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Feature-rich CMOS

GF’s feature-rich CMOS platforms, combined with foundational and complex IP and design enablement, offer mixed-technology solutions on volume production-proven processes. As a result, they are well-suited for a wide variety of applications. Technology features include Bipolar-CMOS-DMOS (BCD) for power management, high-voltage triple-gate oxide for display drivers and embedded non-volatile memory for micro-controllers.

  • Over 3.5 million 180nm BCDLite® wafers have shipped since 2010 in mobile/charger markets and the industry’s first 55nm BCD process.

  • Industry’s first pure 130nm BCD technology with DTI support in automotive Grade 0.

  • Embedded magnetoresistive RAM (eMRAM), embedded resistive RAM (eRRAM) and embedded Flash (eFlash) to address the requirements of broad market segments.

  • Display driver technology platforms (55DDI, 40DDI and 28SLP-HV) in mass production, with over 150K total wafers shipped for DDIC since 2015.