Third party press releases & news Archive May 21, 2026 UCLA Samueli School of Engineering launches $125 million semiconductor hub with top industry leaders Read More: UCLA Samueli School of Engineering launches $125 million semiconductor hub with top industry leaders May 20, 2026 Children’s Museum at Saratoga unveils “Fab Lab” exhibit bringing semiconductor manufacturing to life Read More: Children’s Museum at Saratoga unveils “Fab Lab” exhibit bringing semiconductor manufacturing to life May 15, 2026 Siemens unveils AI-powered library characterization to accelerate semiconductor design Read More: Siemens unveils AI-powered library characterization to accelerate semiconductor design May 7, 2026 SCALINX Joins GlobalFoundries GlobalSolutions Ecosystem to Expand High-Speed Data Converter SoC Solutions Read More: SCALINX Joins GlobalFoundries GlobalSolutions Ecosystem to Expand High-Speed Data Converter SoC Solutions March 23, 2026 Jmem Tek Joins GlobalFoundries Ecosystem to Expand Post-Quantum Security Solutions Read More: Jmem Tek Joins GlobalFoundries Ecosystem to Expand Post-Quantum Security Solutions March 18, 2026 Flexcompute and GlobalFoundries Enable Integrated Design and Simulation on GF Silicon Photonics Platform Read More: Flexcompute and GlobalFoundries Enable Integrated Design and Simulation on GF Silicon Photonics Platform March 18, 2026 Luceda Photonics and GlobalFoundries Announce Strategic Collaboration to Deliver Luceda PDK, Accelerating Silicon Photonics Innovation Read More: Luceda Photonics and GlobalFoundries Announce Strategic Collaboration to Deliver Luceda PDK, Accelerating Silicon Photonics Innovation March 17, 2026 NLM Photonics Samples Silicon Organic Hybrid PICs Manufactured at GlobalFoundries Read More: NLM Photonics Samples Silicon Organic Hybrid PICs Manufactured at GlobalFoundries March 16, 2026 EXFO’s Industry-leading Innovations Supporting AI Infrastructure from Chip to System to Data Center Exhibited at OFC 2026 Read More: EXFO’s Industry-leading Innovations Supporting AI Infrastructure from Chip to System to Data Center Exhibited at OFC 2026 1 2 3 4 Next»
