Sonnet Software, Inc. announced today that its electromagnetic (EM) simulation suite, utilizing their industry leading analysis engine, em, has been qualified on GLOBALFOUNDRIES (GF) 12nm FinFET (12LP) process technology. Designers can take advantage of Sonnet’s trademark accuracy for EM simulation while working with today’s demanding manufacturing processes, ensuring a faster design to market timeline.
Attopsemi’s I-fuse™ provides small size, high reliability, low program voltage/current, low power and wide temperature to enable GLOBALFOUNDRIES 22nm FDX® for AI, IoT, automotive, industry, and communication applications
Attopsemi’s I-fuse™ provides small size, high reliability, low program voltage/current, low power and wide temperature to enable GLOBALFOUNDRIES 22nm FDX® for AI, IoT, automotive, industry, and communication applications
如果想要寻找确凿证据证明5G网络革命的到来，就应该参加最近在巴塞罗那世界移动通信大会上由格芯发起的专题讨论会。
格芯的一位受邀专家在会上展示了一款已有的64单元28 GHz硅基天线，可用于毫米波(mmWave) 5G天线阵列。此外，会上还谈到了中国计划在今年就安装20万个5G基站，另有与会人士提到了目前已有多种半导体IP可以用于5G芯片设计，并基于格芯的差异化制造与封装技术进行制造。
资料来源：格芯
智能连接塑造数据驱动的未来（Intelligent Connectivity for a Data-Driven Future）是本次格芯专题讨论会的主题。智能连接是指数据中心、网络和客户端（或“边缘”）设备，如智能手机和物联网系统之间日益复杂紧密的相互关系。这些相互关系由数据驱动，并将日渐被AI赋能，进而重塑所触及的每一个行业，影响和改变我们生活的方方面面。
本次专题讨论会的目的是与世界移动通信大会的与会者分享5G专家的观点和意见，讨论内容包括市场分析、关键产品的供应、软件设计工具与服务的开发（用于创建和测试针对特定应用的创新型5G芯片）。
网络连接的爆炸式增长
本次讨论会由格芯全球销售、业务开发、客户和设计工程高级副总裁Mike Cadigan主持，格芯首席技术官兼全球客户解决方案副总裁Subi Kengeri作了开场发言。
Subi概述了全球无线连接的爆炸性增长及其带来的机遇和挑战。他强调，鉴于6GHz以下和毫米波5G应用的复杂性，网络运营商与设备、服务和IP提供商之间的密切合作至关重要。之后，他概述了格芯等半导体制造商的角色要如何发展才能实现所有这些目标，并介绍了格芯的差异化技术为5G应用带来的一些具体优势。
源自格芯的5G创新，新生代晶圆厂 资料来源：格芯
“我们现在生活在一个网络无处不在且日益增长的互联世界，这对任何人来说都不是新闻，但当前网络的速度和覆盖范围令人难以置信，”他说，“2017年，全球共有180亿台联网设备，相当于每人拥有2.4台联网设备，但到2022年，也就是三年以后，总数就将增加近一倍，达到约290亿台设备。”
此外，虽然目前移动数据流量每月约为27艾字节，但到2024年底，这一数字将达到大约136艾字节。“每个月的数据将达到136艾字节，而预计5G将占其中的25%，”他说，“换言之，届时全球超过40%的人口将使用5G，这将使5G成为有史以来在全球范围内推出的最快的无线网络。”
这种快速增长和全球覆盖范围对半导体设计和制造具有重大影响，而首当其冲的就是“创新”一词的含义，他谈到。
“过去，我们将创新描述为芯片技术的前沿发展，但今天，认为这种创新能够支持5G的大规模部署是天真的。特别是考虑到仅设计、验证、原型制作和生产一个5nm集成电路就可能花费超过五亿美元。”
他指出，5G领域的真正创新是打造出能够提供5G优化性能的设备，同时兼顾功耗、性能、射频和应用特定功能。“如今，功耗和每功能单位成本是关键指标，而不是特征尺寸。”他同时指出，一些既有的节点正在获得新生，因为现有流程正以新的方式将技术、特征、功能和支持相结合。
格芯正处于这一趋势的最前沿，拥有大量经过验证的支持5G的工艺。其中包括22FDX，可为移动设备等许多应用带来优异的功耗、性能和射频功能；而8SW RF SOI技术可为移动应用带来出众的功耗和性能。格芯还提供一系列封装技术，鉴于5G端点功率的增加，保障散热至关重要。
专家谈毫米波领域
Subi发言后是与讨论嘉宾的问答环节：
Mike Cadigan发起了讨论，他问Joe为什么电话公司等网络运营商会决定转向5G，以及5G部署速度方面的问题。“总体情况是，对于运营商而言，5G将大大降低数据传输成本，”他说，“2G网络出现后，每GB数据的传输成本从数千美元降到了数十美元。而如今，使用LTE和小型蜂窝，每GB的传输成本约为1美元，而使用毫米波后，每GB的成本不到10美分。因此，移动流量套餐在今后将趋向固定资费套餐，不限制流量。”
他指出，部署工作不会统一进行，需要一些时间才能发展完备。“一些国际网络运营商，特别是瑞士和中国的运营商，已经牢牢锁定了5G。例如，中国正在大力推进，计划在今年部署20万个5G基站，”他说，“但是，世界其他地区的部署情况不一，日本和韩国是早期采用者之一。”
在美国，运营商不会在全国范围内部署；而是利用现有的4G网络，建成一座座5G“岛屿”。“事实上，尽管大部分5G网络尚未部署，5G手机也正在推出。”他谈到。（在巴塞罗那世界移动通信大会之后不久，Verizon宣布很快将在芝加哥和明尼阿波利斯的部分地区开始提供5G服务，并且不限流量。）
然后Mike转向Alastair，询问他对5G技术要求的看法。Alastair拿着他带给观众看的28 GHz硅基阵列说，毫米波技术比6GHz以下的5G技术要复杂得多，而且在设备层面上非常需要更多的线性功率。“我们需要尽一切努力来提高硅的线性功率。”他说。
“此外，热管理在无线电传输中始终至关重要，而且今后也会是这样。不瞒你们说，几十年前，当相控阵雷达首次问世时，最初投入使用的一些雷达因为过热而起火了。因此，我们迫切需要在控制热量的同时提高电源效率，还要在此过程中降低每个发射器的成本。虽然可以通过电路技巧达到部分效果，但根本上还是要从硅入手。”他说。
“格芯为我们开发了一些非常好的器件选项，让我们能够选择不同的参数来定制适合特定应用的器件，这样我们就可以在工作中，提高工作电压并通过建模来衡量最终的可靠性。这非常有价值，是我们两家公司之间深度合作的产物。”他表示。
Joachim指出，设计复杂的片上系统(SoC)并非易事，而要确保产品达到设计目标也不容易。为此，Synopsys与格芯密切合作开发IP核心技术，如低功耗DDR内存接口(LPDDR)、高带宽内存接口(HBM)、PCI Express等，以提高SOC设计人员的生产力并降低项目风险。“除了可以利用Synopsys和其他IP提供商的许多IP核心技术之外，今天的设计人员还可以访问高级架构探索工具，基于将在SoC上执行的实际软件环境，在架构层面优化SoC。”
Cadigan最后向每位讨论嘉宾询问了格芯还应该做些什么。Joachim说格芯应该做比现在更多的事情：“复杂性越来越高，而这需要更密切的协作。”Joe重申了提高功率的重要性。“现在没有人使用滤波器，但随着我们向前发展，附近的频段会有竞争的运营商，因此需要更多的功率。”
Alastair表示，封装会变得更加重要，不仅仅是为了散热，更是为了提高集成度。此外，他回应Joachim说，建模功能将变得更加重要，特别是为了衡量可靠性。
Gary Dagastine是一位职业撰稿人，主要为EE Times、Electronics Weekly和许多专业媒体撰写关于半导体行业的文章。他是NanocEEhip Fab Solutions杂志的特约编辑，也是IEEE国际电子器件大会(IEDM)（全球最具影响力的半导体技术大会）的媒体关系主管。加入General Electric Co.之后，他开始涉足半导体行业，在该公司工作期间，他负责为GE功率、模拟和定制IC业务提供沟通支持。Gary毕业于纽约斯克内克塔迪联合大学。
马萨诸塞州洛厄尔和加利福尼亚州圣克拉拉，2019年3月5日 – MACOM Technology Solutions Inc.(“MACOM”)和格芯(“GF”)今天宣布战略合作，使用格芯当前一代硅光子产品90WG升级MACOM的创新激光光子集成电路(L-PIC™)平台，以满足数据中心和5G电信行业的需求。此次合作将利用格芯的300mm硅制造工艺来提供必要的成本、规模和容量，以期为超大规模数据中心互连和100G、400G及以上的5G网络部署实现主流L-PIC部署。
格芯的90WG基于该公司使用300mm晶圆处理的90nm SOI技术，可将光学器件（如调制器、多路复用器和检测器）以低成本集成到单个硅衬底中。MACOM的L-PIC技术解决了将激光器与硅基光子集成电路(PIC)对准的剩余关键挑战。利用MACOM获得专利的蚀刻刻面技术(EFT)激光器和获得专利的自对准EFT (SAEFTTM)工艺，MACOM的激光器可以高速和高耦合效率直接对准并连接硅光子芯片，从而加速在真正的工业规模应用中采用硅光子。
该行业正在进入云数据中心及5G光学构建中的高速光学连接的漫长升级周期。行业预测，2019年、2020年及以后将成为粗波分复用(CWDM)和PAM-4的强劲增长年，2019年整体需求量潜力将达到1000万台。凭借2016年实现160万个端口、2017年实现400万个端口和2018年实现600万个端口的记录，MACOM将与格芯合作以扩大L-PIC生产规模，旨在满足这一呈指数级增长的市场需求。
MACOM总裁兼首席执行官John Croteau表示，“随着每年数据中心内部带宽需求翻番，云服务提供商在迁移至100G及更高速率时供应受到限制。除此之外，电信运营商现在正为其5G网络构建采用相同的CWDM和PAM-4光学标准。高效扩展收发器容量和制造产能的能力至关重要。通过对齐格芯硅光子技术与MACOM的EFT激光器之间的产能扩充，以及迁移至300mm晶圆，我们相信，这种具有战略意义的合作将使我们能够满足行业需求，并使我们能够在未来几年继续为行业提供服务。”
格芯首席执行官汤姆∙嘉菲尔德表示，“作为硅光子解决方案和先进封装功能的领导企业，我们已经奠定了一个很好的基础，使我们的客户能够构建新一代高性能光互连。凭借我们深厚的制造专业知识，结合MACOM强大的技术，我们可以大规模提供差异化的硅光子解决方案，加快产品上市时间，并降低数据中心和新一代5G光学网络中客户端应用的成本。”
关于MACOM：
MACOM通过为光学、无线和卫星网络提供突破性半导体技术，满足当今社会对信息不断增长的需求，从而实现更好的互联和更安全的世界。
今天，MACOM为基础设施提供支持，数百万人时刻通过该基础设施进行沟通交流、处理业务、旅行、了解资讯和娱乐。我们的技术提高了移动互联网的速度并扩大了覆盖范围，使光纤网络能够将以前难以想象的流量带到企业、家庭和数据中心。
为了保证我们的安全，MACOM技术将新一代雷达技术用于空中交通管制和天气预报，以及在现代网络战场上成功执行任务。
MACOM是领先的通信基础设施、航空航天和国防公司的理想合作伙伴，通过出色的团队和广泛的模拟RF、微波、毫米波和光子半导体产品组合，帮助解决网络容量、信号覆盖、能源效率和现场可靠性等领域的复杂挑战。
MACOM是半导体行业的支柱，通过为客户提供真正的竞争优势和为投资者提供出色价值的大胆技术进步，60多年来一直在努力改变世界。
MACOM的总部位于马萨诸塞州洛厄尔，已通过ISO9001国际质量标准和ISO14001环境管理标准认证。MACOM在北美、欧洲和亚洲设有设计中心和销售办事处。
MACOM、M/A-COM、M/A-COM Technology Solutions、M/A-COM Tech、Partners in RF & Microwave、The First Name in Microwave和相关徽标是MACOM的商标。所有其他商标均为其各自所有者的财产。有关MACOM的更多信息，请访问www.macom.com，在Twitter上关注@MACOMtweets，在LinkedIn和Facebook上加入MACOM或访问MACOM YouTube频道。
About GF:
GLOBALFOUNDRIES (GF) is a leading full-service foundry delivering truly differentiated semiconductor technologies for a range of high-growth markets. GF provides a unique combination of design, development, and fabrication services, with a range of innovative IP and feature-rich offerings including FinFET, FDX™, RF and analog mixed signal. With a manufacturing footprint spanning three continents, GF has the flexibility and agility to meet the dynamic needs of clients across the globe. GF is owned by Mubadala Investment Company. For more information, visit www.globalfoundries.com.
关于前瞻性声明的特别说明：
本新闻稿包含基于MACOM的信念和假设以及MACOM目前可获得的信息的前瞻性声明。这些前瞻性声明反映了MACOM目前对未来事件的看法，并受可能导致这些事件或我们的实际活动或结果与任何前瞻性声明中所表达的内容产生重大差异的情况下的风险、不确定性、假设和变化的影响。尽管MACOM认为前瞻性声明中反映的预期是合理的，但它不能也不保证未来事件、结果、行动、活动水平、绩效或成就。请读者不要过分依赖这些前瞻性声明。许多重要因素可能导致实际结果与前瞻性声明所表明的结果大不相同，包括但不限于MACOM的10-K表上的年度报告、10-Q表上的季度报告和其他提交给美国证券交易委员会的文件的“风险因素”中描述的那些因素。无论是否出现新信息、未来事件或其他情况，MACOM均不承担公开更新或修订任何前瞻性声明的义务。
新产品免责声明：
MACOM产品公告中的任何明示或暗示声明均不构成任何形式的保证或可保证的规范。对于任何产品销售，MACOM可能提供的唯一保证是MACOM与购买方之间关于此类销售的书面购买协议中包含的保证，并由正式授权的MACOM员工签署，或者，如果MACOM的采购订单确认如此指示，MACOM标准报价或销售条款和条件中包含的有限保修，其副本可在以下网址找到：https://www.macom.com/purchases
有关销售信息，请联系：
North Americas — Phone:800.366.2266
Europe — Phone:+353.21.244.6400
India — Phone:+91.80.43537383
China — Phone:+86.21.2407.1588
媒体联系人：
Ozzie Billimoria
MACOM Technology Solutions Inc.
978-656-2896
ozzie.billimoria@macom.com
Colin Boroski
Rainier Communications
508-475-0025 x142
cboroski@rainierco.com
Anja-Maria Hastenrath
embedded PR
+49 (0)89 64913634-11
ah@embedded-pr.de
Erica McGill
GLOBALFOUNDRIES
518-795-5240
erica.mcgill@globalfoundries.com
Lowell, Massachusetts and Santa Clara, Calif., March 5, 2019 – MACOM Technology Solutions Inc. (“MACOM”), and GLOBALFOUNDRIES (“GF”) today announced a strategic collaboration to ramp MACOM’s innovative Laser Photonic Integrated Circuit (L-PIC™) platform using GF’s current-generation silicon photonics offering, 90WG, to meet Data Center and 5G Telecom industry demands. The collaboration will leverage GF’s 300mm silicon manufacturing process to deliver requisite cost, scale and capacity that is expected to enable mainstream L-PIC deployment for hyperscale Data Center interconnects and 5G network deployments at 100G, 400G and beyond.
GF’s 90WG, built on the company’s 90nm SOI technology using 300mm wafer processing, enables low-cost integration of optical devices like modulators, multiplexers and detectors into a single silicon substrate. MACOM’s L-PIC technology solves the remaining key challenge of aligning lasers to the silicon PIC. Leveraging MACOM’s patented Etched Facet Technology (EFT) lasers and a patented Self-Alignment EFT (SAEFTTM) process, MACOM’s lasers are aligned and attached directly to the silicon photonics die with high speed and high coupling efficiency, thereby accelerating the adoption of silicon photonics in true industrial-scale applications.
The industry is entering a long upgrade cycle for high speed optical connectivity within Cloud Data Centers as well as 5G optical buildouts. Industry forecasts project 2019, 2020 and beyond to be strong growth years for Coarse Wavelength Division Multiplexing (CWDM) and PAM-4, with the potential for overall unit demand in 2019, reaching volumes of 10 million units. With a track record of enabling 1.6 million ports in 2016, 4 million ports in 2017, and 6 million ports in 2018, MACOM will work with GF to scale L-PIC production aimed at meeting this exponentially growing market demand.
“With the demand for bandwidth doubling inside Data Centers each year, Cloud Service Providers are supply constrained in moving to 100G and beyond. On top of this, Telecom carriers are now adopting the same CWDM and PAM-4 optical standards for their 5G Network buildouts. The ability to efficiently scale transceiver capacity and manufacturing throughput is critical,” said John Croteau, President and CEO of MACOM. “By aligning capacity expansion between GF’s silicon photonics technology and MACOM’s EFT Lasers, and moving to 300mm wafers, we believe that this very strategic collaboration will allow us to meet industry demand and position us to service the industry for years to come.”
“We have built an incredible foundation as a leader in providing silicon photonic solutions and advanced packaging capabilities that enable our clients to build a new generation of high-performance optical interconnects,” said Tom Caulfield, CEO at GF. “With our deep manufacturing expertise, combined with MACOM’s strong technology, we can deliver differentiated silicon photonic solutions at scale, accelerate time-to-market, and reduce costs for client applications in Data Center and next-generation 5G optical networks.”
About MACOM:
MACOM enables a better-connected and safer world by delivering breakthrough semiconductor technologies for optical, wireless and satellite networks that satisfy society’s insatiable demand for information.
Today, MACOM powers the infrastructure that millions of lives and livelihoods depend on every minute to communicate, transact business, travel, stay informed and be entertained. Our technology increases the speed and coverage of the mobile Internet and enables fiber optic networks to carry previously unimaginable volumes of traffic to businesses, homes and Data Centers.
Keeping us all safe, MACOM technology enables next-generation radars for air traffic control and weather forecasting, as well as mission success on the modern networked battlefield.
MACOM is the partner of choice to the world’s leading communications infrastructure, aerospace and defense companies, helping solve their most complex challenges in areas including network capacity, signal coverage, energy efficiency and field reliability, through its best-in-class team and broad portfolio of analog RF, microwave, millimeterwave and photonic semiconductor products.
MACOM is a pillar of the semiconductor industry, thriving for more than 60 years of daring to change the world for the better, through bold technological strokes that deliver true competitive advantage to customers and superior value to investors.
Headquartered in Lowell, Massachusetts, MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard. MACOM has design centers and sales offices throughout North America, Europe, and Asia.
MACOM, M/A-COM, M/A-COM Technology Solutions, M/A-COM Tech, Partners in RF & Microwave, The First Name in Microwave and related logos are trademarks of MACOM. All other trademarks are the property of their respective owners. For more information about MACOM, please visit www.macom.com follow @MACOMtweets on Twitter, join MACOM on LinkedIn and Facebook or visit the MACOM YouTube Channel.
About GF:
GLOBALFOUNDRIES (GF) is a leading full-service foundry delivering truly differentiated semiconductor technologies for a range of high-growth markets. GF provides a unique combination of design, development, and fabrication services, with a range of innovative IP and feature-rich offerings including FinFET, FDX™, RF and analog mixed signal. With a manufacturing footprint spanning three continents, GF has the flexibility and agility to meet the dynamic needs of clients across the globe. GF is owned by Mubadala Investment Company. For more information, visit www.globalfoundries.com.
SPECIAL NOTE REGARDING FORWARD-LOOKING STATEMENTS:
This press release contains forward-looking statements based on MACOM’s beliefs and assumptions and on information currently available to MACOM. These forward-looking statements reflect MACOM’s current views about future events and are subject to risks, uncertainties, assumptions and changes in circumstances that may cause those events or our actual activities or results to differ materially from those expressed in any forward-looking statement. Although MACOM believes that the expectations reflected in the forward-looking statements are reasonable, it cannot and does not guarantee future events, results, actions, levels of activity, performance or achievements. Readers are cautioned not to place undue reliance on these forward-looking statements. A number of important factors could cause actual results to differ materially from those indicated by the forward-looking statements, including, but not limited to, those factors described in “Risk Factors” in MACOM’s Annual Report on Form 10-K, Quarterly Reports on Form 10-Q and other filings with the Securities and Exchange Commission. MACOM undertakes no obligation to publicly update or revise any forward-looking statement, whether as a result of new information, future events or otherwise.
DISCLAIMER FOR NEW PRODUCTS:
Any express or implied statements in MACOM product announcements are not meant as warranties or warrantable specifications of any kind. The only warranty MACOM may offer with respect to any product sale is one contained in a written purchase agreement between MACOM and the purchaser concerning such sale and signed by a duly authorized MACOM employee, or, to the extent MACOM’s purchase order acknowledgment so indicates, the limited warranty contained in MACOM’s standard Terms and Conditions for Quotation or Sale, a copy of which may be found at: https://www.macom.com/purchases
FOR SALES INFORMATION, PLEASE CONTACT:
North Americas — Phone: 800.366.2266
Europe — Phone: +353.21.244.6400
India — Phone: +91.80.43537383
China — Phone: +86.21.2407.1588
MEDIA CONTACTS:
Ozzie Billimoria
MACOM Technology Solutions Inc.
978-656-2896
ozzie.billimoria@macom.com
Colin Boroski
Rainier Communications
508-475-0025 x142
cboroski@rainierco.com
Anja-Maria Hastenrath
embedded PR
+49 (0)89 64913634-11
ah@embedded-pr.de
Erica McGill
GLOBALFOUNDRIES
518-795-5240
erica.mcgill@globalfoundries.com
穆巴达拉投资公司CEO强调 会一如既往支持格芯发展全新策略
[中国上海，2019年2月28日] – 日前，阿布扎比王储穆罕默德(Sheikh Mohamed bin Zayed)与新加坡国防部兼外交部高级政务部长孟理齐(Maliki Osman)博士在新加坡进行国事访问，期间亲自到访格芯(GLOBALFOUNDRIES)在新加坡的先进半导体制造厂。此次访问是阿布扎比王储亚洲访问的其中一站，旨在促进阿拉伯联合酋长国与亚洲各国的经济与技术合作。
位于新加坡兀兰工业区(Woodlands Industrial Park)的格芯新加坡厂，是阿拉伯联合酋长国在新加坡最大的投资项目。该厂总计超过5,500名员工，每年生产数百万片半导体晶元，产品应用范围广泛。目前，格芯新加坡厂在实施格芯的最新战略方针中，针对全球最具创新能力的芯片设计商的需求，为其开发并提供量身打造的差异化半导体解决方案。
阿布扎比王储穆罕默德（右一）及访问团参观格芯新加坡厂，格芯高级副总裁兼亚洲、欧洲晶圆厂运营总经理洪啟财（右二） 陪同介绍与交流
穆巴达拉投资公司(Mubadala Investment Company)是阿布扎比领先的战略投资公司，也是格芯的全资股东，阿布扎比王储穆罕默德担任穆巴达拉投资公司的董事局主席。随同阿拉伯联合酋长国访问团一同访问的还有其他政府和企业领导人，包括穆巴达拉投资公司的执行董事会主席兼首席执行官Khaldoon Khalifa Al Mubarak。
阿布扎比王储穆罕默德（左八）、新加坡国防部兼外交部高级政务部长孟理齐（左十）及穆巴达拉投资公司的执行董事会主席兼首席执行官KhaldoonKhalifa Al Mubarak（左七）与格芯高级副总裁兼亚洲、欧洲晶圆厂运营总经理洪啟财（左九）及随行访问政府团、格芯高层合影
“格芯新加坡厂的生产技术，赋能了现今全球超数十亿个的联网设备，推动了全球半导体产业进入创新新纪元。” Al Mubarak说道，“格芯凭借着自身专注及鼓舞人心的领导能力和明确策略，正在全力创造价值。正因如此，格芯将一如既往地是穆巴达拉核心投资组合中不可或缺的一部分。”
阿拉伯联合酋长国访问团参观了格芯新加坡全厂，巡视了格芯的生产设施并与高层进行交流。格芯展示了为支持先进制程的制造，在扩增、虚拟实境以及人工智能与机器学习上的创新成果。
关于格芯
格芯（GLOBALFOUNDRIES）是全球领先的全方位服务半导体代工厂，为世界上最富有灵感的科技公司提供独一无二的设计、开发和制造服务, 其创新的知识产权和功能多样的系列产品包括FinFET、FDX™、RF以及模拟混合信号。伴随着全球生产基地横跨三大洲的发展步伐，格芯促进了改变行业的技术和系统的出现，并赋予了客户塑造市场的力量。格芯由阿布扎比穆巴达拉投资公司（Mubadala Investment Company）所有。
媒体垂询：
杨颖（Jessie Yang）
(021) 8029 6826
ying.yang@globalfoundries.com
邢芳洁（Jay Xing）
86 18801624170
jay.xing@allisonpr.com
Visit reinforces support for GF as the company executes on its new strategy
Singapore, February 28, 2019 – GLOBALFOUNDRIES today hosted an official state visit by His Highness Sheikh Mohammed bin Zayed Al Nahyan, Crown Prince of Abu Dhabi and Deputy Supreme Commander of the United Arab Emirates Armed Forces, and Dr. Maliki Osman, Senior Minister of State, Ministry of Defense & Ministry of Foreign Affairs from Singapore, at the company’s advanced semiconductor manufacturing facility in Singapore. The visit was part of a broader regional tour to strengthen bilateral and economic collaboration between the UAE and a number of Asian countries.
The GLOBALFOUNDRIES facilities in the Woodlands Technology Park comprise Abu Dhabi’s largest investment in Singapore. With more than 5,500 employees and the capacity to manufacture millions of semiconductor wafers per year across a wide range of technologies, the site is leading the way in executing on GLOBALFOUNDRIES’ new strategy of providing differentiated semiconductor solutions tailored to the needs of the world’s most innovative chip designers.
His Highness Sheikh Mohammed bin Zayed Al Nahyan is the Chairman of Mubadala Investment Company, GLOBALFOUNDRIES’ 100% shareholder. Accompanying him on the visit were a number of government and business leaders including HE Khaldoon Khalifa Al Mubarak, Chairman of the Executive Affairs Authority and CEO and Managing Director of Mubadala Investment Company.
“The technologies manufactured here in Singapore are enabling a new era of innovation in a world that now has billions of connected devices,” said Al Mubarak. “With its focused and inspirational leadership and a clear strategy for value creation, GLOBALFOUNDRIES continues to be an integral part of Mubadala’s portfolio.”
The UAE delegation toured GF’s manufacturing facilities, met with company leadership, and received a demonstration of the company’s innovations in Augmented and Virtual Reality as well as Artificial Intelligence and Machine Learning, to support advances in the manufacturing process.
Photo Gallery (Click to Download):
About GF
GLOBALFOUNDRIES (GF) is a leading full-service foundry delivering truly differentiated semiconductor technologies for a range of high-growth markets. GF provides a unique combination of design, development, and fabrication services, with a range of innovative IP and feature-rich offerings including FinFET, FDX™, RF, and analog mixed signal. With a manufacturing footprint spanning three continents, GF has the flexibility and agility to meet the dynamic needs of clients across the globe. GF is 100% owned by Mubadala Investment Company. For more information, visit globalfoundries.com.
Contact:
Erica McGill
GLOBALFOUNDRIES
(518) 795-5240
erica.mcgill@globalfoundries.com
Nova today announced that its co-authored paper with GLOBALFOUNDRIES on “Implementation of machine learning for high volume manufacturing metrology challenges” has been selected as the winner of the Diana Nyyssonen award for “best paper at SPIE’s 2018 Advanced Lithography Symposia.” The award was granted to Nova and GF on the opening day of the 2019 Conference. The paper is a result of the continuous partnership between the companies and demonstrates the innovation Nova promotes in advanced process control utilizing its unique and differentiated software solutions. The methodology described in the paper was already installed and is utilized by GF in high volume manufacturing.
Nova today announced that its co-authored paper with GLOBALFOUNDRIES on “Implementation of machine learning for high volume manufacturing metrology challenges” has been selected as the winner of the Diana Nyyssonen award for “best paper at SPIE’s 2018 Advanced Lithography Symposia.” The award was granted to Nova and GF on the opening day of the 2019 Conference. The paper is a result of the continuous partnership between the companies and demonstrates the innovation Nova promotes in advanced process control utilizing its unique and differentiated software solutions. The methodology described in the paper was already installed and is utilized by GF in high volume manufacturing.