Sensor fusion in action: How cameras and LiDAR integrate with radar for safer driving January 29, 2026 By Yuichi Motohashi. Dep. Director / Global Segment Lead, Automotive Display, Camera, LiDAR & SerDes, GlobalFoundries Sense – analyze – act. This is the principle that advanced driver assistance systems (ADAS) operate on. Modern vehicles rely on a network of sensors to build a more precise, reliable perception of their surroundings. Sensor fusion combines these inputs – from radar, camera, LiDAR, and ultrasound – with artificial intelligence and deep learning to deliver the environmental acuity required for vehicles to make split-second decisions. Since 1999, when Mercedes-Benz “taught the car to see,” radar has been a proven cornerstone of ADAS. However, camera and LiDAR technologies are rapidly advancing, adding new levels of detail and depth to a vehicle’s perception. LiDAR in particular has long been stuck in the space between functional solutions and scalable manufacturing. GF is closing that gap, using FinFET, advanced packaging and photonics to unlock the path to mass-market viability. Together, complementary sensors provide high-resolution imagery, 3D mapping and object classification capabilities – each essential for the safer driving of today, and the fully autonomous mobility of tomorrow. Cameras: Sharpening your car’s view of the world Cameras capture high-quality images around cars to detect lane markings, speed limits, turn signals, pedestrians and more. Sophisticated algorithms analyze images taken by cameras to determine the distance, size, and speed of objects, enabling the system to react appropriately. Automotive cameras do not utilize ultra-high megapixel counts like mobile phones because additional pixels result in increased data for the vehicle’s computer system to process. Producing extremely high-resolution images would significantly expand the volume of data transmitted to the central processor, potentially exceeding the capabilities of System on Chips (SoCs) that must analyze this information instantaneously to ensure safety. Excessive data could hinder processing speeds or overwhelm the system. Consequently, it is essential to carefully balance detection distance with the processing power required by the central SoC. The primary image quality Key Performance Indicator (KPI) is dynamic range, which is vital for maintaining accuracy in difficult lighting and weather conditions—ranging from intense sunlight at dusk to darkness, heavy rainfall, or fog. Achieving such high dynamic range imaging necessitates increasingly sophisticated Read-out ICs (ROIC) within automotive stacked CMOS Image Sensors (CIS). There exists a direct relationship between system-level, circuit-level and transistor-level requirements for high-performance automotive CIS ROIC. System-level Enhanced resolution (from 8MP to 12–16MP), frame rate (≥30fps), and dynamic range (≥130dB) are necessary, collectively increasing the processing load on the ROIC. Transmission bandwidth of at least 6Gbps is essential, underscoring the need for SerDes integration. Long‑range detection depends on high pixel resolution, high-speed operation and minimal read noise (including 1/f and RTS noise). Improved low‑light performance requires minimizing both ADC and transistor noise. Circuit-level To accommodate high bandwidth, circuits must achieve elevated clock speeds, low jitter and reduced noise. Die size limitations call for high capacitor density, robust transconductance (gm) and efficient logic cell area usage. Reliable functionality at temperatures up to 125°C demands low leakage characteristics. Transistor-level High-speed operation mandates transistors with superior Ft/Fmax and low-noise characteristics. Consistent performance at elevated temperatures relies on effective leakage control and optimized transistor density. Images captured by vehicular cameras underpin many Advanced Driver-Assistance Systems (ADAS) features, such as lane departure warnings, collision avoidance and parking assistance, making them integral to contemporary automotive safety solutions. GF’s advanced technology platform continues to facilitate the development of state-of-the-art automotive CIS solutions. LiDAR: Mapping the roads in 3D If cameras are the car’s eyes, LiDAR adds depth perception. Instead of 2D images, LiDAR emits laser pulses and measures their return to generate a 3D point cloud of the surroundings. By doing this, LiDAR generates a detailed 3D map of the world around your vehicle. This is ultimately how the car knows the difference between a pedestrian, a bicyclist, an animal, another car or a garbage can. Take Aurora, the driverless commercial self-driving truck service. Its long-range lidar detects objects in the dark of night over 450 meters away, even identifying objects as quickly as 11-seconds sooner than a traditional driver would. This precise 3D vision powers today’s ADAS features, like lane keeping, pedestrian detection and adaptive cruise control, and is laying the foundation for full self-driving functionality in the future. Key figures of merit for automotive LiDAR systems Detection range and accuracy Long‑range LiDAR must exceed 300 m detection distance. Field of View (FoV) Short‑range LiDAR Horizontal FoV target ~150° Vertical FoV: 20–30° Angular resolution: Long‑range: 0.1–0.15° Short‑range: 0.6° Distance resolution/ranging accuracy Target improvement to around 5 cm accuracy Frame rate Increased target: 30 fps Point rate dToF: Increase to ~10 M pts/sec FMCW: Expected ~2 M pts/sec Power consumption System-level power target: << 20 W How GlobalFoundries powers smarter sensors GF is at the forefront of advancing both camera and LiDAR technologies, delivering solutions that improve performance, integration, and efficiency. For camera, the image sensor is the core component that determines the performance of automotive cameras. GlobalFoundries delivers advanced Readout IC (ROIC) solutions for stacked CMOS Image Sensors (CIS), utilizing industry-leading 40nm and 22nm process nodes to meet the demanding requirements of next-generation automotive applications. 40nm and 22nm platforms provide low-noise performance for analog circuits and low power consumption even under extreme automotive high temperatures. In particular, 40nm-equipped image sensor has great image quality and high reliability, while 22nm based platform also offers outstanding signal processing capabilities, low-power operations. Some of the benefits are: Higher resolution and improved dynamic range: GF’s solutions enable image sensors to capture higher resolution images with higher dynamic range, by enabling faster, low noise A/D conversion with lower power consumption System integration: Integrating essential components like memory, ISP (Image signal processor), analog and high-speed interface onto a single chip simplifies the complexity of ADAS. With cameras generating and processing high volumes of data, Serializer/Deserializer technology converts data into a fast, streamlined stream, sends it over just single wires, and then converts it back for processing. GF is playing an active role in the OpenGMSL alliance and supporting SerDes-integrated smart sensors. For LiDAR, GF’s silicon photonics on the 45SPCLO platform could integrate laser source, light emitter, receiver and signal processing on a single chip, reducing LiDAR size and making it easier to fit into vehicles. Working with both O-band and C-brand wavelengths, the platform also uses a special silicon nitride (SiN) waveguide to achieve best-in-class propagation loss properties. In addition, GF’s HP silicon germanium (SiGe) is the gold standard for image quality in high-performance LiDARs, and offers unparalleled response times for transimpedance amplifiers to process signals and detect objects faster. Die Vorteile sind: Miniaturization: Integrating multiple optical components onto one chip results in more cost-efficient, compact LiDAR systems. Developing highly integrated, true solid-state FMCW LiDAR results in lower manufacturing costs, making LiDAR more accessible. Electronics integration: Combining SiPh with CMOS electronics enables enhanced signal processing for smarter, more capable sensors. The rise of cameras and LiDAR to steer the future of autonomous driving Radar, cameras and LiDAR each shine on their own, but they need to work in concert when it comes to making cars smarter and safer. GF’s technology sits at the heart of fusing these sensors, helping cars on the road to see farther, react quicker and make smarter decisions in the blink of an eye. While cameras and LiDARs are more emerging technologies in the automotive industry, there’s massive potential to advance their performance and integration. GF is empowering automakers to accelerate the deployment of safer, smarter and more autonomous vehicles. Autor-Biografie Yuichi Motohashi is the Deputy Director of End Markets at GlobalFoundries, responsible for leading the global segment in automotive cameras, LiDAR, SerDes and displays, which facilitate next-generation ADAS, autonomous driving and enhanced in-cabin experiences.
Physical AI Moves Center Stage: Why Data Center Investments Are Enabling Real-World Robotics January 23, 2026 Mike Hogan, Chief Business Officer, GlobalFoundries Robots and Physical AI systems are entering a breakthrough moment, evolving from experimental demonstrations into practical tools that operate, react and make decisions in the physical world. Their rapid advancement underscores a major shift underway. AI is moving to the edge, becoming embedded in the devices and machines that surround us.In fact, UBS predicts the market will reach up to $1.7 trillion by 2050 for humanoid robots alone. But behind this transformation lies a critical foundation: the massive investment cycle in AI data centers, which is now opening the door to Physical AI and reshaping semiconductor requirements. This is where GlobalFoundries comes in, delivering the essential semiconductor technology needed to bring Physical AI applications to life. The data center investment cycle What might look like sudden excitement around Physical AI is really the natural next step in a long‑running infrastructure build‑out. Every major leap in our industry starts this way: the foundation gets built first and then the applications explode. And that’s exactly what’s happening now, AI infrastructure is finally primed to push intelligence out of the cloud and into the physical world. Now, massive investments in AI data centers are driving forward a new investment cycle, but the real market opportunity is the next phase of the cycle: Physical AI, aimed at enabling billions of physical devices — from wearable devices to autonomous vehicles — to sense, think, act and communicate in real time. This cycle is accelerating at breakneck speed—market projections indicate an explosive annual growth rate of 33.49% from 2025 to 2034, an opportunity too urgent to ignore. The emergence of Physical AI This momentum signals that Physical AI is moving beyond pilots and prototypes and into scaled, real-world deployment. As data centers face mounting constraints around power and compute, Physical AI helps alleviate this pressure by shifting intelligence and decision-making to the edge directly onto devices, further accelerating this adoption. Physical AI continuously aggregates data from diverse sensors, processes information at varying levels of fidelity and makes decisions that are executed through motors and actuators in split seconds. These systems also operate across multiple sensor domains, enabling a true form of intelligent autonomy that allows machines to sense, think, act and communicate within the physical world. Real world applications taking shape You may not know it, but you’re likely familiar with emerging applications of physical AI today. Think of advanced driver-assistance systems, home robotics, drones, smart infrastructure, and even AI-enabled medical and diagnostic equipment. In markets around the world, physical AI is already being applied in areas such as mobility assistance and rehabilitation, where intelligent, on‑device systems support seniors, patients and industrial workers. These deployments show how real‑time decision‑making at the edge enables practical, scalable solutions. And as Physical AI continues to gain momentum, it is driving new and more complex demands for semiconductor innovation. How Physical AI workloads reshape semiconductor requirements As highlighted by the real-world deployments at CES this year, Physical AI workloads are fundamentally different than those driving generative AI, concentrated primarily in data centers. Physical AI introduces more complex and diverse workloads than generative AI models. As chip designers’ expectations rise for devices to continuously gather and process data and end users’ expectations rise for devices to execute commands and communicate in dynamic, unpredictable environments, these evolving demands are redefining semiconductor requirements. And here’s the breakdown of how: Sense: Physical AI drives explosive growth in sensing, requiring precision analog, high‑performance RF and tightly integrated mixed‑signal solutions. GF’s FDX® platform, known for its RF performance, leakage control and high‑temperature reliability, already powers sensing in industrial automation and ADAS. As modalities expand across vision, radar, lidar and environmental sensing, GF’s precision analog, SiGe RF and integrated memory technologies provide the low‑power foundation needed to capture and preprocess real‑world data. Think: Real‑time autonomy demands ultra‑low‑power, workload‑optimized compute. MIPS’ multi‑threaded RISC‑V CPUs deliver deterministic, event‑driven performance, prioritizing critical tasks and enabling instant response at the edge. Paired with GF’s energy‑efficient FDX® and FinFET technologies, these platforms push compute from centralized cloud environments into billions of devices in a distributed intelligence model. Act: Executing decisions in the physical world requires high‑precision control, low latency and tight integration across motors and actuators. GF’s BCD, power GaN, mixed‑signal IP and high‑reliability CMOS support dense I/O, fast motor‑control loops and efficient actuation–core to robotics, industrial automation and emerging humanoid systems. MIPS enhances this with leading real‑time control‑loop performance for motor control, sensor fusion and decision‑making workloads. Communicate: Physical AI relies on secure, low‑power connectivity across billions of devices. With leadership in RF, connectivity, SiGe and GaN for RF, GF enables everything from short‑range device links to high‑bandwidth 5G/6G and satellite communications. Combined with MIPS’ open, software‑first architecture, GF can deliver platforms that communicate quickly, efficiently and securely within distributed intelligent systems. Shifting requirements are driving demand for analog precision, multimodal integration, ultra-low power, optimized compute, low latency, secure connectivity, integrated memory and advanced sensing circuitry. Taken together, the depth of our technology and the breadth of our portfolio positions GlobalFoundries well to support the next phase of AI as it moves into the physical world. Delivering the technologies that power Physical AI As AI data center investments continue to scale, they are setting the stage for the next wave of innovation at the edge. This shift is creating a rapidly expanding opportunity for Physical AI—expected to reach at least $18 billion by 2030—as intelligent capabilities move into devices and systems across transportation, industrial automation, consumer electronics and medical technologies. Customers are now looking to bring more sensing, decision‑making, actuation and connectivity directly onto the device and the technology requirements are evolving accordingly. GF is building the technologies that make this transition possible. With our expanded portfolio, including ultra‑low‑power CMOS, precision analog, RF and connectivity solutions, advanced packaging and the addition of MIPS’ real‑time, multi‑threaded RISC‑V processors, we are giving customers the platforms they need to design differentiated Physical AI solutions. Our global manufacturing footprint, deep co‑design partnerships and growing pipeline of AI‑driven design wins allow us to support customers from architecture through production, helping them accelerate development and bring next‑generation intelligent devices to market with confidence. Innovating for tomorrow Today, Physical AI powers our autonomous vehicles, advanced driver-assistance systems, home robotics, drones, smart devices, even wearables and AI-enabled medical and diagnostic equipment. Looking ahead to the future, Physical AI will evolve beyond these applications, ushering in the era of humanoid robots and far more advanced autonomous systems. In our upcoming blog in this series, Ed Kaste, our SVP of GF’s ultra low power CMOS business, will take a deeper dive into the impact of this transition to future applications of Physical AI and GF’s role in enabling these technologies. Capturing the early waves of Physical AI’s inflection point The industry has reached a turning point: AI is no longer confined to racks of GPUs; it’s moving into the devices, machines, vehicles and robots that shape everyday life. As Physical AI proliferates, the semiconductor requirements become clearer and so does GF’s role in enabling this shift. Our next blog we’ll unpack the technical underpinnings that will define the next decade of Physical AI and how GF is positioning to lead at this inflection point. Mike Hogan is the Chief Business Officer at GlobalFoundries, where he leads strategy, technology roadmaps and R&D across all product lines. With more than 35 years in the semiconductor industry, he has held senior leadership roles at Cypress Semiconductor, Broadcom/Avago, PulseCore, Sirific Wireless and Texas Instruments.
GlobalFoundries Appoints Ganesh Moorthy to Board of Directors January 15, 2026 Seasoned semiconductor industry leader brings decades of operational and strategic expertise to GF’s Board MALTA, N.Y., January 15, 2026 – GlobalFoundries (Nasdaq: GFS) (GF) today announced the appointment of Ganesh Moorthy to its board of directors. Mr. Moorthy, former president and CEO of Microchip Technology Inc., joins GF’s Board, effective immediately. Mr. Moorthy brings more than four decades of experience in the semiconductor industry, including transformative leadership at Microchip Technology, where he served as CEO, president and board member until his retirement in November 2024. He was appointed CEO and president in March 2021 and joined Microchip’s Board of Directors in January 2021. Prior to that, he held senior leadership roles at Microchip including COO and executive vice president. Earlier in his career, Mr. Moorthy spent 19 years at Intel in engineering and executive leadership positions, building deep expertise across manufacturing, product innovation and customer-driven execution. “Ganesh’s deep understanding of semiconductor technology, manufacturing at scale and corporate growth will be a tremendous asset to GF as we continue to execute our strategy and expand our leadership in essential semiconductor technologies,” said Dr. Thomas Caulfield, Executive Chairman of GlobalFoundries. “His leadership experience will help us accelerate innovation and strengthen GF’s role as a trusted partner delivering essential technologies that bring intelligence into the real world.” “GlobalFoundries is uniquely positioned to bring intelligence to everyday devices through differentiated, power-efficient semiconductors manufactured at scale,” said Ganesh Moorthy. “I’m excited to work with Tom, Tim and the Board to advance GF’s strategy, deepen customer partnerships and accelerate delivery of the technologies customers need to turn innovation into real-world impact.” Currently, Mr. Moorthy serves as Chair of the Board of Ralliant, a global precision technologies company essential for breakthrough innovation in an electrified and digital world. He also serves on the Board of Directors of Celanese, SiTime and Ayar Labs, a leader in optical interconnect solutions for large-scale AI workloads. Previously, he served for over a decade on the board of Rogers, a global leader in engineered materials. Mr. Moorthy’s appointment reinforces GF’s commitment to advance its long-term growth strategy through a resilient manufacturing footprint that delivers power-efficient, differentiated technologies to customers worldwide. More information about GF’s Board of Directors can be found here. Über GF GlobalFoundries (GF) ist ein führender Hersteller von Halbleitern, auf die sich die Welt zum Leben, Arbeiten und Vernetzen verlässt. Wir sind innovativ und arbeiten mit unseren Kunden zusammen, um energieeffizientere und leistungsfähigere Produkte für die Automobilindustrie, intelligente mobile Geräte, das Internet der Dinge, Kommunikationsinfrastrukturen und andere wachstumsstarke Märkte zu entwickeln. Mit seiner globalen Produktionsbasis, die sich über die USA, Europa und Asien erstreckt, ist GF eine vertrauenswürdige und zuverlässige Quelle für Kunden in aller Welt. Jeden Tag liefert unser talentiertes und vielfältiges Team Ergebnisse mit einem unnachgiebigen Fokus auf Sicherheit, Langlebigkeit und Nachhaltigkeit. Weitere Informationen finden Sie unter www.gf.com. GF, GlobalFoundries, die GF-Logos und andere GF-Marken sind Marken von GlobalFoundries Inc. oder ihrer Tochtergesellschaften. Alle anderen Marken sind das Eigentum ihrer jeweiligen Inhaber. Zukunftsorientierte Informationen Diese Pressemitteilung kann zukunftsgerichtete Aussagen enthalten, die mit Risiken und Ungewissheiten verbunden sind. Die Leser werden davor gewarnt, sich auf diese zukunftsgerichteten Aussagen zu verlassen. Diese zukunftsgerichteten Aussagen beziehen sich nur auf das Datum dieser Pressemitteilung. GF ist nicht verpflichtet, diese zukunftsgerichteten Aussagen zu aktualisieren, um sie an Ereignisse oder Umstände nach dem Datum dieser Pressemitteilung oder an die tatsächlichen Ergebnisse anzupassen, sofern dies nicht gesetzlich vorgeschrieben ist. Medienkontakt: Erica McGill [email protected]
GlobalFoundries to Acquire Synopsys’ Processor IP Solutions Business, Expanding Capabilities to Accelerate Physical AI Applications January 14, 2026 Acquisition will strengthen GF’s leadership in Physical AI, enhances compute capabilities, expands company’s RISC-V and AI portfolio and software tools and accelerates custom silicon development MALTA, N.Y., January 14, 2026 – GlobalFoundries (Nasdaq: GFS) (GF) today announced its execution of a definitive agreement to acquire Synopsys’ ARC Processor IP Solutions business, including its teams of engineers and designers. This strategic move will accelerate GF’s and MIPS physical AI roadmap and strengthen their capabilities in custom silicon solutions. The proposed acquisition includes the ARC-V, ARC-Classic, ARC VPX-DSP and ARC NPX NPU product lines as well as the applications-specific instruction set (ASIP) processor tools including ASIP Designer and ASIP Programmer. Upon closing, these assets and expert teams will be integrated with MIPS, a GlobalFoundries company, to deliver a comprehensive processor IP suite, especially tailored for physical AI applications. The expanded offering will enhance engagement through IP licensing and software, enabling faster time-to-market for GF’s customers. The integration of Synopsys’ ARC technologies, which includes high-performance, mid-range and ultra-low power compute and AI cores, will enable scalable, energy-efficient processing solutions. With a strong patent portfolio, a global customer network and proven engineering expertise, this acquisition will accelerate innovation and enhance capabilities to deliver solutions for wearables, robotics, AI-driven consumer applications and advanced AI silicon. “This acquisition doubles down on our commitment to advancing our leadership in Physical AI. By combining Synopsys’ ARC IP and MIPS technologies with GF’s advanced manufacturing capabilities, we are lowering the barrier for customer adoption of the essential technologies that our customers need to innovate faster for the next generation of compute and AI applications,” said Tim Breen, CEO of GlobalFoundries. “This move will strengthen our differentiated technology roadmap and position GF to deliver end-to-end solutions for our customers that will support the expansion of AI-enabled devices into the physical world.” Synopsys will retain and continue to grow its broad design IP portfolio spanning logic libraries, embedded memories, interface IP, security IP and subsystems. “This transaction enhances the focus of Synopsys’ IP business on furthering our leadership in essential interface and foundation IP while winning new, high-value opportunities that advance our position as the leading provider of engineering solutions from silicon to systems,” said Sassine Ghazi, president and CEO of Synopsys. “GF will be an excellent future steward for the processor IP solutions business, enabling customers worldwide to benefit from continued, strong competition in the development and delivery of processor IP solutions.” The acquisition of Synopsys’ ARC and ARC-V Processor IP Solutions business is subject to the satisfaction of customary closing conditions, including the receipt of required regulatory approvals, and is expected to be completed in the second half of calendar year 2026. Following the acquisition, GF will work closely with Synopsys to ensure a seamless transition for employees, customers and partners. Über GF GlobalFoundries (GF) is a leading manufacturer of essential semiconductors the world relies on to live, work and connect. We innovate and partner with customers to deliver more power-efficient, high-performance products for the automotive, smart mobile devices, internet of things, communications infrastructure and other high-growth markets. With our global manufacturing footprint spanning the U.S., Europe and Asia, GF is a trusted and reliable source for customers around the world. Every day, our talented and diverse team delivers results with an unyielding focus on security, longevity and sustainability. For more information, visit www.gf.com. About MIPS MIPS, a GlobalFoundries company, is a leading provider of RISC-V IP and software for physical AI platforms. Our innovations deliver standards-based computing platforms developed with our customers’ software-first solutions. MIPS technology enables the adoption of AI in real-time, event-driven products for high-growth markets such as aerospace, automotive, defense, embedded computing, enterprise infrastructure, and industrial robotics. As part of the GlobalFoundries family, we deliver RISC-V at foundry scale and enable Physical AI to be built on MIPS. For more information visit MIPS.com. GF, GlobalFoundries, die GF-Logos und andere GF-Marken sind Marken von GlobalFoundries Inc. oder ihrer Tochtergesellschaften. Alle anderen Marken sind das Eigentum ihrer jeweiligen Inhaber. Zukunftsorientierte Informationen This news release contains forward-looking statements regarding the combination of GF’s MIPS business with Synopsys’ Processor IP Solutions business, which involve risks and uncertainties. Such risks and uncertainties include, but are not limited to, the expected timing of the transaction, failure to satisfy the conditions to closing of the transaction, and the potential benefits of the transaction. Readers are cautioned not to place undue reliance on any of these forward-looking statements and urged to review the risks and uncertainties discussed in our 2024 Annual Report on Form 20-F, current reports on Form 6-K and other reports filed with the Securities and Exchange Commission. These forward-looking statements speak only as of the date hereof. GF undertakes no obligation to update any of these forward-looking statements to reflect events or circumstances after the date of this news release or to reflect actual outcomes, unless required by law. Media Contact: Erica McGill [email protected]
GlobalFoundries setzt sein Sponsoring der FIRST LEGO League in Vermont für die Saison 2025–2026 fort 30. Dezember 2025 GF richtet zum zweiten Mal in Folge die Landesmeisterschaft in seinem Werk in Essex Junction aus. Essex Junction, Vermont, 29. Dezember 2025 – GlobalFoundries(Nasdaq: GFS) ist stolz darauf, seine Rolle als Hauptsponsor desFIRST®LEGO® League (FLL)-Programms in Vermont für die Saison 2025–2026 erneut zu bestätigen.Diese fortgesetzte Partnerschaft spiegelt das starke Engagement von GF für das gesellschaftliche Engagement, die Förderung der MINT-Bildung in der Grundschule und weiterführenden Schule sowie die Förderung der Entwicklung zukünftiger Arbeitskräfte wider. Zum zweiten Mal in Folge wird GF am Samstag, dem 17. Januar 2026, die FLL Vermont State Championship in seinem Werk in Essex Junction ausrichten, unterstützt von engagierten GF-Freiwilligen, was die enge Verbundenheit des Unternehmens mit der lokalen Gemeinschaft unterstreicht. Diese erneute Sponsoring-Vereinbarung stärkt die langjährige Beziehung von GF zurFIRST-Organisationin Vermont, wo GF-MitarbeiterFIRST-Teamsin lokalen Gemeinden aktiv betreut und im letzten Jahr mehr als 2.500 Stunden ehrenamtlicher Arbeit geleistet haben. Durch die Fortsetzung des Engagements als FLL-Hauptsponsor bekräftigt GF sein Engagement für die Förderung eines dynamischen MINT-Ökosystems und die Inspiration der nächsten Generation von Innovatoren und Problemlösern. „Wir freuen uns, auch in der Saison 2025–2026 wieder als Hauptsponsor derFIRST LEGOLeague in Vermont aufzutreten“, so Ken McAvey, Senior Vice President und General Manager von Vermont Operations and Global Facilities bei GF. „Jahr für Jahr investieren unsere Mitarbeiter ihre Zeit und ihr Fachwissen als Mentoren und Freiwillige, um Schülern dabei zu helfen, ihre Leidenschaft für MINT zu wecken. Letztes Jahr durften wir mehr als 800 Schüler, Trainer, Eltern, Gemeindemitglieder, Freiwillige und MINT-Begeisterte zu unserer Staatsmeisterschaft begrüßen. Die Ausrichtung dieser Veranstaltung zum zweiten Mal in Folge ist ein Beweis für unser unerschütterliches Engagement. Die Unterstützungvon FIRST isteine Investition in die zukünftigen Fachkräfte der Halbleiterindustrie, und wir freuen uns, erneut Schüler dabei zu unterstützen, eine Karriere in Technologie und Innovation anzustreben, wo sie uns dabei helfen können, das Wesentliche zu gestalten.“ Die FIRST LEGOLeague (FLL) Challenge, die sich an Schüler der Klassen 4 bis 8 in ganz Vermont richtet, hat ein bedeutendes Wachstum verzeichnet. In der Saison 2024–2025 waren in Vermont landesweit 60 FLL Challenge-Teams am Start, und für die aktuelle Saison werden über 74 Teams erwartet. Dieses Wachstum wurde durch die Zusammenarbeit zwischen GF undFIRST inVermont ermöglicht.FIRSTinVTist eine gemeinnützige Organisation, die sich dafür einsetzt,FIRST-Teamsauf allen Programmebenen aufzubauen und zu fördern, indem sie nachhaltige Beziehungen zwischen den Teams und Partnern in der Gemeinde aufbaut. „Das erneute Sponsoring durch GF eröffnet noch mehr Schülern aus Vermont die Möglichkeit, amFIRST LEGOLeague-Programm teilzunehmen und Fähigkeiten zu entwickeln, die ihnen ein Leben lang zugutekommen werden“, so Joseph Chase, Partner für die Durchführung des FLL-Programms in Vermont. „Gemeinsam erweitern wir den Zugang zu MINT-Bildung in unserem Bundesstaat und vertiefen deren Wirkung. Wir freuen uns, die Meisterschaft zum zweiten Mal in Folge bei GF auszurichten, und können es kaum erwarten, die unglaublichen Leistungen dieser Schüler zu sehen. Bei dieser Partnerschaft geht es darum, eine starke Grundlage für die Führungskräfte und Innovatoren von morgen zu schaffen.“ Das GF-Werk in Essex Junction in der Nähe von Burlington ist ein Eckpfeiler der amerikanischen Halbleiterfertigung und beschäftigt rund 1.800 Mitarbeiter. Die hier hergestellten GF-Chips kommen in einer Vielzahl von Anwendungen zum Einsatz, von Smartphones und Automobilen bis hin zu Kommunikationsinfrastrukturen weltweit. Über dieFIRST LEGOLeague FIRST®LEGO® League begleitet Jugendliche schon in jungen Jahren beim Lernen und Entdecken im Bereich MINT. Von „Entdecken“ über „Erforschen“ bis hin zu „Herausfordern“ lernen die Schüler die Grundlagen von MINT kennen und wenden ihre Fähigkeiten in spannenden Wettbewerben oder Ausstellungen an, während sie gleichzeitig Lerngewohnheiten, Selbstvertrauen und Teamfähigkeit entwickeln. Über GFGlobalFoundries (GF) ist ein führender Hersteller von wichtigen Halbleitern, auf die sich die Welt beim Leben, Arbeiten und Kommunizieren verlässt. Wir entwickeln Innovationen und arbeiten mit Kunden zusammen, um energieeffizientere, leistungsstärkere Produkte für die Automobilindustrie, intelligente Mobilgeräte, das Internet der Dinge, Kommunikationsinfrastrukturen und andere wachstumsstarke Märkte zu liefern. Mit unserer globalen Produktionspräsenz in den USA, Europa und Asien ist GF ein vertrauenswürdiger und zuverlässiger Partner für Kunden auf der ganzen Welt. Jeden Tag liefert unser talentiertes globales Team Ergebnisse mit einem unerschütterlichen Fokus auf Sicherheit, Langlebigkeit und Nachhaltigkeit. Weitere Informationen finden Sie unterwww.gf.com. GlobalFoundries Inc., GF, GlobalFoundries, die GF-Logos und andere GF-Marken sind Marken von GlobalFoundries Inc. oder seinen Tochtergesellschaften. Alle anderen Marken sind das Eigentum ihrer jeweiligen Inhaber. Kontakt: Gina DeRossi GF [email protected] 518-491-5965
onsemi entwickelt gemeinsam mit GlobalFoundries GaN-Leistungsbauelemente der nächsten Generation 18. Dezember 2025 Die Zusammenarbeit erweitert das Leistungsportfolio von onsemi um leistungsstarke 650-V-Lateral-GaN-Lösungen für KI-Rechenzentren, die Automobilindustrie, die Luft- und Raumfahrt sowie andere wichtige Märkte. SCOTTSDALE, Arizona, und MALTA, New York, 18. Dezember 2025 – onsemi (Nasdaq: ON) gab heute bekannt, dass es eine Kooperationsvereinbarung mit GlobalFoundries (Nasdaq: GFS) (GF) unterzeichnet hat, um fortschrittliche Galliumnitrid (GaN)-Leistungsprodukte unter Verwendung des hochmodernen 200-mm-eMode-GaN-auf-Silizium-Prozesses von GF zu entwickeln und herzustellen, beginnend mit 650 V. Diese Zusammenarbeit beschleunigt die Roadmap von onsemi für leistungsstarke GaN-Bauelemente und integrierte Leistungsstufen und erweitert das Portfolio um Hochspannungsprodukte, um den wachsenden Leistungsanforderungen von KI-Rechenzentren, Elektrofahrzeugen, erneuerbaren Energien, industriellen Systemen sowie Luft- und Raumfahrt, Verteidigung und Sicherheit gerecht zu werden.„Diese Zusammenarbeit vereint das System- und Produkt-Know-how von onsemi mit dem fortschrittlichen GaN-Prozess von GlobalFoundries, um neue 650-V-Leistungsbauelemente für wachstumsstarke Märkte anzubieten. In Kombination mit unseren Siliziumtreibern und -controllern werden diese GaN-Produkte es Kunden ermöglichen, innovativere und kleinere, effizientere Stromversorgungssysteme für KI-Rechenzentren, Elektrofahrzeuge, Weltraumanwendungen und andere Bereiche zu entwickeln. Wir sind auf dem besten Weg, unseren Kunden in der ersten Hälfte des Jahres 2026 Muster zur Verfügung zu stellen und schnell zur Serienproduktion überzugehen.“ – Dinesh Ramanathan, Senior Vice President of Corporate Strategy, onsemi.„Durch die Kombination unserer 200-mm-GaN-on-Si-Plattform und unserer Fertigung in den USA mit dem umfassenden System- und Produkt-Know-how von onsemi beschleunigen wir die Entwicklung hocheffizienter Lösungen und bauen widerstandsfähige Lieferketten für Rechenzentren, die Automobilindustrie, die Industrie, die Luft- und Raumfahrt, die Verteidigung und andere wichtige Märkte auf. Mit onsemi als wichtigem Partner werden wir weiterhin GaN-Halbleiter vorantreiben, die den sich wandelnden Anforderungen von KI, Elektrifizierung und nachhaltiger Energie gerecht werden.“ – Mike Hogan, Chief Business Officer, GlobalFoundries.onsemi wird seine branchenführenden Siliziumtreiber, Controller und thermisch optimierten Gehäuse mit der 650-V-GaN-Technologieplattform von GF kombinieren, um optimierte GaN-Bauteile mit höherer Leistungsdichte und Effizienz anzubieten. Dazu gehören Stromversorgungen und DC-DC-Wandler für KI-Rechenzentren, Bordladegeräte und DC-DC-Wandler für Elektrofahrzeuge, Solar-Mikrowechselrichter und Energiespeichersysteme, Motorantriebe und DC-DC-Wandler für Industrie-, Luftfahrt-, Verteidigungs- und Sicherheitsanwendungen.Diese Bemühungen erweitern das führende Leistungshalbleiter-Portfolio von onsemi, das nun das gesamte Spektrum der GaN-Technologien umfasst – von niedrigen, mittleren und hohen Spannungen bei lateralen GaN bis hin zu ultrahohen Spannungen bei vertikalen GaN. Damit können Systementwickler Leistungsarchitekturen der nächsten Generation entwickeln, die mehr Leistung bei geringerem Platzbedarf bieten. Zu den Vorteilen von GaN gehören: Betrieb mit höherer Frequenz– Durch den Betrieb mit höheren Schaltfrequenzen ermöglicht GaN den Entwicklern, die Anzahl der Komponenten, die Systemgröße und die Kosten zu reduzieren und gleichzeitig die Effizienz und die thermische Leistung zu verbessern. Bidirektionale Fähigkeit– Bidirektionale GaN-Fähigkeiten ermöglichen völlig neue Topologien, die bis zu vier herkömmliche unidirektionale Transistoren ersetzen können, wodurch Kosten gesenkt und Designs vereinfacht werden. Integrierte Funktionalität– Die Kombination von GaN-FETs mit Treibern, Controllern, Isolierung und Schutz in einem einzigen Gehäuse ermöglicht schnellere Designzyklen und geringere elektromagnetische Störungen. Die thermisch verbesserten Gehäuse und optimierten Gate-Treiber steigern die Leistung und Zuverlässigkeit selbst bei hohen Schaltgeschwindigkeiten. Zeitplan und Verfügbarkeitonsemi wird in der ersten Hälfte des Jahres 2026 mit der Bemusterung beginnen.Über onsemionsemi(Nasdaq: ON) treibt disruptive Innovationen voran, um eine bessere Zukunft zu gestalten. Mit Schwerpunkt auf den Endmärkten Automobil und Industrie beschleunigt das Unternehmen den Wandel in Megatrends wie Fahrzeugelektrifizierung und -sicherheit, nachhaltige Energienetze, industrielle Automatisierung sowie 5G- und Cloud-Infrastruktur. onsemibietet ein hoch differenziertes und innovatives Produktportfolio mit intelligenten Energie- und Sensortechnologien, die die komplexesten Herausforderungen der Welt lösen und den Weg zu einer sichereren, saubereren und intelligenteren Welt ebnen.onsemiist im Nasdaq-100Index®und im S&P500®Index vertreten. Weitere Informationen zuonsemifinden Sie unterwww.onsemi.com. onsemi und die onsemi sind Marken von Semiconductor Components Industries, LLC. Alle anderen in diesem Dokument genannten Marken- und Produktnamen sind eingetragene Marken oder Marken ihrer jeweiligen Eigentümer. Obwohl das Unternehmen in dieser Pressemitteilung auf seine Website verweist, sind die Informationen auf der Website nicht Bestandteil . Über GFGlobalFoundries (GF) istein führender Hersteller von wichtigen Halbleitern, auf die sich die Welt beim Leben, Arbeiten und Kommunizieren verlässt. Wir entwickeln Innovationen und arbeiten mit Kunden zusammen, um energieeffizientere, leistungsstärkere Produkte für die Automobilindustrie, intelligente Mobilgeräte, das Internet der Dinge, Kommunikationsinfrastrukturen und andere wachstumsstarke Märkte zu liefern. Mit unseren weltweiten Produktionsstätten in den USA, Europa und Asien ist GF ein vertrauenswürdiger und zuverlässiger Partner für Kunden auf der ganzen Welt. Jeden Tag liefert unser talentiertes, globales Team Ergebnisse mit einem unerschütterlichen Fokus auf Sicherheit, Langlebigkeit und Nachhaltigkeit. Weitere Informationen finden Sie unterwww.gf.com. Kontakt: onsemiMichael Mullaney[email protected] GlobalFoundriesStephanie Gonzalez[email protected]
GlobalFoundries beschleunigt und stärkt Europas Halbleiter-Ökosystem durch strategische Partnerschaft mit Cloudberry 18. Dezember 2025 Zusammenarbeit zur Vertiefung des europäischen Innovationsökosystems und zur Bereitstellung eines frühzeitigen Zugangs zu fortschrittlichen Fertigungsplattformen für Start-ups, um Innovationen zu beschleunigen DRESDEN, Germany — December 18, 2025 — GlobalFoundries (NASDAQ: GFS) (GF) today announced a partnership with Finnish venture capital firm Cloudberry to accelerate and strengthen Europe’s semiconductor and photonics startup ecosystem. The collaboration includes GF’s participation as a limited partner in Cloudberry’s new fund and its commitment to provide technology expertise and resources that help emerging companies accelerate innovation from concept to industrial scale.Through its partnership with Cloudberry, GF gains direct access to Europe’s emerging semiconductor and photonics startups—from university spin-offs to seed and Series A ventures. This early engagement helps deepen the ecosystem by allowing GF to synchronize its technology roadmap with innovative applications and collaborate within promising markets such as autonomous vehicles, Physical AI, Industry 4.0 and next generation communications. As a strategic investor in Cloudberry’s newly launched dedicated venture fund, GF strengthens its support for the next generation of European semiconductor leaders. This collaboration provides GF with early insight into breakthrough innovations, aligning its expertise with future market needs and actively bridging the gap between academic research, early prototypes and volume production. As one of the world’s leading manufacturers of essential semiconductors, GF offers differentiated platforms such as FDX, RF technologies, Silicon Photonics and power devices optimized for automotive, industrial, IoT AI and consumer applications. Startups supported through Cloudberry will gain structured engagement with GF’s technology teams and design resources—reducing time-to-market while accelerating growth. “GlobalFoundries’ market-leading, highly specialized chip technologies are built on innovation and collaboration,” said Manfred Horstmann, General Manager and Senior Vice President at GlobalFoundries Dresden. “By partnering with Cloudberry, we are accelerating and deepening Europe’s semiconductor ecosystem, working closely with early-stage startups to gain insight into emerging innovations and deliver tailored solutions that help them scale quickly, giving them a competitive advantage when they enter the market.” “We see this partnership as the beginning of a long-term initiative to further strengthen the European semiconductor ecosystem,” said Veera Pietikäinen, founding partner at Cloudberry. “Europe has world-class talent and deep technological expertise in semiconductors and photonics, and companies like GF have already made significant investments to develop and scale that expertise. Building on this foundation, we are creating a specialized platform to help these companies grow even further, thereby reinforcing Europe’s technological sovereignty.” About GF GlobalFoundries (GF) is a leading manufacturer of essential semiconductors the world relies on to live, work and connect. We innovate and partner with customers to deliver more power-efficient, high-performance products for the automotive, smart mobile devices, internet of things, communications infrastructure and other high-growth markets. With our global manufacturing footprint spanning the U.S., Europe and Asia, GF is a trusted and reliable source for customers around the world. Every day, our talented global team delivers results with an unwavering focus on security, longevity and sustainability. For more information, visit www.gf.com. ©GlobalFoundries Inc., GF, GlobalFoundries, the GF logos and other GF marks are trademarks of GlobalFoundries Inc. Or its subsidiaries. All other trademarks are the property of their respective owners. About Cloudberry Cloudberry is Europe’s first dedicated venture capital firm investing in semiconductors, photonics and advanced materials. Backed by strategic investors, including GlobalFoundries, a leading manufacturer of essential semiconductors, and Radiant, a global leader in photonics, Cloudberry offers specialised support to help Europe’s best semiconductor startups scale. More information at cloudberry.vc. Forward-looking information This news release may contain forward-looking statements, which involve risks and uncertainties. Readers are cautioned not to place undue reliance on any of these forward-looking statements. These forward-looking statements speak only as of the date hereof. GF undertakes no obligation to update any of these forward-looking statements to reflect events or circumstances after the date of this news release or to reflect actual outcomes, unless required by law. Contact: GF: Marian Möbius EMEA-Unternehmenskommunikation [email protected] 0172-5885944 Mora: René Kromhof Gründungspartner [email protected]
