March 6, 2026 As the aerospace and defense community gathers at the GOMACTech Conference next week, industry leaders will focus on non-negotiables in the industry including assured access; trusted supply for uncompromised integrity and confidentiality; and modernization activities to innovate national defense systems. However, none of that progress is sustainable without manufacturing that is secure, scalable and built for long program lifecycles. At GlobalFoundries, we’re committed to meeting these needs through domestic semiconductor manufacturing across our Trusted accredited facilities in Malta, New York and Burlington, Vermont. As a long-standing supplier to the U.S. A&D ecosystem, our onshore footprint plays an essential role in strengthening resilient semiconductor capabilities, leveraging scale for commercial and industrial markets, and specializing for the aerospace and defense market. That’s why we’ve been accelerating the transfer, ramp and launch of key process technologies in the U.S. to deliver enhanced security and strengthen domestic supply for applications ranging from secure communications and radar to SATCOM, signal processing and power systems. FDX™ and FinFET: Efficient compute for secure, connected defense systems In GF’s Malta fab in New York, FDX production is ramping up after first being announced in our collaboration with NXP. This platform brings fully-depleted SOI benefits to systems that must deliver strong performance within tight thermal and power budgets. For defense modernization, our FDX technology supports secure communications and networking by enabling power-efficient compute and control closer to the edge, advances edge autonomy through low-latency processing for sensor fusion and real-time decision-making and enables signal-chain integration by bringing mixed workloads together alongside RF-adjacent subsystems. From SATCOM front-end modules to smart sensors, FDX is building the next generation of connected and secure solutions critical to the A&D industry. Another important high-performance, energy-efficient compute platform manufactured in New York is our FinFET technology. As the industry’s most complete 1X FinFET platform, this technology offers a winning combination of processing performance, secure connectivity, power efficiency, reliability and radiation hardness in a customizable, compact design backed by over a decade of manufacturing expertise. Customers like BAE Systems utilize GF’s technology for advanced avionics and telecommunications applications that can withstand the harsh environment of space. Feature-rich, energy-efficiency at scale Defense systems are increasingly distributed across sensors, radios, trackers and microcontrollers operating at the edges – often in environments where battery life, temperature and reliability define what’s possible. GF’s ultra-low power 40nm platform is designed for exactly these kinds of needs with ultra-low standby leakage, high endurance and integrated analog features. First announced last October, GF is bringing our 40nm ultra-low power technology to New York – a critical step forward for A&D customers planning next-generation low-power connectivity and control solutions back by resilient U.S. manufacturing. 12S0 is another critical technology manufactured through our New York site that A&D customers like BAE Systems trust and have flight-proven for radiation-hardened by design solutions for sensitive space applications. A highly-customizable platform with power efficiency and area benefits and supported by a robust design ecosystem partner, 12S0 provides the flexibility and reliability needed for efficient and scalable electronic systems. 45RFSOI & 45RFE: RF performance for SATCOM front-ends and beamformers Modern defense communications rely on spectrum agility, beam steering and high-efficiency RF front ends, particularly as SATCOM architectures evolve and phased arrays proliferate across air, land, sea and space. That’s why GF produces 45RFSOI and 45RFE in Malta, New York to support RF front-end and beamforming requirements. 45RFSOI is designed for very high-frequency wireless systems, including advanced radar and 5G/6G mmWave applications, while 45RFE enables handset and battery-operated devices with lower leakage and an enhanced PA device. These platforms help A&D customers integrate more RF functionality in compact form factors without compromising performance. CBIC: GF’s highest-performing SiGe to date GF’s CBIC complimentary Bi-CMOS silicon germanium platform is the highest performing SiGe platform to date, targeting high-performance, high-speed communications. With full production ramp in Vermont slated for this year, the CBIC platform will expand trusted domestic access for applications where RF performance and consistency are critical, including SATCOM and advanced radar applications. In practice, that performance translates into tangible system benefits. For example, in low-noise amplifiers the technology design allows for ultra-low noise figure at reduced current consumption. In advanced radar systems, CBIC technology enables high-resolution sensing and distance ranging in a reduced form factor, supporting more capable sensing architectures where space, weight and power are tightly constrained. Power GaN: Advancing U.S.-manufactured power for next-gen platforms Power is a strategic differentiator in defense, impacting endurance, payload capacity, thermal design and system reliability. As gallium nitride (GaN) becomes a key enabler for higher energy efficiency, greater power density and compactness in power systems, GF has expanded its power roadmap by entering into a technology licensing agreement with TSMC for 650V and 80V GaN. By pairing proven GaN technology with GF’s focus on robust manufacturing, we’re advancing power solutions designed for harsh operating environments and addressing critical gaps for mission-critical platforms that can’t afford performance tradeoffs. Why GF’s technology leadership is central to trusted A&D manufacturing Trusted manufacturing is strongest when it’s backed by a thriving ecosystem that brings together innovative process technologies, committed customers and long-term partnerships that reinforce scale and longevity. This combination validates that U.S.-based production can deliver leading capability while also meeting the security and assurance expectations that aerospace and defense programs require. As demand for trusted U.S. manufacturing accelerates, GF remains aligned with national security priorities by strengthening domestic semiconductor resilience and long-term defense readiness, today and into the future.
