June 1, 2026 By Afusat Dirisu, Deputy Director, Space & Rad Hard, Aerospace & Defense When Artemis II lifted astronauts beyond Low Earth Orbit for the first time in more than 50 years, it marked another milestone in human exploration. But missions like these are only possible because of electronics that perform flawlessly in one of the most unforgiving environments imaginable. Navigation, communication and life-support systems for modern spaceflight all depend on semiconductors. The semiconductor industry is also reaching a new frontier. As ambitions expand beyond lunar missions toward deep space exploration and satellite constellations, companies begin exploring chip manufacturing in space, leveraging microgravity and natural vacuum conditions to improve production. But while “made-in-space” semiconductor manufacturing is still in its early days, the immediate challenge is ensuring chips can survive the brutal realities of space. The reality of space: The stress test for silicon Electronics are subjected to extreme and often unpredictable conditions from the moment a rocket leaves the launch pad; temperatures can swing dramatically, radiation levels are orders of magnitude higher than on Earth and the vacuum environment introduces unique material stresses. Unlike terrestrial systems, there is no opportunity for repair or replacement once the hardware is deployed. Conventional commercial chips, like those designed for your smartphone, smart refrigerator or electric vehicle, are not built for this level of exposure. Radiation alone can cause transient faults, degrade materials over time or even permanently damage circuits. Over long mission lifetimes, these effects compound, ultimately threatening system reliability and mission success. This is why space demands a fundamentally different approach to semiconductor design and manufacturing, rooted in resilience, predictability and trust. GlobalFoundries addresses the design challenge head-on through our portfolio of technologies that are well suited for radiation-hardened-by-design (RHBD) techniques. GF is also exploring and developing technological nodes that are radiation-hardened-by-process (RHBP) through optimization of doping implants or engineering of the substrate materials to further enhance radiation performance metrics such as total ionizing dose (TID) and single event effects (SEE). These efforts enable electronics that can operate reliably under sustained radiation exposure. This foundation is what allows space systems to perform without failure—long after launch. Designing for radiation to ensure resilience at the core RHBD techniques are essential to ensuring chips can withstand the harshness of the space environment. Rather than relying solely on shielding, RHBD incorporates resilience into the chip architecture. Through design techniques such as redundancy, spatial layout awareness and robust fault-mitigation strategies, RHBD enables semiconductors to continue operating even when exposed to radiation-induced disruptions. These approaches allow designers to anticipate and mitigate errors before they propagate, ensuring consistent performance in mission-critical systems. From Low Earth Orbits and geosynchronous orbits to deep space probes, different space missions require tailored approaches to balance performance, power and durability, but RHBD remains central to ensuring that chips will not fail or can recover from failures through the mission lifetime. Why security is a non-negotiable requirement In aerospace and defense applications, security becomes as critical as performance. Semiconductors used in space often power sensitive systems, including communications infrastructure and national security assets. Ensuring that these chips are manufactured in trusted, secure environments is essential to preventing tampering, safeguarding intellectual property and maintaining mission integrity. As an accredited Trusted Foundry and Common Criteria-certified supplier, GlobalFoundries brings rigorous processes, oversight and compliance to every stage of manufacturing. This ensures that chips are delivered securely and uncompromised, a critical requirement for customers operating in high-stakes environments and critical end applications. Driving differentiated manufacturing on a global scale Meeting the demands of space-grade electronics also requires flexibility across technologies and geographies. GF’s global manufacturing footprint enables a diverse portfolio of semiconductor solutions optimized for aerospace, defense and other critical infrastructure applications. Across its global fabs, GF supports mission-specific wafer technologies spanning advanced nodes for high-performance processing, RF integration and power-efficient platforms. This empowers customers to align the right technology to the right application without compromising quality or scalability. In the U.S., GF’s Malta, New York facility is expanding production with advanced platforms like FDX® FD-SOI, 45SOI and FinFET, supporting applications from secure communications to edge computing. Also in development at the Malta site is FinFET RHBP technology, which incorporates Vorago HARDSIL® to further enhance TID and SEE performance of our 12 nm FinFET node. Our Burlington, Vermont facility anchors GF’s power and RF leadership, with Gallium Nitride (GaN) and high-voltage GaN-on-silicon technologies powering next-generation radar, satellite and autonomous systems. GF’s fabs in Singapore and Dresden are internationally recognized for secure, high-integrity manufacturing under Common Criteria certification. Together, this global manufacturing strength ensures customers can confidently move across the full product lifecycle, backed by the performance, reliability and trust required for mission-critical applications in space and beyond. Accelerating innovation through ecosystem partnerships No single company solves space challenges alone. That’s why GlobalFoundries cultivates an ecosystem of partners driving radiation-hardened solutions on GF platforms. GF’s 12LP FinFET radiation-hardened-by-process (RHBP) platform is being developed in close partnership with Northrop Grumman Space Systems and Vorago Technologies to expand GF’s portfolio for customers requiring radiation-hardened solutions. The platform incorporates process enhancements that preserve the baseline electrical performance of designs, allowing designers to leverage existing IP while achieving significantly improved radiation performance. Recently, BAE Systems introduced its Ascent spacecraft, designed to support dynamic space operations through advanced maneuverability capabilities, including refueling and high-thrust propulsion, while carrying multiple rideshare payloads. At the heart of this innovation is BAE Systems’ collaboration with GF. BAE’s 12S0 and RH12™ Storefronts, built on GF’s 45SOI and FinFET platforms, respectively, provide a turnkey pathway for developing custom radiation-hardened-by-design (RHBD) solutions. This approach combines the performance and efficiency of advanced commercial technology with the resilience required for space applications. The result is a powerful combination of high-performance processing, secure connectivity, low power consumption and robust reliability within a compact, customizable design. These ecosystem partnerships are accelerating the path from concept to orbit, enabling more agile development, reducing program risk and ensuring that next-generation space systems are ready to perform in the most demanding environments. Bridging today’s needs with tomorrow’s possibilities The vision of manufacturing semiconductors in space may eventually reshape the industry, opening new frontiers for performance and materials. But as that future is still emerging, missions like Artemis II demonstrate that success today depends on something far more immediate: silicon that can endure the harsh realities of space. The differentiator right now is not where chips are made, but how well they are built to survive. Trusted, secure and radiation-hardened semiconductor solutions — like those manufactured with GF technologies — remain the foundation of mission readiness, ensuring that every system operates without failure when it matters most. By combining advanced manufacturing, a secure global supply chain and deep ecosystem collaboration, GF is enabling the next generation of space innovation. As exploration accelerates beyond Earth’s orbit, the path forward will be defined by the resilience of the technologies that make those journeys possible. Afusat Dirisu has more than 25 years of experience across industry, government and academia. Her career spans digital electronics and quantum cascade laser design, as well as technology consulting, portfolio management, STEM education program leadership, and technical sales and business development. She holds a Ph.D. in Electrical Engineering from Princeton University, an M.S. in Electrical Engineering from Stony Brook University, and a B.S. in Computer Engineering from Polytechnic University (now the NYU Tandon School of Engineering).
