FDX™ Network

• Ultra-low-power PMU IP in 22FDX®, 10+ PMU IPs provides more selection
• IPs in other GF processes are available, including proven eNVM IP

• Lowest power Gigasample-class data converter IP available in advanced GlobalFoundries technology
• Ideal for any high sample rate, low power applications
• Radiation-tolerant and radiation-hardened versions available

• Providers of advanced packaging, assembly and test development services
• 22FDX® platform support and baseline package qualifications. Package types anticipated to be qualified are:
  • Flip chip – Chip Scale Package (FcCSP)
  • Wafer level – Chip Scale Package, Fan Out- (WlCSP-FO)
  • Wire Bond

• Analog Value Ltd. offers a family of dual ADC IPs in 22FDX® process with resolution ranging from 12b to 16b and sample rate from 5Msps to 50Msps
• The ADCs have very small area and power consumption

• Andes provides power-efficient, small-footprint 32-bit and 64-bit soft CPU IP cores implemented on GF’s 22nm FD-SOI (22FDX®) technology, especially well-suited for the IoT, edge computing and deep learning SoC design
• Andes provides a comprehensive ecosystem, including the most mature support for RISC-V processor cores

• ANSYS multiphysics simulation enables chip-package-system (CPS) success in 7nm FinFET, RFIC and 22FDX in AI, 5G, automotive and HPC applications
• Solve physically-coupled design challenges of power, thermal, variability, timing, electromagnetics and reliability across CPS

• ArterisIP interconnect IP accelerates timing closure for FDX-based designs, in applications from automotive ADAS and machine learning to small IoT processors
• ArterisIP FDX-based offerings include the Ncore Cache Coherent Interconnect IP with Ncore Resilience Package, FlexNoC Interconnect IP with FlexNoC Resilience Package and PIANO Timing Closure Package

• Providers of advanced packaging, assembly and test development services
• 22FDX® platform support and baseline package qualifications. Package types anticipated to be qualified are:
  • Flip chip – Chip Scale Package (FcCSP)
  • Wafer level – Chip Scale Package, Fan In – (WlCSP-FI)
  • Wafer level – Chip Scale Package, Fan Out – (WlCSP-FO)

• Highly integrated IoT systems-on-chip comprising front ends, radios, mixed-signal, power management, PHY and modem
• Turnkey best-in-class full-chip RFIC and modem design services for clients’ system solutions

• Founded in 2010, Attopsemi Technology is dedicated to developing proprietary I-fuse™ OTP IP to all CMOS process technologies from 0.7um to 7nm and beyond.
• I-fuse™ OTP provides small size, high reliability, low program voltage, low power and wide temperature range to enable harsh applications such as automotive, 3D IC, and IoT applications.

• Body Bias floor planning via Genus^™ design exploration
• FDX-tailored support for Voltus^™ and Tempus^™ solutions

Companies in all sectors need to accelerate their digital transformation: global leaders must rethink their innovation cycle while speed has become a survival factor to stay ahead of the competition. Industry players and innovators have to embrace connectivity, software and semiconductors to shift towards intelligent industry and ensure a sustainable value chain.

As the world leader in Engineering and R&D services, we help our clients accelerate their journey towards intelligent industry. We bring them global expertise and capabilities, cutting-edge technologies in digital and software, agile engineering platforms, and an industrialized delivery model.

With more than 55,000 engineers and scientists across the globe, we unleash the potential of R&D and innovation to help companies engineer smart products, optimized operations, new customer experiences, and new sources of value.

We help the world’s largest innovators engineer the products and services of tomorrow by leveraging our experts, labs, tools, and frameworks across three main expertise domains:

Products and systems engineering

• Mechanical and physical engineering
• Electrical, electronics and semiconductors
• Systems engineering and product design.

Digital and software

• Software engineering
• Connectivity and network engineering
• Data science, analytics, and artificial intelligence.

Industrial operations

• Manufacturing and process engineering
• Operations management
• Product support and service

For more information please visit: www.capgemini.com

• Leading provider of low-power certified IP solution for Wireless Connectivity standards (WiFi, Bluetooth, Thread, NB-IoT, GNSS etc.) for consumer and IoT applications
• Offers efficient AI & Deep Learning Processor IPs for Imaging and Computer Vision Edge IoT & Automotive Applications

• We offer ultra-low-power IP for next generations of hearables and wearables
• We are using FDX22nm due the highly optimized process node for these applications (SOI, BB, etc…)

• World-class radio/antenna advanced test and characterization facility, electromagnetic simulation and modeling from MHz to THz
• Intelligent mmWave phased array/MIMO integrated circuit, module, antenna, system-in-package, IP and R&D

• Offers a complete portfolio of configurable RISC-V based processor IP cores
• Provides a comprehensive processor development platform with full software toolchain support

• CoreHW is your one-stop custom ASIC solution partner
• CoreHW competences cover RF systems; RFIC; analog, mixed signal and digital; RF front-end and antennas

• CSEM is a supplier of design services and silicon IPs, recognized as a leader for very low-power ICs & systems, and a rich history & IP catalog in ULP digital, RFICs and embedded machine learning
• CSEM’s IcyTRX, best-in-class Bluetooth Low Energy silicon RF IP, is integrated in millions of chips worldwide

• WaveIntegrity™ is a comprehensive software suite that integrates seamlessly into any client flow to tackle SLN during digital, analog or RF IP authoring and full system integration, from RTL to tape out
• SiPEX™ accurately models interactions between devices, back-end-of-line, and silicon-on-insulator (SOI) substrates enabling RF front end module designers to fully simulate layout and design changes with accuracy, speed and seamless design flow interoperability

Dolphin Design is a leading provider of semiconductor IP solutions, specialized in ASIC and IP design targeting markets such as Defense, Automotive, Industrial, Personal Electronics, and IoT. Dolphin Design’s cutting-edge technology IPs in AI computing, Power Management, High-quality Audio, Power Metering, and Design Safety/Robustness enable their thousands customers and partners to accelerate design cycles, foster faster time-to-market and build products/solutions that address the challenges of any industries, supporting a more sustainable world.

• Provides reliable OTP IP, NeoFuse, for sophisticated SoC designs on 22FDX® process technology targeting mobile, IoT, and RF connectivity applications
• Offers comprehensive, cost-effective, and customizable logic NVM solutions

• Empyrean’s high speed SarADC IP in 22FDX® provides high performance with ultra low power
• Empyrean’s worldwide support team provides timely, strong support

• Design services for Automotive, CCS, and RF
• Value-add services include firmware development and pre/post silicon validation

• EXTOLL provides leading-edge semiconductor IP for the interconnect market.
• High-performance, low latency SERDES PHY, which provides interconnect solution from 2.5 to 32 Gpbs, and high-speed, low-jitter LC-PLL are both silicon proven in several process nodes.

• A leading applied research and development center for ASIC, system-on-chip (SoC), and IP
• Offers dynamic biasing IPs for advanced SoC designs in 22FDX® technology

• A total RF, mmWave, digital and mixed-signal test solution provider, from test fixture design, test program development on ATE/ Bench and RF HTOL reliability test to production
• Die processing service: Back grinding, laminate, laser mark, laser grooving, dicing, AOI, singulated wafer probing and T&R with six-side visual inspection

• OSAT provider to apply TSVs for CIS package in mass production
• OSAT provider with CIS product turn-key services from chip package to module

• Ensigma is a leader in delivering wireless connectivity and broadcast IP solutions
• Provides a single-source solution for low-power connectivity including Wi-Fi, BLE and 802.15.4

• IN2FAB Technology specializes in migrating schematic and layout data of IP in other processes to 22FDX® technology
• Circuits can be translated from other GLOBALFOUNDRIES processes or from third party foundries in a fraction of the time taken for redesign

• Silicon-to-systems range of engineering services
• Software services ranging from various firmware, embedded and applications-specific offerings

• Characterization, simulations and modeling services for substrates, active and passive devices for analog and RF applications and MEMS, with a special focus on the FEM. Our services cover on-wafer and packaged components testing
• Incize’s capabilities include small- and large-signal, wideband, nonlinear and noise behaviors, as well as harsh environment and radiation hardness applications

• Innosilicon provides silicon-validated complex interface IPs in 22FDX®, 14LPP, 28SLP and other nodes with high performance, fully customizable solutions
• Leading one-stop-shop IP and turnkey solutions

• ID-Xplore™: a Fast Design and Migration tool for analog IPs
• ID-Xplore™ provides full support for static and dynamic body biasing in FD-SOI technologies

• Intrinsix is a Semiconductor Design Solutions company with over 30 years’ experience working with GlobalFoundries process offerings across many technologies including 22FDX®, 12LP/LPP and 8HP process nodes.
• Intrinsix has expertise in Digital, Analog, Mixed-Signal, and RF applications for Commercial and Consumer applications as well as Aerospace/Defense/Government programs.

• Silicon Validated Foundation and Complex IP
• Portfolio ranging from Foundry Certified Foundation IP to a complete ASIC solution

• Industry-leading RapidIO IP in 22FDX®
• Strong local support provides professional service to clients

• Credentialed FD-SOI expertise on system design, IC design, and fast prototyping
• IoT, RF, and ADAS SoC realization focus

• RFwave-tailored circuit simulators with tight integration of 3D EM simulation technologies enabling co-simulation of chip level RF circuit blocks, multi-chip and multi-technology modules
• An interoperable IC design platform

• Provides embedded FPGA (eFPGA) IP in 22FDX® System-on-Chip (SoC) designs targeting a variety of applications, including automotive ADAS, vision processors and ISP
• eFPGA IP is highly flexible — the number of logic blocks as well as the type and number of arithmetic and memory blocks are fully customizable

• Mixel is a leading provider of mixed-signal IPs and offers a wide portfolio of high-performance mixed-signal connectivity IP solutions.
• Mixel’s mixed-signal portfolio includes PHYs and SerDes, such as MIPI D-PHY^SM, MIPI M-PHY®, MIPI C-PHY^SM, LVDS, and many dual mode PHY supporting multiple standards. Available in GlobalFoundries 22FDX® technology platform.

• Mobile Semiconductor offers leading edge SRAM, ROM and Register File compilers optimized for applications requiring ultra-low power, low leakage, or ultra-high performance
• Mobile Semiconductor’s 22nm FD-SOI (22FDX®) low leakage compilers provide retention currents in the nanoamp range with configurable clock rate from 50 MHz to 500 MHz to trade off leakage versus performance

• High-quality VbyOne IP in 22FDX®, more high-speed IPs, display IPs and analog IPs are portable to 22FDX®
• Strong support system and flexibility on IP customization

• All-digital PLL IP and complementary design solutions for 22FDX®
• Custom IC design and physical implementation services for GF FD-SOI process technologies

• BSIMProPlus™, ME-Pro™: industry’s leading modeling solution, SPICE model extraction, customization & QA, process platform evaluation & benchmark, for Bulk, FD-SOI, FinFET technologies
• NanoSpice™, NanoSpice Giga™: new SPICE and FastSPICE simulators, fully leverage parallel computing power to achieve accurate, fast and economic circuit simulation & verifications for big FD-SOI & FinFET designs

• Mass production proven ultra-low power embedded FPGA
• Complete SW support for FPGA design and SoC integration in 22FDX®

• GF channel partner providing IP and design services for 22FDX® process technology
• “makeChip” design service platform provides an IT infrastructure with EDA tools and technology data setup

• Cryptofirewall cores which complement security implementations
• DPA counter measure solution offerings to enhance security measures

• Offers low-power 64-bit RISC-V CPU IP cores available on 22FDX® process technology
• Industry leader in low-power, asynchronous design focused on embedded computer vision and artificial intelligence

• Software solutions and processes for IoT, automotive and industrial and emerging device technologies
• Offer turnkey solutions including hardware and software for complete SoC production

Siemens is dedicated to helping companies engineer a smarter future faster. Siemens is committed to delivering the world’s most comprehensive portfolio of embedded software solutions as well as electronic design automation (EDA) software, hardware, and services. What’s more, Siemens is breaking down the barriers between electrical, mechanical and software design disciplines, between design and manufacturing, bridging virtual and physical design and manufacturing, enabling companies to more rapidly advance in their digital transformation and evolve from systems to market-leading ecosystems companies with the Siemens Xcelerator portfolio.

• Provides RISC-V CPU IP including SiFive’s E31 and E51 RISC-V cores available on GF’s 22FDX® process technology
• Founded by the inventors of RISC-V and the first fabless provider of customized semiconductors based on the free and open instruction set architecture

• Silicon Creations provides world-class PLLs, low power, high-performance SerDes and high-speed differential I/Os with IP in production from 10nm to 180nm and proven in 7nm
• Silicon Creations’ GLOBALFOUNDRIES 22nm FDX General purpose Fractional-N PLL is wide range, being able to generate any frequency between 25MHz and 5GHz with a precision of better than 0.01ppm

• SmartSpice™ and Utmost IV™ – Simulation, optimization and characterization of spice models for analog FDX circuits
• iPDK’s for FDX technology for Silvaco’s custom design flow

• Sofics (Solutions for ICs), a foundry independent IP company, offers solutions that lower cost, increase revenue and profit, reduce operational risk and create value for (AS)IC customers
• Solutions enable normal operation high performance (despite and with ESD protection), higher ESD robustness where needed and in an economic fashion and first-time-right patented designs, available off-the-shelf at reduced silicon, development and IP costs

• Best-in-class low power “PowerMiser” and ultra low voltage “EverOn” SRAM offerings available on GF’s 22nm FD-SOI (22FDX®) process technology
• sureCore’s industry-leading, low power SRAM technology meets both challenging power budgets and manufacturability constraints posed by today’s visionary IoT, wearable and medical products

Synopsys is a leading provider of high-quality, silicon-proven IP solutions for SoC designs. The broad DesignWare® IP portfolio includes logic libraries, embedded memories, PVT sensors, embedded test, analog IP, wired and wireless interface IP, security IP, embedded processors and subsystems. To accelerate prototyping, software development and integration of IP into SoCs, Synopsys’ IP Accelerated initiative offers IP prototyping kits, IP software development kits and IP subsystems. Synopsys’ extensive investment in IP quality, comprehensive technical support and robust IP development methodology enable designers to reduce integration risk and accelerate time-to-market. For more information on DesignWare IP, visit https://www.synopsys.com/designware

• DDR Interface IP, based on 14 issued patents, provides the right power, performance, area and reliability for FDX™-based SoCs in portable applications
• Wide range of “ideas2silicon” services that span design specification, RTL, logic design/verification, physical implementation, and manufacturing operations.

• One-stop-shop turnkey solution
• China-based, with complete FDX-tailored ASIC platform capability and services

• IP customization services on silicon-proven microwave front-ends and synthesizers up to mmWave frequencies
• World class transceiver designs for backhaul, 5G, 802.11.* and RADAR applications

Xenergic provides ultra-low power SRAM for wide application categories ranging from ultra-low power to high-speed. Xenergic’s MemoryTailor^TM provides the best memory configuration for each application’s specific needs.

• Analog/RF IC EDA suite enabling fast passive modeling and simulation at advanced technology nodes
• Integrated passive devices (IPD) solution enabling system miniaturization for RF front-end module designs

• High speed high performance multi-protocols Serdes PHY solution (up to 16G) for 22FDX®
• High performance analog IPs (ADC/DAC/PLL/PMU/AFE) provider