bandwidth between data center servers and faster connections between data centers along the telecommunication infrastructure. Click here to read the full blog post, on the site of our ecosystem partner Ansys.
Frictionless Networking: A Megatrend that Requires Powerful RF Solutions April 15, 2021 Frictionless networking, virtualization, and hierarchical AI are three technological megatrends that will transform how we live and work. This article on frictionless networking is the first in a series examining how GlobalFoundries solutions enable each of these megatrends. Although the transistor debuted nearly three quarters of a century ago, paving the way for solid-state integrated circuits and ushering in the electronics revolution, the last two years may have been the most momentous ones ever in the industry’s history. In 2019, geopolitical tensions brought a sharp focus to the strengths and vulnerabilities of the global semiconductor supply chain. Because of the need for a reliable supply of chips for all manner of products, semiconductors suddenly became a flashpoint for industrial, commercial and foreign-relations policies. Then, driven by the Covid-19 pandemic in 2020, awareness of the raw power of the world’s digital infrastructure grew, as people began to depend on it more heavily than ever before to fight the contagion, to run companies remotely, to educate students, to socialize, and for many other things large and small. GlobalFoundries (GF) CEO Tom Caulfield said that ever since society realized supply chain issues and the pandemic weren’t short-term crises, there’s been a deepening awareness of the importance of digital technologies and how they will forever change our lives. “It’s amazing to see not only how pervasive and resilient the digital infrastructure had become over the last decade, and yet how little of its full potential was exploited until COVID-19,” he said. “We started to imagine not a new normal, but a better normal. This better normal will come from exploiting the capabilities of our pervasive, expanding and improving digital infrastructure. …. This is not just an opportunity for our industry, it’s our calling.” As a result, GF sees three megatrends and one enormous hurdle that have emerged, Caulfield said, and GF solutions are critical to all of them. The first is frictionless networking – a ubiquitous “always-on, seamless, intelligent and secure connection, 24 hours, seven days a week” – which we’ll explore in greater depth below in this blog. The second megatrend is pervasive deployment of virtualization. “Network function virtualization (NFV) is a great example,” Caulfield said. “This is where network processing is done in the cloud, and data is transported from dumb access points to the cloud for processing. This results in significant scale advantages similar to the value proposition of cloud storage and computing we enjoy today. NFV significantly improves bandwidth and speed, and it does it at a much lower cost and power point. Also, given the flexible nature of a virtualized network, the time and effort to deploy new services can be enhanced, as the new feature will come via a software push versus a hardware upgrade to the user.” The final megatrend is hierarchical artificial intelligence (AI), or “AI Everywhere,” from devices to sensors, from the edge to the cloud. “Data is the new gold, but it is only ore if we can extract it from a raw, unstructured format and use it to gain insights, take action and make decisions,” Caulfield said. “The amount of structured and unstructured data generated in just the last two years alone is greater than all of the data generated before, yet we only use 3% of all this data. Hierarchical AI is the key to extracting value from immense, unstructured data by parsing it to extract important information, then compressing it for more efficient transport to compute and storage.” While each megatrend has its own hurdles and challenges, and reducing power consumption is a make-or-break issue for all of them, the move to a digital future is unstoppable. Frictionless Networking is Coming “Our vision for future network connectivity is that you’re not even going to know what network you’re connected to, your device will automatically find it, authenticate it and optimize it for bandwidth, latency and other critical attributes,” said Peter Gammel, Vice President and CTO of GF’s Mobile and Wireless Infrastructure Business Unit. “We call this frictionless networking because when we talk about how we see connectivity playing out in the years to come as wireless systems make use of increasingly fast RF and mmWave spectrum, we don’t want to get lost in the details of 5G, 6G, Wi-Fi, Bluetooth, or some other network protocol. “Instead, the key point is this: No matter how you connect, the last hop between a network and your device is always going to be wireless,” he said, “and that means even though there’s already been a virtual explosion of radio frequency (RF) content in all sorts of devices, the trend is only going to accelerate.” Gammel said it isn’t just smartphones, tablets and PCs that will depend on frictionless networking capabilities. A universe of diverse products will need it to function, in applications as varied as Industry 4.0 (i.e., smart, automated manufacturing); the Internet of Things (IoT); wearables for health and wellness; automotive systems like advanced driver assistance (ADAS); and others too numerous to mention. The challenges are enormous. Data traffic at key network hubs is on a steep incline – up to 40% in some cases – and those rates are only going to increase in the coming years, Gammel said in a keynote address at the 2021 IEEE International Reliability Physics Symposium. “Future networks will require extreme capacity and data rates, much higher spectral efficiency, ultra-low latency, much higher reliability and robust security.” The Best RF Technology Will Carry the Day That’s all well and good, but anyone who has experienced difficulty in connecting to a network might wonder how we will ever reach a state of frictionless networking. What will it take to get there? “I’ve been in this industry for 40 years, and the way you measure success has never changed: It always comes down to leadership in RF technologies, which are essential to the performance and power consumption of front-end modules (FEMs) and power amplifiers, the most critical elements of a wireless communications system,” Gammel said. He said that to maximize the use of available spectrum, the push is on to drive output power as close to reliability limits as possible. That plays to GF’s strengths as the longstanding leader in many different RF technologies, including RF-SOI (RF silicon on insulator), FD-SOI (fully depleted silicon on insulator) and SiGe (silicon germanium) solutions. “Our RF SOI solutions are the go-to choice for integrated FEMs and beamformers in 5G base stations and smartphones,” Gammel said. “Meanwhile, because our 22FDX™ FD-SOI solution combines RF, analog, embedded memory, and advanced logic in one chip, they offer unmatched peak performance and energy efficiency for the integration of FEM elements like data converters, LNAs, power amplifiers (PAs) and switches with a transceiver.” In addition, he said, GF’s SiGe solutions are widely used in Wi-Fi and cellular power amplifiers, and SiGe technology provides a path to the terahertz frequencies needed for future network architectures. “The Best is Yet to Come” Gammel laid out what he sees as the other necessary ingredients for frictionless networking. “Turnkey assembly and test capabilities are going to become more important as the industry moves to terahertz frequencies, because the interface between circuits and packaging becomes more critical to performance. Do you put the antenna on the package or on the die, and what is the best configuration?” he said. Open interfaces are another requirement. “Proprietary interface protocols never win. Open interfaces are critical in building an ecosystem, and we’re seeing this already in network infrastructure and in standards-setting activities,” he said. One example is the 5G Open Radio Access Networks (Open RAN) initiative. Also, non-terrestrial networks that make use of satellites in low-Earth orbit (LEO) constellations are key to delivering connectivity to underserved geographies. “The commercial deployment of LEO constellations isn’t science fiction, it’s happening. The Starlink constellation from SpaceX is an example,” he said. “Much work remains to be done and many technology innovations are still required to leverage the vast, untapped spectrum from 100 GHz to 1 THz, but we have made great progress already and the best is yet to come,” Gammel said. The next article in this series will focus on the virtualization megatrend.
Joint press release on the “USEP” project completion April 14, 2021 High technology for medium-sized companies: Lower costs for more creativity A new type of sensor platform ‘Made in Saxony’ enables even smaller companies to develop IoT systems cost-effectively Dresden, April 14, 2021. Together with Globalfoundries Dresden, a group of Fraunhofer institutes in Saxony has developed a sensor platform that can be used to create individually configurable IoT and edge computing solutions. For the first time, small and medium-sized suppliers now have the opportunity to produce particularly powerful, energy-efficient and highly integrated systems at low cost. In contrast to independent development, the time required and development costs are significantly reduced. How can we develop a highly integrated, multi-channel sensor solution for mechanical engineering? Or a networked sensor system for building automation? The need-based, miniaturized development of smart systems adapted to individual specifications is a complex and expensive project for small and medium-sized enterprises (SMEs): They cannot use off-the-shelf electronic modules, but have to design innovative system solutions for selected customers themselves and usually in small quantities. »Customers are increasingly expecting highly integrated electronic prototypes or small series for the Internet of Things (IoT) and Edge Computing. However, without the appropriate system architectures and production methods, it is difficult for medium-sized companies to achieve a return on investment in development,” says Dr. Peter Schneider, Head of the Development Adaptive Systems EAS branch of the Fraunhofer Institute for Integrated Circuits IIS in Dresden. Support for the innovation driver medium-sized companies Under the leadership of the EAS branch, a consortium of Saxon Fraunhofer institutes and industry has therefore developed the “Universal Sensor Platform USeP.” It enables SMEs in particular to use a wide variety of modular and configurable platform elements and to put them together according to the modular principle with maximum flexibility. »The 3D sensor platform gives developers a largely free hand in terms of both software and hardware in order to produce future-oriented, individual products. While this used to cost six or seven-digit amounts in euros, SMEs can now save up to 90 percent in time and money,” explains Schneider. Thanks to the good and intensive cooperation between the development partners involved, the successful completion of the trend-setting project became possible within only three years. USeP has already mastered a first practical test. Within a cooperation between Globalfoundries Dresden and five other companies from the hardware and software sector, it was the core of a Edge AI pilot solution . With their help, the companies were able to develop a first product version (minimum viable product) for predictive maintenance of ultrapure water valves in chip production within just three months. Building blocks for the development of high technology »The sensor platform based on the GLOBALFOUNDRIES 22FDX ® developed in Dresdentechnology enables an energy-efficient and high-performance SoC (System on Chip) design that meets demanding edge computing requirements with embedded MRAM,” says Dr. Axel Preuße from Globalfoundries Dresden. The chip has numerous wireless and wired communication interfaces and uses a powerful 32-bit RISC-V processor with a total of 9 cores as the central processing and control unit. Not least because of its openness and flexibility, this open-source processor architecture is trend-setting and offers the ideal basis for secure and trustworthy electronics. The unique system architecture of the platform is also characterized by that the latest assembly and packaging technologies are combined with the latest semiconductor design methods and security components. Thanks to its flexible building blocks and the associated software environment, it enables uncomplicated integration of different sensors. The research project supported by the Free State of Saxony and the European Union as part of the European Regional Development Fund (ERDF) has now been completed and an independent company has emerged: The start-up Sensry in Dresden not only offers its customers the option of highly integrated sensor electronics -customize modules with the help of the universal sensor platform, but can also convey the competencies of the USeP development partners to interested SMEs. They thus have a supply chain at their disposal with which they can efficiently implement their ideas and visions: Concept development, system design, processors, sensors and data transmission as well as simulation and testing of your planned system are comprehensively and sustainably supported. In addition to the semiconductor manufacturer Globalfoundries Dresden, the Saxon Fraunhofer Institutes for Photonic Microsystems IPMS and Electronic Nano Systems ENAS as well as the institute branches All Silicon System Integration ASSID of Fraunhofer IZM and Development Adaptive Systems EAS of Fraunhofer IIS were involved in the development of the universal sensor platform USeP. The research partners were supported by colleagues from Fraunhofer IZM in Berlin, Fraunhofer IIS in Erlangen and Fraunhofer AISEC in Garching near Munich.