September 20, 2017 GLOBALFOUNDRIES Delivers Custom 14nm FinFET Technology for IBM SystemsJointly developed 14HP process is world’s only technology that leverages both FinFET and SOI Santa Clara, Calif., Sept. 20, 2017 […] Read Press Release
September 20, 2017 GLOBALFOUNDRIES Unveils Vision and Roadmap for Next-Generation 5G ApplicationsTechnology platforms are uniquely positioned to enable a new era of ‘connected intelligence’ with the transition to 5G Santa Clara, […] Read Press Release
September 20, 2017 GLOBALFOUNDRIES and Soitec Enter Into Long-term Supply Agreement on FD-SOI WafersStrategic milestone to help guarantee a secure, high-volume supply of FD-SOI technology Santa Clara, Calif., and Bernin (Grenoble), France, Sept. […] Read Press Release
September 20, 2017 GLOBALFOUNDRIES Announces Availability of mmWave and RF/Analog on Leading FDX™ FD-SOI Technology PlatformTechnology solution delivers ‘connected intelligence’ to next generation high-volume wireless and IoT applications with lower power and significantly reduced cost […] Read Press Release
September 20, 2017 GLOBALFOUNDRIES Announces Availability of Embedded MRAM on Leading 22FDX® FD-SOI PlatformAdvanced embedded non-volatile memory solution delivers ‘connected intelligence’ by expanding SoC capabilities on the 22nm process node Santa Clara, Calif., […] Read Press Release
September 20, 2017 GLOBALFOUNDRIES Introduces New 12nm FinFET Technology for High-Performance ApplicationsNew 12LP technology offers density and performance improvement over current generation Platform features enhancements for next-gen automotive electronics and RF/analog […] Read Press Release
September 18, 2017 GLOBALFOUNDRIES Announces Enhanced RF SOI Process Design Kit For Use with CWS’ SiPEX™ Design SolutionEnhanced PDK incorporates design productivity tool to further enhance high-performance RF SOI switches Santa Clara, Calif., September 18, 2017 — […] Read Press Release
August 10, 2017 GLOBALFOUNDRIES Demonstrates 2.5D High-Bandwidth Memory Solution for Data Center, Networking, and Cloud ApplicationsSolution leverages 2.5D packaging with low-latency, high-bandwidth memory PHY built on FX-14™ ASIC design system Santa Clara, Calif., August 9, […] Read Press Release
