Sonnet Suites Qualified for GLOBALFOUNDRIES Advanced FinFET Process Technology
Sonnet Software, Inc. announced today that its electromagnetic (EM) simulation suite, utilizing their industry leading analysis engine, em, has been qualified on GLOBALFOUNDRIES (GF) 12nm FinFET (12LP) process technology. Designers can take advantage of Sonnet’s trademark accuracy for EM simulation while working with today’s demanding manufacturing processes, ensuring a faster design to market timeline.
Attopsemi’s I-fuse OTP Passed 3 lots of HTS and HTOL Qualification for 1,000hr on GLOBALFOUNDRIES 22FDX FD-SOI Technology
Attopsemi’s I-fuse™ provides small size, high reliability, low program voltage/current, low power and wide temperature to enable GLOBALFOUNDRIES 22nm FDX® for AI, IoT, automotive, industry, and communication applications
Attopsemi’s I-fuse OTP Passed 3 lots of HTS and HTOL Qualification for 1,000hr on GLOBALFOUNDRIES 22FDX FD-SOI Technology
Attopsemi’s I-fuse™ provides small size, high reliability, low program voltage/current, low power and wide temperature to enable GLOBALFOUNDRIES 22nm FDX® for AI, IoT, automotive, industry, and communication applications
智能连接塑造数据驱动的未来(Intelligent Connectivity for a Data-Driven Future)是本次格芯专题讨论会的主题。智能连接是指数据中心、网络和客户端(或“边缘”)设备,如智能手机和物联网系统之间日益复杂紧密的相互关系。这些相互关系由数据驱动,并将日渐被AI赋能,进而重塑所触及的每一个行业,影响和改变我们生活的方方面面。
Mike Cadigan发起了讨论,他问Joe为什么电话公司等网络运营商会决定转向5G,以及5G部署速度方面的问题。“总体情况是,对于运营商而言,5G将大大降低数据传输成本,”他说,“2G网络出现后,每GB数据的传输成本从数千美元降到了数十美元。而如今,使用LTE和小型蜂窝,每GB的传输成本约为1美元,而使用毫米波后,每GB的成本不到10美分。因此,移动流量套餐在今后将趋向固定资费套餐,不限制流量。”
Gary Dagastine是一位职业撰稿人,主要为EE Times、Electronics Weekly和许多专业媒体撰写关于半导体行业的文章。他是NanocEEhip Fab Solutions杂志的特约编辑,也是IEEE国际电子器件大会(IEDM)(全球最具影响力的半导体技术大会)的媒体关系主管。加入General Electric Co.之后,他开始涉足半导体行业,在该公司工作期间,他负责为GE功率、模拟和定制IC业务提供沟通支持。Gary毕业于纽约斯克内克塔迪联合大学。
MACOM、M/A-COM、M/A-COM Technology Solutions、M/A-COM Tech、Partners in RF & Microwave、The First Name in Microwave和相关徽标是MACOM的商标。所有其他商标均为其各自所有者的财产。有关MACOM的更多信息,请访问www.macom.com,在Twitter上关注@MACOMtweets,在LinkedIn和Facebook上加入MACOM或访问MACOM YouTube频道。
About GF:
GLOBALFOUNDRIES (GF) is a leading full-service foundry delivering truly differentiated semiconductor technologies for a range of high-growth markets. GF provides a unique combination of design, development, and fabrication services, with a range of innovative IP and feature-rich offerings including FinFET, FDX™, RF and analog mixed signal. With a manufacturing footprint spanning three continents, GF has the flexibility and agility to meet the dynamic needs of clients across the globe. GF is owned by Mubadala Investment Company. For more information, visit www.globalfoundries.com.
MACOM and GLOBALFOUNDRIES Collaborate to Scale Silicon Photonics to Hyperscale Cloud Data Center and 5G Network Buildouts
Collaborative agreement expands existing relationship, to deliver requisite cost, scale and capacity to enable mainstream L-PIC deployment for 100G, 400G and beyond
Multi-source supply chain leveraging GF’s global manufacturing footprint in Singapore and New York
Production scale of 300mm wafers is expected to enable exponential port growth in cloud Data Centers and 5G networks
Lowell, Massachusetts and Santa Clara, Calif., March 5, 2019 – MACOM Technology Solutions Inc. (“MACOM”), and GLOBALFOUNDRIES (“GF”) today announced a strategic collaboration to ramp MACOM’s innovative Laser Photonic Integrated Circuit (L-PIC™) platform using GF’s current-generation silicon photonics offering, 90WG, to meet Data Center and 5G Telecom industry demands. The collaboration will leverage GF’s 300mm silicon manufacturing process to deliver requisite cost, scale and capacity that is expected to enable mainstream L-PIC deployment for hyperscale Data Center interconnects and 5G network deployments at 100G, 400G and beyond.
GF’s 90WG, built on the company’s 90nm SOI technology using 300mm wafer processing, enables low-cost integration of optical devices like modulators, multiplexers and detectors into a single silicon substrate. MACOM’s L-PIC technology solves the remaining key challenge of aligning lasers to the silicon PIC. Leveraging MACOM’s patented Etched Facet Technology (EFT) lasers and a patented Self-Alignment EFT (SAEFTTM) process, MACOM’s lasers are aligned and attached directly to the silicon photonics die with high speed and high coupling efficiency, thereby accelerating the adoption of silicon photonics in true industrial-scale applications.
The industry is entering a long upgrade cycle for high speed optical connectivity within Cloud Data Centers as well as 5G optical buildouts. Industry forecasts project 2019, 2020 and beyond to be strong growth years for Coarse Wavelength Division Multiplexing (CWDM) and PAM-4, with the potential for overall unit demand in 2019, reaching volumes of 10 million units. With a track record of enabling 1.6 million ports in 2016, 4 million ports in 2017, and 6 million ports in 2018, MACOM will work with GF to scale L-PIC production aimed at meeting this exponentially growing market demand.
“With the demand for bandwidth doubling inside Data Centers each year, Cloud Service Providers are supply constrained in moving to 100G and beyond. On top of this, Telecom carriers are now adopting the same CWDM and PAM-4 optical standards for their 5G Network buildouts. The ability to efficiently scale transceiver capacity and manufacturing throughput is critical,” said John Croteau, President and CEO of MACOM. “By aligning capacity expansion between GF’s silicon photonics technology and MACOM’s EFT Lasers, and moving to 300mm wafers, we believe that this very strategic collaboration will allow us to meet industry demand and position us to service the industry for years to come.”
“We have built an incredible foundation as a leader in providing silicon photonic solutions and advanced packaging capabilities that enable our clients to build a new generation of high-performance optical interconnects,” said Tom Caulfield, CEO at GF. “With our deep manufacturing expertise, combined with MACOM’s strong technology, we can deliver differentiated silicon photonic solutions at scale, accelerate time-to-market, and reduce costs for client applications in Data Center and next-generation 5G optical networks.”
About MACOM:
MACOM enables a better-connected and safer world by delivering breakthrough semiconductor technologies for optical, wireless and satellite networks that satisfy society’s insatiable demand for information.
Today, MACOM powers the infrastructure that millions of lives and livelihoods depend on every minute to communicate, transact business, travel, stay informed and be entertained. Our technology increases the speed and coverage of the mobile Internet and enables fiber optic networks to carry previously unimaginable volumes of traffic to businesses, homes and Data Centers.
Keeping us all safe, MACOM technology enables next-generation radars for air traffic control and weather forecasting, as well as mission success on the modern networked battlefield.
MACOM is the partner of choice to the world’s leading communications infrastructure, aerospace and defense companies, helping solve their most complex challenges in areas including network capacity, signal coverage, energy efficiency and field reliability, through its best-in-class team and broad portfolio of analog RF, microwave, millimeterwave and photonic semiconductor products.
MACOM is a pillar of the semiconductor industry, thriving for more than 60 years of daring to change the world for the better, through bold technological strokes that deliver true competitive advantage to customers and superior value to investors.
Headquartered in Lowell, Massachusetts, MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard. MACOM has design centers and sales offices throughout North America, Europe, and Asia.
MACOM, M/A-COM, M/A-COM Technology Solutions, M/A-COM Tech, Partners in RF & Microwave, The First Name in Microwave and related logos are trademarks of MACOM. All other trademarks are the property of their respective owners. For more information about MACOM, please visit www.macom.com follow @MACOMtweets on Twitter, join MACOM on LinkedIn and Facebook or visit the MACOM YouTube Channel.
About GF:
GLOBALFOUNDRIES (GF) is a leading full-service foundry delivering truly differentiated semiconductor technologies for a range of high-growth markets. GF provides a unique combination of design, development, and fabrication services, with a range of innovative IP and feature-rich offerings including FinFET, FDX™, RF and analog mixed signal. With a manufacturing footprint spanning three continents, GF has the flexibility and agility to meet the dynamic needs of clients across the globe. GF is owned by Mubadala Investment Company. For more information, visit www.globalfoundries.com.
SPECIAL NOTE REGARDING FORWARD-LOOKING STATEMENTS:
This press release contains forward-looking statements based on MACOM’s beliefs and assumptions and on information currently available to MACOM. These forward-looking statements reflect MACOM’s current views about future events and are subject to risks, uncertainties, assumptions and changes in circumstances that may cause those events or our actual activities or results to differ materially from those expressed in any forward-looking statement. Although MACOM believes that the expectations reflected in the forward-looking statements are reasonable, it cannot and does not guarantee future events, results, actions, levels of activity, performance or achievements. Readers are cautioned not to place undue reliance on these forward-looking statements. A number of important factors could cause actual results to differ materially from those indicated by the forward-looking statements, including, but not limited to, those factors described in “Risk Factors” in MACOM’s Annual Report on Form 10-K, Quarterly Reports on Form 10-Q and other filings with the Securities and Exchange Commission. MACOM undertakes no obligation to publicly update or revise any forward-looking statement, whether as a result of new information, future events or otherwise.
DISCLAIMER FOR NEW PRODUCTS:
Any express or implied statements in MACOM product announcements are not meant as warranties or warrantable specifications of any kind. The only warranty MACOM may offer with respect to any product sale is one contained in a written purchase agreement between MACOM and the purchaser concerning such sale and signed by a duly authorized MACOM employee, or, to the extent MACOM’s purchase order acknowledgment so indicates, the limited warranty contained in MACOM’s standard Terms and Conditions for Quotation or Sale, a copy of which may be found at: https://www.macom.com/purchases
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Abu Dhabi Crown Prince Visits GLOBALFOUNDRIES Singapore Campus
Visit reinforces support for GF as the company executes on its new strategy
Singapore, February 28, 2019 – GLOBALFOUNDRIES today hosted an official state visit by His Highness Sheikh Mohammed bin Zayed Al Nahyan, Crown Prince of Abu Dhabi and Deputy Supreme Commander of the United Arab Emirates Armed Forces, and Dr. Maliki Osman, Senior Minister of State, Ministry of Defense & Ministry of Foreign Affairs from Singapore, at the company’s advanced semiconductor manufacturing facility in Singapore. The visit was part of a broader regional tour to strengthen bilateral and economic collaboration between the UAE and a number of Asian countries.
The GLOBALFOUNDRIES facilities in the Woodlands Technology Park comprise Abu Dhabi’s largest investment in Singapore. With more than 5,500 employees and the capacity to manufacture millions of semiconductor wafers per year across a wide range of technologies, the site is leading the way in executing on GLOBALFOUNDRIES’ new strategy of providing differentiated semiconductor solutions tailored to the needs of the world’s most innovative chip designers.
His Highness Sheikh Mohammed bin Zayed Al Nahyan is the Chairman of Mubadala Investment Company, GLOBALFOUNDRIES’ 100% shareholder. Accompanying him on the visit were a number of government and business leaders including HE Khaldoon Khalifa Al Mubarak, Chairman of the Executive Affairs Authority and CEO and Managing Director of Mubadala Investment Company.
“The technologies manufactured here in Singapore are enabling a new era of innovation in a world that now has billions of connected devices,” said Al Mubarak. “With its focused and inspirational leadership and a clear strategy for value creation, GLOBALFOUNDRIES continues to be an integral part of Mubadala’s portfolio.”
The UAE delegation toured GF’s manufacturing facilities, met with company leadership, and received a demonstration of the company’s innovations in Augmented and Virtual Reality as well as Artificial Intelligence and Machine Learning, to support advances in the manufacturing process.
GLOBALFOUNDRIES (GF) is a leading full-service foundry delivering truly differentiated semiconductor technologies for a range of high-growth markets. GF provides a unique combination of design, development, and fabrication services, with a range of innovative IP and feature-rich offerings including FinFET, FDX™, RF, and analog mixed signal. With a manufacturing footprint spanning three continents, GF has the flexibility and agility to meet the dynamic needs of clients across the globe. GF is 100% owned by Mubadala Investment Company. For more information, visit globalfoundries.com.
NOVA and GLOBALFOUNDRIES Jointly Awarded the “Best Metrology Paper” at SPIE Advanced Lithography Conference
Nova today announced that its co-authored paper with GLOBALFOUNDRIES on “Implementation of machine learning for high volume manufacturing metrology challenges” has been selected as the winner of the Diana Nyyssonen award for “best paper at SPIE’s 2018 Advanced Lithography Symposia.” The award was granted to Nova and GF on the opening day of the 2019 Conference. The paper is a result of the continuous partnership between the companies and demonstrates the innovation Nova promotes in advanced process control utilizing its unique and differentiated software solutions. The methodology described in the paper was already installed and is utilized by GF in high volume manufacturing.
NOVA and GLOBALFOUNDRIES Jointly Awarded the “Best Metrology Paper” at SPIE Advanced Lithography Conference
Nova today announced that its co-authored paper with GLOBALFOUNDRIES on “Implementation of machine learning for high volume manufacturing metrology challenges” has been selected as the winner of the Diana Nyyssonen award for “best paper at SPIE’s 2018 Advanced Lithography Symposia.” The award was granted to Nova and GF on the opening day of the 2019 Conference. The paper is a result of the continuous partnership between the companies and demonstrates the innovation Nova promotes in advanced process control utilizing its unique and differentiated software solutions. The methodology described in the paper was already installed and is utilized by GF in high volume manufacturing.