This is a historic moment of growth for the semiconductor industry. Chips are essential to everything from smartphones and vehicles to AI data centers – nearly anything with an on/off switch. But with this opportunity comes a challenge: building a sustainable talent pipeline of engineers, technicians and countless other roles that will support the industry’s seismic growth.  

Experts predict the need for one million additional workers by 2030, and at GlobalFoundries, we see this as a continued reminder of the importance of investing in our people, inspiring the next generation of innovators and strengthening the talent that drives our success. Our ability to deliver differentiated technology and reliable manufacturing begins with the exceptional teams we build today. 

Nurturing our amazing workforce 

Our more than 13,000 employees across the United States, Europe and Asia are the foundation of our success, working day to day to deliver incredible innovations. Every advancement we achieve with our customers is the result of their dedication, expertise and vision. 

To remain a destination for top talent in a competitive market, we’ve adopted a people-first strategy that removes barriers to career growth. A centerpiece of this effort is the Student Loan Repayment Program, the first of its kind in the semiconductor industry. U.S.-based employees can receive up to $28,500 in tax-free assistance to pay down student debt. In its first year, more than 300 employees enrolled, and GF has already contributed over $180,000 toward their loans. Participants have shared that the program has given them the freedom to focus on advancing their careers and building their futures without the weight of long-term debt. 

As our very own Morgan Woods told the Associated Press: “The fact that I’m now ahead of where I thought I would be a little over a year ago is very nice to see.” Through the program, she now expects to pay off her loans four years earlier.  

Building talent further & future talent 

Addressing the talent gap requires expanding the pipeline of skilled professionals. That’s why we’ve partnered with educational institutions to create career pathways and hands-on training opportunities that prepare the next generation of semiconductor leaders. 

One example of GF’s commitment to invest $1 million in Hudson Valley Community College to enhance workforce training and apprenticeship programs. Our team also leads the industry with the first U.S. Registered Apprenticeship Program, which provides opportunities for individuals with no prior experience or training in the semiconductor industry, offering full-time paid positions and cost-free college courses to high school graduates. These programs create access for people from diverse backgrounds while strengthening the overall talent ecosystem for semiconductors. 

Integrating specialized expertise 

Developing talent internally is only part of the equation. GF also brings in highly specialized skills through strategic acquisitions. This strategy includes GF’s acquisition of MIPS, a leader in AI and processor IP. Combining MIPS’ decades of design and IP innovation with GF’s world-class manufacturing capabilities will enhance our ability to meet the growing needs of AI and edge computing customers. 

As part of GF’s digital transformation to drive enterprise AI adoption, our engineers are advancing their capabilities in data-driven environments and stepping into smart manufacturing leadership roles. Through strategic partnerships with academia, solution providers and government agencies, we are co-developing future-ready solutions and building a strong talent pipeline. For example, our MOU with A*STAR to strengthen advanced packaging capabilities in Singapore includes employee upskilling and the creation of expert-level roles—laying the foundation for future growth. 

Investing in people everywhere to drive global industry growth anywhere 

GF’s geographically diverse presence across the United States, Europe and Asia also positions the company to adapt to regional labor markets and attract talent where it is most critical. This global approach provides both workforce flexibility and supply chain resilience, supporting customers in key markets around the world. 

The semiconductor talent shortage is one of the most significant challenges the industry faces, but it is also a call to action. GF is committed to fostering an environment where employees can grow, advance and contribute to the innovations that will define the future of technology, no matter where they, or our customers, are based. By investing in workforce programs, education partnerships and specialized expertise, GF is building the foundation for sustainable industry growth in the years ahead. 

GlobalFoundries Executive Chairman Tom Caulfield recently joined CNBC Money Movers for an exclusive interview and talked about how economic tools can help create demand for U.S. made chips and bring home more manufacturing capacity.  

“If you believe — and I don’t know anyone who doesn’t — that for national security, supply chain, and economic security, that we ought to be doing more semiconductor manufacturing in the U.S., then these are the tools you need to go make that happen,” explained Caulfield.

He added that proposals under consideration by President Trump and Commerce Secretary Lutnickare about lifting and shifting demand to fill capacity: “There’s no sense building capacity if the demand is not here, and this administration – with Secretary Lutnick and President Trump – are trying to use economic tools to drive demand here as well.”

Caulfield also emphasized that GlobalFoundries is ready to continue to build out its scale and manufacture in the U.S. “We’ve talked about a $16 billion capital expansion through leveraging the CHIPS funding and the investment tax credit, and the rate and pace of that is not dependent on GF being able to deploy the capital or create. It’s really about securing the commitment and the desire of our customers to want to bring more of that supply that we make for them back home.”

By Wael Fakhreldin, End-Market Director of Automotive Processing at GlobalFoundries 

Chiplets are individual semiconductor dies, each responsible for a distinct system’s function. These dies are integrated using advanced packaging to create a complete, high-performance system. This heterogeneous integration of different process technologies includes FinFet for logic, FD-SOI for RF, BCD for power management and FD-SOI or CMOS for analog mixed signal to form a System-in-Package. 

Unlike consumer or datacenter markets, the automotive product life cycles can last more than 15 years. Additionally, automotive systems rely on numerous analog sensors, switches, loads and actuators, requiring a range of analog and mixed signal IPs to support precise, safety-critical sensing and control.  

These long product lifecycles, combined with the need to balance evolving analog and mixed-signal capabilities with increasing digital compute demands, are key drivers behind the adoption of chiplet-based systems in automotive. Automotive chiplets can ensure the integration of I/O chiplets and power management chiplets on mature process nodes to match the industry life cycles and unique product features. Meanwhile, other digital-heavy chiplets could be refreshed, requalified or sourced from multiple vendors. 

Software-defined vehicles present significant opportunities for automotive chiplets across various domains, including cross-domain zonal controllers, central computer clusters, infotainment systems and smart sensor modules such as radars, lidars and sensor fusion systems. This can be accomplished by using various process technologies to address specific applications, including: 

Compute & Processing 

• Leading-edge CPU, GPU, and AI accelerator chiplets on sub-10nm nodes 

• Low-power ASIL-D MCU/MPU chiplets with TSN Ethernet, 10BaseT1S, and CAN-XL on GF’s 12LP+ and 22FDX platforms 

Memory & Data Handling 

• Centralized non-volatile memory and HBM chiplets 

Connectivity & I/O 

• Swappable I/O chiplets for diverse applications, optimized on GF’s 22FDX 

• Wireless chiplets (Wi-Fi, Bluetooth, UWB) on GF’s 22FDX 

Sensing & Perception 

• Radar RF front-end chiplets on GF’s 22FDX 

• Lidar front-end chiplets on GF’s silicon photonics platform 

• Sensor fusion modules 

Power Management 

• Power management and distribution chiplets on GF’s 55BCD platform 

Enabled by technology optimization, automotive chiplet systems improve system-level cost efficiency by scaling wafer costs across leading-edge and mature process nodes, and by enhancing overall system yields compared to large monolithic SoCs. Chiplet architectures also offer scalability and modularity by mixing and matching different chiplets to support various performance requirements. Additionally, they offer supply chain flexibility through multi-vendor sourcing of leading-edge chiplets, helping address varying customer and regional needs 

However, automotive chiplet development faces several challenges. These include significant packaging investments due to complexity and strict reliability standards; limited cooling capabilities compared to datacenters impacting thermal management of high-power chiplets and long-term thermal stress that can accelerate package degradation. Chiplet systems also require robust ecosystem frameworks for integration and interoperability. While industry-standard EDA tools are beginning to support chiplet simulation, design, and verification flows; these are not as established as those for monolithic solutions. Current die-to-die standardization is primarily driven by the UCIe Consortium, with ongoing efforts to establish standards for manufacturing and testability. 

Earlier in 2025, GlobalFoundries (GF) announced its first-of-its-kind advanced packaging and test capabilities center in New York, focused on essential chips for AI, automotive, and other applications. The facility will feature new production capabilities for advanced packaging, wafer-to-wafer bonding, assembly and testing of 3D and heterogeneous integrated chips using GF’s 12LP+, 22FDX, and other leading platforms. 

In addition to these planned investments and advancements, GF is expanding its IP portfolio to support chiplet-based systems and is actively collaborating with industry leaders on standardization, reliability and qualification to meet the rigorous demands of automotive applications.  

Wael Fakhreldin is a director of automotive processing at GlobalFoundries. He focuses on automotive microcontrollers, microprocessors, AI accelerators and chiplets enabling next generation vehicle electronic architectures.

By Anand Rangarajan, Director End Markets, GlobalFoundries 

As urban populations grow and infrastructure demands intensify, cities around the world are turning to the Internet of Things (IoT) to become smarter, more sustainable and more responsive to our residential needs. IoT technologies enable real-time data collection and analysis, allowing city systems to operate more efficiently and adaptively. 

What defines a smart city in the age of IoT? 

Smart cities integrate digital technologies into urban systems to improve the quality of life for residents, optimize resource use and enhance public services. This transformation is part of a broader shift in line with Industry 4.0 that combines cyber-physical systems, automation, and real-time data exchange. At the heart of this transformation is IoT—networks of connected devices that share data with each other for informed decision-making and automation.  

Top IoT applications powering smart cities today 

Smart cities are not just about technology; they’re about using data and connectivity to make cities more livable, resilient and sustainable. IoT enables this by embedding intelligence into everyday systems: traffic lights, water meters, waste bins and even streetlights become data sources that inform real-time decisions and long-term planning. 

Below are five key areas that are made possible through advancements in IoT technology to promote resource circularity and optimization: 

• Smart transportation & traffic management 
  IoT sensors embedded in traffic lights and roadways collect data that can be used to manage congestion, thereby reducing emissions and improving commute times. Real-time data enables dynamic traffic routing and predictive maintenance of infrastructure. 

• Waste management 
  IoT-enabled bins and collection systems can enable optimized pickup routes and schedules to reduce fuel consumption and improve sanitation services. 

• Energy efficiency 
  Smart grids and connected meters allow for better energy distribution and usage tracking, helping cities reduce consumption and integrate renewable sources. 

• Water & air quality monitoring 
  Sensors can monitor pollution levels and water quality, enabling timely interventions and policy adjustments to protect public health. Using real-time data to identify anomalies, monitoring water flow and pressure enables predictive maintenance and automated responses. 

• Public safety & emergency response 
  IoT devices such as surveillance cameras, gunshot detectors and connected emergency systems can enhance situational awareness and reduce response times. These technologies can be used to enable faster data sharing and automated alerts, helping first responders act more quickly and effectively in critical situations. 

The sustainability impact of IoT in smart cities  

Through the role of IoT in smart cities, these technologies contribute significantly to sustainability goals by reducing resource consumption (e.g., water and energy), lowering greenhouse gas emissions and improving public health outcomes. The convergence of IoT, AI, and Big Data enables real-time decision-making and policy development through data-driven insights that enhance a city’s infrastructural integrity. As highlighted in a comprehensive review published in Energy Informatics, smart cities are increasingly leveraging these technologies to optimize energy systems, transportation networks, waste management, and building operations, all of which are critical to achieving environmental sustainability. 

In addition to supporting sustainability goals, IoT also plays a vital role in advancing climate adaptation strategies within smart cities. By enabling real-time environmental monitoring—such as tracking temperature fluctuations, air quality and flood risks—IoT systems help cities anticipate and respond to climate-related challenges more effectively. These technologies support early warning systems, guide infrastructure upgrades and inform urban planning decisions that enhance resilience against extreme weather events and slong-term climate shifts. As a result, cities can better protect vulnerable populations, reduce recovery costs and maintain continuity in essential services. 

Key challenges in scaling smart city IoT infrastructure 

While the vision of smart cities is compelling, the path to realization is complex. Cities face several technological and infrastructural challenges that must be addressed to scale smart solutions effectively. 

1. Always-on devices need ultra-low power 
Smart city infrastructure relies on IoT devices that operate continuously, such as traffic sensors, air quality monitors, and smart lighting systems. Many of these devices are battery-powered and in hard-to-reach locations, making energy efficiency critical to minimize maintenance and extend operational life. These devices also require low-power communication capabilities to transmit data reliably without draining energy reserves. 

GF’s Solution: 
22FDX+ is designed for ultra-low power operation, enabling devices to run longer on less energy. Ideal for battery-powered, always-on applications, it supports low-power communication protocols, so devices stay connected while conserving energy. The platform’s Active Body Biasing feature further reduces the overall power envelope, enhancing real-time responsiveness and minimizing the need for frequent servicing, making it ideal for scalable smart city deployments. 

2. Complex power management across diverse systems 
From EV charging stations to automated traffic controls, smart cities integrate a wide range of systems, each with unique voltage and reliability requirements. Managing power across these systems efficiently is a major challenge. 

GF’s Solution: 
BCDLite enables robust mixed-signal designs by integrating low- and high-voltage components on a single chip. With proven automotive-grade reliability, it supports compact, scalable power management for critical infrastructure like smart streetlights and EV chargers. 

3. Data security & always-on connectivity 
With millions of connected devices transmitting data, smart cities must ensure secure, low-power memory solutions that support continuous operation and protect sensitive information. 

GF’s Solution: 
GF’s embedded RRAM and eMRAM technologies offer secure, ultra-low power memory for always-on devices. These platforms enable on-chip integration of memory, improving energy efficiency and supporting secure storage for credentials and cryptographic keys. 

4. Real-time urban intelligence from sensor fusion 
Smart cities require real-time situational awareness from diverse sensor inputs—audio, imaging, radar—to support public safety, traffic management, and environmental monitoring. 

GF’s Solution: 
GF’s 22FDX+ platform supports multimodal sensor fusion and edge AI, enabling real-time interpretation of complex urban environments. Its full SoC integration and RF capabilities make it ideal for smart infrastructure applications like gunshot detection and autonomous traffic systems. 

Together, these platforms empower cities to deploy intelligent infrastructure that reduces energy consumption, enhances mobility, and supports long-term sustainability goals. 

The future of smart cities: IoT, AI, and edge computing 

The convergence of IoT, AI and edge computing is accelerating the smart city agenda. For industry stakeholders, this means new opportunities in infrastructure, analytics and services. For sustainability advocates, it means actionable insights and measurable progress toward climate goals. 

To learn more about how GF is shaping the future of smart cities through sustainable technology, explore the latest insights in our Sustainability Report and discover how our platforms are driving tech-for-humanity solutions. 

Anand Rangarajan is Director, End Markets, at GlobalFoundries with a focus on edge AI and compute, which includes a range of segments such as smart home, wearables, augmented reality headsets and eyeglasses, asset tracking, sensor fusion, and health monitoring. He collaborates with customers and other stakeholders to enhance GF’s value proposition for these innovative applications in the edge and AI compute space. Prior to GF, he served as a product manager at Microchip.